MC9S08AW60MPUE557 vs MC9S08AW32CPUE Comparação
Comparação detalhada lado a lado de MC9S08AW60MPUE557 por NXP Semiconductors e MC9S08AW32CPUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ AtivoComparação de especificações
| Parâmetro | MC9S08AW60MPUE557 | MC9S08AW32CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $6,10 | $6,10 |
| Core Architecture | HCS08 (enhanced S08) | — |
| Largura do barramento de dados | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | 2KB |
| Tensão de alimentação de operação | 2.7 V to 5.5 V | — |
| I/O Pins | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa | — |
| Encapsulamento | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| ADC | [DATA_NEEDED: number of channels and resolution] | — |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| Serial Interfaces | SCI, SPI, I2C (per NXP family description) | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | Single-wire background debug mode (BDM) |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| Max Clock Speed | — | 40 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| ADC Resolution | — | 10-bit |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tray |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) |
| Family | — | S08AW (AW60/48/32/16) |