MC7448VU1250ND vs MC7447AVU1000NB Comparação
Comparação detalhada lado a lado de MC7448VU1250ND por NXP Semiconductors e MC7447AVU1000NB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC7448VU1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP Semiconductors
MC7448VU1250ND ✗ Fim de vidaNXP Semiconductors
MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP
MC7447AVU1000NB ⚠ Última compraComparação de especificações
| Parâmetro | MC7448VU1250ND | MC7447AVU1000NB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $128,00 | $99,50 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Part Family | MPC7448 (PowerPC G4) | — |
| Core | PowerPC G4 32-bit | — |
| Core Architecture | Power Architecture with AltiVec SIMD extension | PowerPC G4 (MPC7447A) |
| Core Frequency | 1.25 GHz | 1.0 GHz |
| L2 Cache | 1 MB on-die (with ECC) | 512 KB on-chip |
| External Bus | MPX / 60x (64-bit) | — |
| Core Voltage | 1.1 V | — |
| Encapsulamento | 360-FCCBGA (25x25 mm) | 360-FCCBGA (Flip-Chip Ceramic BGA), 25x25 mm |
| Temperatura de operação | -40C to +105C (industrial, APL8 RV2.2.1) | 0C to +105C (commercial) |
| Number of Cores | 1 | 1 |
| Instruction Set | 32-bit Power Architecture + AltiVec | 32-bit PowerPC RISC |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA socket or solder) |
| Status do ciclo de vida | End of Life (per NXP product page) | — |
| Status RoHS | Compliant | [DATA_NEEDED: explicit RoHS statement] |
| Bus Width | — | 64-bit external bus |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (128-bit VMX) |
| Core Supply Voltage (Vdd) | — | 1.25 V to 1.35 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V |
| Process Technology | — | Silicon-on-Insulator (SOI), 0.13 um |
| Multi-Core Support | — | Single core (no SMP fabric on-package) |
| Floating Point Unit | — | Double-precision FPU + AltiVec single-precision SIMD |
| Instruction Cache | — | 32 KB (Harvard) |
| Branch Target Buffer | — | 512-entry BHT |