MC9S08AW60CFDE vs MC9S08JM32CGT Comparação
Comparação detalhada lado a lado de MC9S08AW60CFDE por NXP Semiconductors e MC9S08JM32CGT por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AW60CFDE - 8-bit HCS08 MCU, 60KB Flash, 40MHz, QFN-48 | NXP
MC9S08AW60CFDE NrndNXP Semiconductors
MC9S08JM32CGT - 8-bit USB MCU, 32KB Flash, 48MHz, QFN-48 | NXP
MC9S08JM32CGT ✓ AtivoComparação de especificações
| Parâmetro | MC9S08AW60CFDE | MC9S08JM32CGT |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $7,43 | $4,02 |
| Core | HCS08 (S08 enhanced) | HCS08 (S08 core, 8-bit) |
| CPU Bit Width | 8 bit | — |
| Maximum CPU Clock | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 24 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) | 32 KB (32K x 8) |
| RAM | 4 KB | 2 KB |
| Tensão de alimentação | 2.7 V to 5.5 V | — |
| I/O Pins | 38 | — |
| Encapsulamento | 48-QFN-EP (7x7 mm, 0.5 mm pitch) | 48-QFN-EP (7x7 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | Compliant | RoHS Compliant (per QFN-EP package marking MO-220VKKD-2) |
| MSL (Moisture Sensitivity Level) | 3 | — |
| Temperatura de operação | -40C to +85C | [DATA_NEEDED: industrial temperature range] |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Peripheral Set | SCI, SPI, I2C, TPM timers, 10-bit ADC, COP watchdog, LVD, RTI | — |
| Instruction Set Compatibility | HC08 with added BGND instruction | — |
| CPU Frequency | — | 48 MHz |
| USB | — | USB 2.0 Full-Speed Device with on-chip transceiver |
| Operating Voltage | — | 3.3 V / 5 V (integrated LDO) |
| ADC | — | 12-bit, multi-channel |
| Communication Interfaces | — | USB, SCI (UART), SPI, IIC |
| Timers | — | Multiple (TPM/MTIM, per datasheet) |
| Debug | — | Background Debug + on-chip ICE module (2 comparators, triggers) |