MC7448VU1250ND vs MC7447AVU1000NB Vergleich
Detaillierter Direktvergleich von MC7448VU1250ND von NXP Semiconductors und MC7447AVU1000NB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC7448VU1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP Semiconductors
MC7448VU1250ND ✗ AbgekündigtNXP Semiconductors
MC7447AVU1000NB - 1GHz PowerPC G4 MPU 512KB L2 | NXP
MC7447AVU1000NB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MC7448VU1250ND | MC7447AVU1000NB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $128,00 | $99,50 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Part Family | MPC7448 (PowerPC G4) | — |
| Core | PowerPC G4 32-bit | — |
| Core Architecture | Power Architecture with AltiVec SIMD extension | PowerPC G4 (MPC7447A) |
| Core Frequency | 1.25 GHz | 1.0 GHz |
| L2 Cache | 1 MB on-die (with ECC) | 512 KB on-chip |
| External Bus | MPX / 60x (64-bit) | — |
| Core Voltage | 1.1 V | — |
| Gehäuse | 360-FCCBGA (25x25 mm) | 360-FCCBGA (Flip-Chip Ceramic BGA), 25x25 mm |
| Betriebstemperatur | -40C to +105C (industrial, APL8 RV2.2.1) | 0C to +105C (commercial) |
| Number of Cores | 1 | 1 |
| Instruction Set | 32-bit Power Architecture + AltiVec | 32-bit PowerPC RISC |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA socket or solder) |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: explicit RoHS statement] |
| Bus Width | — | 64-bit external bus |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec (128-bit VMX) |
| Core Supply Voltage (Vdd) | — | 1.25 V to 1.35 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V |
| Process Technology | — | Silicon-on-Insulator (SOI), 0.13 um |
| Multi-Core Support | — | Single core (no SMP fabric on-package) |
| Floating Point Unit | — | Double-precision FPU + AltiVec single-precision SIMD |
| Instruction Cache | — | 32 KB (Harvard) |
| Branch Target Buffer | — | 512-entry BHT |