MC68CK16Z1CAG16 vs MC9S12D64MFUER Comparação
Comparação detalhada lado a lado de MC68CK16Z1CAG16 por NXP Semiconductors e MC9S12D64MFUER por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC68CK16Z1CAG16 - 16-Bit HC16 16MHz ROMless MCU | NXP
MC68CK16Z1CAG16 ✗ Fim de vidaNXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER NrndComparação de especificações
| Parâmetro | MC68CK16Z1CAG16 | MC9S12D64MFUER |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $12,60 | $1,05 |
| Manufacturer | NXP Semiconductors | — |
| Series | HC16 | — |
| Core Processor | CPU16 | — |
| Core Size | 16-Bit | — |
| Core Architecture | CISC | HCS12 (16-bit CISC) |
| Speed | 16 MHz | — |
| Program Memory Type | ROMless | Flash |
| Program Memory Size | External (ROMless) | 64 KB (64K x 8) |
| RAM Size | 1 KB | — |
| Number of I/O | 16+ | 59 |
| Oscillator Type | Internal | — |
| Tensão de alimentação | 3.3 V / 5 V | 2.5 V / 5 V |
| Encapsulamento | 144-LQFP (20x20 mm) | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Tipo de montagem | Surface Mount | Surface Mount (SMD/SMT) |
| Operating Temperature Grade | Industrial ('CK' suffix) | — |
| Automotive Qualified | Yes (Automotive family) | — |
| Instruction Set Compatibility | Upward code-compatible with 68HC11 family | — |
| Inter-Module Bus (IMB) | Yes | — |
| Status RoHS | Compliant | Compliant |
| Status do ciclo de vida | End of Life (EOL) | — |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| ADC | — | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Faixa de temperatura de operação | — | -40 C to +125 C |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |