M7AFS600-FGG484 vs M1AFS1500-1FGG484I Comparação
Comparação detalhada lado a lado de M7AFS600-FGG484 por Microchip Technology e M1AFS1500-1FGG484I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip
M7AFS600-FGG484 ✓ AtivoMicrochip Technology
M1AFS1500-1FGG484I - 1.5M Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-1FGG484I ✓ AtivoComparação de especificações
| Parâmetro | M7AFS600-FGG484 | M1AFS1500-1FGG484I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $232,90 | $0,00 |
| Family | Fusion (Mixed-Signal FPGA) | Fusion Mixed-Signal FPGA |
| System Gates | 600 K | 1500000 gates |
| Embedded Processor | ARM CoreMP7 (hard core) | ARM Cortex-M1 |
| Technology | 130 nm flash-based | — |
| Core Voltage | 1.5 V | — |
| User I/O | 172 | 223 |
| Maximum Operating Frequency | 1098.9 MHz (distributor-listed) | — |
| Configuration Memory | Flash (non-volatile, secure) | On-chip flash (single-chip, instant-on) |
| Encapsulamento | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm | 484-ball Fine-Pitch BGA (FGG484), 1.00 mm pitch |
| Ball Pitch | 1 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Status RoHS | Compliant (Pb-free balls, FGG suffix) | [DATA_NEEDED: RoHS status] |
| Temperatura de operação | [DATA_NEEDED: operating temperature range for commercial grade] | — |
| Total RAM Bits | 110592 (per DigiKey listing) | — |
| Number of Logic Blocks | [DATA_NEEDED: logic block count] | — |
| Manufacturer | — | Microchip Technology (originally Microsemi Corporation) |
| Logic Cells | — | 38400 |
| Flash Fabric Bits | — | 276480 bits |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Speed Grade | — | -1 |
| Package Dimensions | — | 23 mm x 23 mm |
| Temperature Grade | — | Industrial (-40C to +100C, I suffix) |
| Analog Blocks | — | Configurable analog (ADC-based system monitoring) |
| Clock Management | — | On-chip CCC clock conditioning and generation |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |