MC9S08AW60CFDE vs MC9S08JM32CGT 对比
详细并排对比 MC9S08AW60CFDE 出自 NXP Semiconductors 和 MC9S08JM32CGT 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08AW60CFDE - 8-bit HCS08 MCU, 60KB Flash, 40MHz, QFN-48 | NXP
MC9S08AW60CFDE NrndNXP Semiconductors
MC9S08JM32CGT - 8-bit USB MCU, 32KB Flash, 48MHz, QFN-48 | NXP
MC9S08JM32CGT ✓ 量产中规格对比
| 参数 | MC9S08AW60CFDE | MC9S08JM32CGT |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.43 | $4.02 |
| Core | HCS08 (S08 enhanced) | HCS08 (S08 core, 8-bit) |
| CPU Bit Width | 8 bit | — |
| Maximum CPU Clock | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 24 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) | 32 KB (32K x 8) |
| RAM | 4 KB | 2 KB |
| 电源电压 | 2.7 V to 5.5 V | — |
| I/O Pins | 38 | — |
| 封装 | 48-QFN-EP (7x7 mm, 0.5 mm pitch) | 48-QFN-EP (7x7 mm, 0.5 mm pitch) |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | RoHS Compliant (per QFN-EP package marking MO-220VKKD-2) |
| MSL (Moisture Sensitivity Level) | 3 | — |
| 工作温度 | -40C to +85C | [DATA_NEEDED: industrial temperature range] |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Peripheral Set | SCI, SPI, I2C, TPM timers, 10-bit ADC, COP watchdog, LVD, RTI | — |
| Instruction Set Compatibility | HC08 with added BGND instruction | — |
| CPU Frequency | — | 48 MHz |
| USB | — | USB 2.0 Full-Speed Device with on-chip transceiver |
| Operating Voltage | — | 3.3 V / 5 V (integrated LDO) |
| ADC | — | 12-bit, multi-channel |
| Communication Interfaces | — | USB, SCI (UART), SPI, IIC |
| Timers | — | Multiple (TPM/MTIM, per datasheet) |
| Debug | — | Background Debug + on-chip ICE module (2 comparators, triggers) |