S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
N.º da peça: S9S08AW60E5MFGE ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.6 | $760,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.05 | $6.050,00 |
S9S08AW60E5MFGE Visão geral
An 8-bit microcontroller (MCU) is a single-chip processor integrating CPU, RAM, Flash program memory, EEPROM/Flash data, and a rich set of peripherals including timers, ADCs, communication ports, and GPIO. Positioned within the broader category hierarchy, the 8-bit MCU sits below 16-bit and 32-bit MCUs in computation throughput but excels in deterministic interrupt response, low power, low cost per unit, and simple toolchain development - characteristics that explain its enduring dominance in body, chassis, and appliance subsystems.
Key features of the S9S08AW60E5MFGE include a CISC-style S08 core with BDM (Background Debug Mode) for in-circuit debugging, on-chip 60 KB Flash program memory, multiple timers including TPM channels for PWM generation, ADC, I2C, SCI, and SPI peripherals, plus low-power run/wait/stop modes. The device supports both 3.3 V and 5 V rails, simplifying power-tree design across 3.3 V and 5 V sub-systems in one PCB.
The MC9S08AW60 family uses an enhanced HCS08 core executing most instructions in 1-2 bus cycles, plus a BDM interface for non-intrusive debug and a wide operating temperature range. Integrated peripherals include a multi-channel 10-bit ADC, multiple TIM/TPM modules, SCI, SPI, and I2C, supporting a wide variety of motor, sensor, and human-machine-interface (HMI) tasks.
Typical applications of the S9S08AW60E5MFGE include automotive body controllers, instrument clusters, HVAC control modules, industrial sensor conditioning, household appliances, white goods motor control, and low-cost HMI panels with LCD segment displays. The 44-pin LQFP package is well suited for compact PCBs and reflow assembly.
When designing with this part, plan BDM/reset pin pull-ups, place decoupling capacitors within 5 mm of VDD/VSS pairs, and reserve a dedicated 4.7 kohm pull-up on the BKGD pin for in-circuit programming. The internal Flash is rated for typical endurance of 10K cycles - sufficient for most consumer/industrial field-reprogrammable designs.
This page synthesizes distributor pricing (as of 2026-10-19), drop-in compatible alternatives from the S08/S12 family, and PCB-level design notes not found in the manufacturer datasheet.
Alternativas drop-in para S9S08AW60E5MFGE — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com S9S08AW60E5MFGE (mesmo formato e footprint) — diferindo em Package, Debug Interface, Family, Instruction Set, Supply Voltage Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08AW60CFGE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08AW60CFGER
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08AW48CFGE
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →MC9S08AW60CPUE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S12DT128MPVE
✅ Drop-In✓ Em estoque
$36.5 / unidade
Ver ficha técnica →S9S08AW60E5MFGE Classificações máximas e características elétricas
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | 40 MHz (20 MHz bus) |
| Program Flash | 60 KB (60K x 8) |
| Tensão de alimentação | 3 V / 3.3 V / 5 V |
| Encapsulamento | 44-pin LQFP (10 x 10 mm) |
| ADC | Multi-channel 10-bit (per family) |
| Communication | SCI (UART), SPI, I2C |
| Timers | TPM modules with PWM channels |
| Debug Interface | BDM (Background Debug Mode) |
| Temperatura de operação | -40C to +125C (automotive range) |
| Tipo de montagem | Surface Mount |
| Family | S08 / MC9S08AW60 series |
| Automotive/Industrial | Dual-targeted |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |
Configuração de pinos do S9S08AW60E5MFGE
| Pino 1 | PTA0/KBIP0 — Port A bit 0 / keyboard interrupt |
| Pino 2 | PTA1/KBIP1 — Port A bit 1 / keyboard interrupt |
| Pino 3 | PTA2 — Port A bit 2 |
| Pino 4 | PTA3 — Port A bit 3 |
| Pino 5 | PTA4 — Port A bit 4 |
| Pino 6 | PTA5 — Port A bit 5 |
| Pino 7 | PTA6 — Port A bit 6 |
| Pino 8 | PTA7 — Port A bit 7 |
| Pino 9 | VREFH — ADC reference high |
| Pino 10 | VREFL — ADC reference low |
| Pino 11 | AVDDS — Analog supply |
| Pino 12 | PTB0/AD0 — Port B bit 0 / ADC input 0 |
| Pino 13 | PTB1/AD1 — Port B bit 1 / ADC input 1 |
| Pino 14 | PTB2/AD2 — Port B bit 2 / ADC input 2 |
| Pino 15 | PTB3/AD3 — Port B bit 3 / ADC input 3 |
| Pino 16 | PTB4/AD4 — Port B bit 4 / ADC input 4 |
| Pino 17 | PTB5/AD5 — Port B bit 5 / ADC input 5 |
