MC9S08AW32CFGE vs MC9S08AW16CFGE Comparação

Comparação detalhada lado a lado de MC9S08AW32CFGE por NXP Semiconductors e MC9S08AW16CFGE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08AW32CFGE MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE Nrnd
NXP Semiconductors
MC9S08AW16CFGE MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE Nrnd

Comparação de especificações

Parâmetro MC9S08AW32CFGE MC9S08AW16CFGE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $2,86 $0,00
Core Processor S08 (HCS08) 8-bit CISC S08 (HCS08)
Core Size 8-bit 8-bit
Maximum CPU Frequency 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory 32 KB (32K x 8) 16KB (16K x 8)
RAM 2 KB —
EEPROM [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
ADC Resolution 10-bit —
ADC Channels 8-channel —
General Purpose I/O 34 —
Encapsulamento 44-LQFP (10x10 mm), 0.5 mm pitch —
Package Standard MO-220VKKD-2, 7 x 7 mm body variants per distributor listing —
Tipo de montagem Surface Mount Surface Mount
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Instruction Set HC08 instruction set with added BGND instruction —
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Status do ciclo de vida NRND (Not Recommended for New Designs) —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
CPU Speed — 40 MHz
Architecture — CISC, HC08 instruction set with added BGND instruction
RAM Size — [DATA_NEEDED: RAM size]
I/O Ports — 38 general-purpose I/O
Package Type — 44-LQFP (10x10 mm)
Package Outline — QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height
Family — S08AW (AW60/AW48/AW32/AW16)
Target Industries — Industrial and Automotive
Lifecycle Status (NXP) — NRND (Not Recommended for New Designs)

Fichas técnicas e recursos

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