M7AFS600-1FGG484I vs M7AFS600-2FG484I Comparação
Comparação detalhada lado a lado de M7AFS600-1FGG484I por Microchip Technology e M7AFS600-2FG484I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
M7AFS600-1FGG484I ✓ AtivoMicrochip Technology
M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
M7AFS600-2FG484I ✓ AtivoComparação de especificações
| Parâmetro | M7AFS600-1FGG484I | M7AFS600-2FG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $228,00 | $272,01 |
| Series | Fusion (M7AFS600) | — |
| System Gates | 600000 | 600000 gates |
| Number of I/Os | 172 | — |
| Total RAM Bits | 110592 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Tensão de alimentação | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Maximum Operating Frequency | 1282.05 MHz | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal flash-based CMOS |
| Speed Grade | 1 (M7, fastest family grade) | -2 |
| Temperatura de operação | -40C to +85C | 0 to 70 C |
| Encapsulamento / Caixa | 484-BGA (FBGA) | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Estilo de montagem | SMD/SMT | — |
| Packaging | Tray | Tray |
| Programmable Type | Flash-based, In-System Programmable | — |
| Status RoHS | ROHS3 Compliant | — |
| Manufacturer Lead Time | 16 weeks | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Logic Cells | [DATA_NEEDED: logic cell count] | — |
| Family | — | Fusion (Flash-Based FPGA) |
| Logic Elements (D Flip-Flops) | — | 110592 |
| User I/O | — | 172 |
| Core Supply Voltage | — | 1.5 V |
| Configuration Memory | — | Nonvolatile on-chip flash (retains program when powered off) |
| Live at Power-Up (LAPU) | — | Yes |
| Optional Processor Support | — | ARM CoreMP7 |
| Temperature Grade | — | Industrial (I suffix) |
| Encapsulamento | — | 484-ball FBGA, 1.0 mm pitch |
| Tipo de montagem | — | Surface Mount |
| Logic Family | — | CMOS |