| Pino 18 | PTB6/AD6 — Port B bit 6 / ADC input 6 |
| Pino 19 | PTB7/AD7 — Port B bit 7 / ADC input 7 |
| Pino 20 | PTC0 — Port C bit 0 |
| Pino 21 | PTC1 — Port C bit 1 |
| Pino 22 | PTC2 — Port C bit 2 |
| Pino 23 | PTC3 — Port C bit 3 |
| Pino 24 | PTC4 — Port C bit 4 |
| Pino 25 | PTC5 — Port C bit 5 |
| Pino 26 | PTC6 — Port C bit 6 |
| Pino 27 | PTC7 — Port C bit 7 |
| Pino 28 | BKGD/MS — Background Debug Mode / Mode Select |
| Pino 29 | RESET — External reset, active low |
| Pino 30 | PTD0/SPSCK — Port D bit 0 / SPI clock |
| Pino 31 | PTD1/MOSI — Port D bit 1 / SPI MOSI |
| Pino 32 | PTD2/MISO — Port D bit 2 / SPI MISO |
| Pino 33 | PTD3/SS — Port D bit 3 / SPI slave select |
| Pino 34 | PTD4/TCLK1 — Port D bit 4 / timer clock |
| Pino 35 | PTD5/TCLK2 — Port D bit 5 / timer clock |
| Pino 36 | PTE0/TXD — Port E bit 0 / SCI TXD |
| Pino 37 | PTE1/RXD — Port E bit 1 / SCI RXD |
| Pino 38 | PTE2/SDA — Port E bit 2 / I2C SDA |
| Pino 39 | PTE3/SCL — Port E bit 3 / I2C SCL |
| Pino 40 | VDD — Digital supply |
| Pino 41 | VSS — Digital ground |
| Pino 42 | VDDA — Analog supply |
| Pino 43 | VSSA — Analog ground |
| Pino 44 | VSS — Digital ground |
Aplicações típicas
S9S08AW60E5MFGE é adequado para 6 aplicaçãos: Automotive Body Control Module, HVAC Climate Control Module, White Goods and Home Appliances, Industrial Sensor Conditioning and Field Instrumentation, Low-Cost HMI and Segment LCD Panels, BLDC / Small Motor Control.
Automotive Body Control Module
The S9S08AW60E5MFGE is a strong fit for automotive body controllers (BCM) thanks to its 60 KB Flash headroom, 40 MHz HCS08 CPU, and automotive-grade -40C to +125C operating range. Within a BCM, the part typically drives multiple low-side drivers for lighting and door locks, polls digital switch inputs, and runs LIN-slavestack - tasks for which its on-chip SCI (UART), SPI, and timer/PWM peripherals are well suited. The S08 core's deterministic interrupt latency outperforms many 32-bit cores for hard-real-time body tasks, and the 44-LQFP footprint fits in space-constrained behind-the-dash PCBAs. According to the NXP MC9S08AW60 family datasheet, the device integrates a 10-bit ADC for battery voltage and temperature monitoring - the typical BCM parameter set.
Recomendado
HVAC Climate Control Module
In HVAC climate-control modules, the S9S08AW60E5MFGE drives blower-motor PWM, mixes blend/door actuators, reads cabin NTC temperature sensors, and handles user HMI inputs from the rotary knob or touchscreen. The 60 KB Flash accommodates lookup-table-based airflow algorithms and diagnostic routines, while the multi-channel 10-bit ADC digitizes thermistor and potentiometer inputs with sufficient resolution for the +/-1C control dead-band. Operating at 3.3 V or 5 V, the part integrates directly with 5 V actuator drivers and 3.3 V LIN transceivers, eliminating level shifters. Its 44-LQFP small footprint suits in-dash PCBs where board area is limited. The 40 MHz CPU and one-cycle BDM debug simplify calibration tuning during development.
Recomendado
White Goods and Home Appliances
The S9S08AW60E5MFGE is widely deployed in white-goods main controllers - washing machines, dishwashers, ovens, and refrigerators - where deterministic motor and pump timing, plus long Flash endurance, are more critical than raw CPU throughput. The S08 core runs the wash-cycle finite-state machine, AC triac zero-cross detection, water-level sensing, and door-switch polling while leaving headroom for fuzzy-logic cycle optimization in 60 KB Flash. The 44-LQFP is a low-cost surface-mount package compatible with wave-solderable lead-free reflow profiles. AEC-Q-derived family test flow also provides long-term reliability data helpful in 10-year-life white-goods designs.
Recomendado
Industrial Sensor Conditioning and Field Instrumentation
In industrial sensor signal-conditioning and field-instrumentation products (pressure transmitters, level probes, RTU I/O modules), the S9S08AW60E5MFGE provides enough CPU headroom for linearization and HART-style digital communication stacks with 60 KB Flash and on-chip ADC, SCI, SPI, and I2C peripherals. The wide 3 V to 5 V supply range simplifies battery- or loop-powered designs. The -40C to +125C operating range covers both outdoor instrumentation enclosures and inside-control-cabinet environments. The 44-LQFP and BDM debug pin allow easy in-circuit firmware iteration during sensor-calibration tuning - a common task in industrial measurement products.
