MC68CK16Z1CAG16 vs MC9S12D64MFUER Vergleich
Detaillierter Direktvergleich von MC68CK16Z1CAG16 von NXP Semiconductors und MC9S12D64MFUER von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC68CK16Z1CAG16 - 16-Bit HC16 16MHz ROMless MCU | NXP
MC68CK16Z1CAG16 ✗ AbgekündigtNXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER NrndSpezifikationsvergleich
| Parameter | MC68CK16Z1CAG16 | MC9S12D64MFUER |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,60 | $1,05 |
| Manufacturer | NXP Semiconductors | — |
| Series | HC16 | — |
| Core Processor | CPU16 | — |
| Core Size | 16-Bit | — |
| Core Architecture | CISC | HCS12 (16-bit CISC) |
| Speed | 16 MHz | — |
| Program Memory Type | ROMless | Flash |
| Program Memory Size | External (ROMless) | 64 KB (64K x 8) |
| RAM Size | 1 KB | — |
| Number of I/O | 16+ | 59 |
| Oscillator Type | Internal | — |
| Versorgungsspannung | 3.3 V / 5 V | 2.5 V / 5 V |
| Gehäuse | 144-LQFP (20x20 mm) | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Operating Temperature Grade | Industrial ('CK' suffix) | — |
| Automotive Qualified | Yes (Automotive family) | — |
| Instruction Set Compatibility | Upward code-compatible with 68HC11 family | — |
| Inter-Module Bus (IMB) | Yes | — |
| RoHS-Status | Compliant | Compliant |
| Lebenszyklusstatus | End of Life (EOL) | — |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| ADC | — | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Betriebstemperaturbereich | — | -40 C to +125 C |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |