MC9RS08KB4CWJ vs MC9RS08KA8CWJ Comparação
Comparação detalhada lado a lado de MC9RS08KB4CWJ por NXP Semiconductors e MC9RS08KA8CWJ por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP
MC9RS08KB4CWJ ✗ Fim de vidaNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Última compraComparação de especificações
| Parâmetro | MC9RS08KB4CWJ | MC9RS08KA8CWJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1,49 | $1,68 |
| Core Processor | RS08 | — |
| Core Size | 8-bit | — |
| CPU Speed | 20 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | 8 KB Flash |
| RAM Size | 126 B | — |
| EEPROM Size | None (Flash-based) | — |
| Number of I/O | 18 | — |
| Supply Voltage Range | 2.5 V to 5.5 V | — |
| Connectivity | I2C, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Instruction Set | HC08 subset + BGND | Subset of HC08 with added BGND instruction |
| Encapsulamento | 20-pin SOIC (wide-body, tube) | 20-SOIC Wide (20-SOIC W, Tube) |
| Tipo de montagem | Surface Mount | Surface Mount (SMD/SMT) |
| Temperatura de operação | -40C to +85C | — |
| Nível MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status from data] |
| Debug Interface | Background Debug Mode (BDM) | — |
| Largura do barramento de dados | 8-bit | 8 bit |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Maximum CPU Frequency | — | 20 MHz |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Pin/Package Count | — | 20 pins |
| Faixa de temperatura de operação | — | -40 C to +85 C (Industrial) |
| Packaging Method | — | Tube |