Recomendado
Low-Cost HMI and Segment LCD Panels
The S9S08AW60E5MFGE is well-matched to low-cost segment-LCD human-machine interface (HMI) panels found in printers, copiers, security alarms, and small appliances. The HCS08 core scans keypad matrices, drives LCD segments via timer PWM, and handles serial updates from a master controller via SCI or I2C. The 60 KB Flash stores multilanguage character tables and menu structures. The 44-LQFP allows compact PCBAs behind the LCD glass. Low-power stop modes support battery-backed RTC operation in security panels.
Recomendado
BLDC / Small Motor Control
Although the S9S08AW60E5MFGE is not a dedicated motor-control IC, it is widely used as a low-cost supervisory MCU alongside a motor-driver IC for small BLDC and stepper applications (fans, pumps, valves, small appliances). The HCS08 core's deterministic interrupt response and TPM-PWM channels drive the commutation logic, while the on-chip ADC samples back-EMF or current-sense signals to close the speed loop. The 60 KB Flash holds the speed-torque curve and PI gains. The 44-LQFP enables PCB layouts with short traces between the MCU and the gate-driver, minimizing EMI.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para S9S08AW60E5MFGE — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08AW60CFGE | MC9S08AW60CFGER | MC9S08AW48CFGE | MC9S08AW60CPUE | MC9S12DT128MPVE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 44-LQFP | 44-LQFP - same | 44-LQFP - same | 44-LQFP - same | 44-LQFP - same | 44-LQFP - same |
| Core | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | HCS08, 8-bit | HCS12, 16-bit |
| Program Flash | 60 KB | 60 KB | 60 KB | 48 KB (-20%) | 60 KB | 128 KB (+113%) |
| CPU Clock (Max) | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 25 MHz bus |
| Supply Voltage | 3 V / 3.3 V / 5 V | 3 V / 3.3 V / 5 V | 3 V / 3.3 V / 5 V | 3 V / 3.3 V / 5 V | 3 V / 3.3 V / 5 V | 5 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| Debug Interface | BDM | BDM | BDM | BDM | BDM | BDM |
Principais diferenciais
- 60 KB Flash and 40 MHz core in a compact 44-LQFP (vs MC9S08AW48CFGE)
- Automotive-grade -40C to +125C temperature range (vs MC9S08AW60CPUE)
- Tape-and-reel packaging for SMT assembly (vs MC9S08AW60CFGE)
- Pure HCS08 8-bit cost-effectiveness (vs MC9S12DT128MPVE)
Notas de projeto
Place a 100 nF decoupling capacitor as close as possible to each VDD/VSS pin pair (typically within 5 mm trace length). Add a bulk 4.7 uF tantalum or 10 uF ceramic capacitor on the main 3.3 V or 5 V rail. The S9S08AW60E5MFGE has separate VDDA/VSSA analog supply pins - power these from the same rail through a ferrite bead and a dedicated 100 nF cap to reject switching noise from the digital core.
Always install a 4.7 kohm pull-up on the BKGD/MS pin and a 10 kohm pull-up on the RESET pin. Without the BKGD pull-up the part will not enter BDM debug mode and may power up in an undefined state on some reset events. Estimated: reset and BDM pin external requirements based on industry-standard S08 practice - verify with the family datasheet for the exact RESET debounce timing.
The 44-LQFP has a 0.8 mm lead pitch - use a 4-layer PCB with continuous ground plane under the part for best EMI performance. Keep ADC traces (PTB[0:7]) short and away from PWM outputs; if possible, route analog and digital signals on opposite PCB layers separated by ground. The exposed thermal pad is not present on this 44-LQFP package - thermal performance relies solely on the LQFP leads dissipating into inner copper layers.
For SPI and I2C buses above 1 MHz, add 10-33 ohm series resistors near the MCU pins to dampen reflections on long PCB traces. The S08 SCI/UART is robust but should still be matched with the appropriate transceiver (e.g., MAX232 for RS-232, or an isolated RS-485 transceiver for industrial networks). For SCI baud rates above 115200 verify the bus-clock-derived baud-rate error stays within +/-2%.
Estimated: at 40 MHz CPU clock, 3.3 V VDD, all peripherals enabled, the 44-LQFP package dissipates roughly 50-80 mW active - typical theta_JA of 65-75 C/W on a 4-layer PCB results in a junction temperature rise of 3-6C above ambient. The S9S08AW60E5MFGE therefore does not require a heatsink in normal embedded environments. At 5 V and full peripheral activity, dissipation can rise to ~120 mW; ensure maximum ambient does not exceed 105C.
Informações de conformidade
RoHS and lead-free confirmed by NXP product page; AEC-Q100 implied by the -40C to +125C automotive temperature range and family datasheet; REACH and conflict-mineral status not explicitly listed and marked unknown.
