MC9S08AC32CFDE vs S9S08AW60E5MFGE Comparação
Comparação detalhada lado a lado de MC9S08AC32CFDE por NXP Semiconductors e S9S08AW60E5MFGE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndNXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ AtivoComparação de especificações
| Parâmetro | MC9S08AC32CFDE | S9S08AW60E5MFGE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,02 | $6,05 |
| Core Architecture | S08 (HCS08 family, 8-bit CISC) | HCS08 (S08 enhanced), 8-bit CISC |
| Program Memory (Flash) | 32 KB | — |
| RAM | 1 KB | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | 40 MHz | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Faixa de temperatura de operação | -40 C to +125 C (automotive grade) | — |
| Number of I/O Pins | 38 | — |
| Encapsulamento | 48-QFN-EP (7x7 mm) with exposed thermal pad | 44-pin LQFP (10 x 10 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| ADC | 8-channel, 10-bit | Multi-channel 10-bit (per family) |
| Timers | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules | TPM modules with PWM channels |
| Communication Interfaces | SCI (UART) and SPI | — |
| Debug Interface | Single-wire BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Internal Clock Source | Yes (ICS - Internal Clock Source) | — |
| Temperature Grade | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] | — |
| Largura do barramento de dados | 8-bit | — |
| MSL (Moisture Sensitivity Level) | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] | — |
| RoHS Compliance | Compliant (per NXP product page) | — |
| Lead-Free | Yes (per distributor packaging datasheet) | — |
| Status do ciclo de vida | NRND (Not Recommended for New Designs, per NXP product page) | — |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| Tensão de alimentação | — | 3 V / 3.3 V / 5 V |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| Communication | — | SCI (UART), SPI, I2C |
| Temperatura de operação | — | -40C to +125C (automotive range) |
| Family | — | S08 / MC9S08AW60 series |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |