MC9S08AW32CFGE vs MC9S08AW16CFGE 对比

详细并排对比 MC9S08AW32CFGE 出自 NXP Semiconductors 和 MC9S08AW16CFGE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08AW32CFGE MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE Nrnd
NXP Semiconductors
MC9S08AW16CFGE MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP

MC9S08AW16CFGE Nrnd

规格对比

参数 MC9S08AW32CFGE MC9S08AW16CFGE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $2.86 $0.00
Core Processor S08 (HCS08) 8-bit CISC S08 (HCS08)
Core Size 8-bit 8-bit
Maximum CPU Frequency 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Flash Memory 32 KB (32K x 8) 16KB (16K x 8)
RAM 2 KB —
EEPROM [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
ADC Resolution 10-bit —
ADC Channels 8-channel —
General Purpose I/O 34 —
封装 44-LQFP (10x10 mm), 0.5 mm pitch —
Package Standard MO-220VKKD-2, 7 x 7 mm body variants per distributor listing —
安装类型 Surface Mount Surface Mount
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Instruction Set HC08 instruction set with added BGND instruction —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
生命周期状态 NRND (Not Recommended for New Designs) —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
CPU Speed — 40 MHz
Architecture — CISC, HC08 instruction set with added BGND instruction
RAM Size — [DATA_NEEDED: RAM size]
I/O Ports — 38 general-purpose I/O
Package Type — 44-LQFP (10x10 mm)
Package Outline — QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height
Family — S08AW (AW60/AW48/AW32/AW16)
Target Industries — Industrial and Automotive
Lifecycle Status (NXP) — NRND (Not Recommended for New Designs)

数据手册与资源

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