MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
N.º da peça: MC9S08AW60MPUE557 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.62 | $762,00 |
| 500 | $6.85 | $3.425,00 |
| 1.000 | $6.1 | $6.100,00 |
MC9S08AW60MPUE557 Visão geral
Background knowledge: An 8-bit microcontroller (MCU) is a single-chip computer that combines a CPU, RAM, Flash program memory, and peripherals on one silicon die. The HCS08 core is NXP's enhanced 8-bit architecture succeeding the legacy HC08, adding the BGND instruction and a single-wire background debug mode interface that simplifies in-circuit programming and debugging. The MC9S08AW60 belongs to the AW sub-family of low-cost, high-performance HCS08 microcontrollers designed for cost-sensitive motor-control, appliance, and industrial-control applications, fitting the broader microcontroller -> embedded controller -> semiconductor taxonomy.
Key features include a 40 MHz CPU clock with a 20 MHz internal bus frequency, 60 KB (60K x 8) Flash, 4 KB RAM, 38 to 64 programmable I/O lines (package-dependent), and integrated peripherals including ADC, PWM, SCI, SPI, and I2C. The device supports a -40C to +85C industrial operating temperature range and includes on-chip voltage regulator, low-voltage detection, and watchdog timer for system reliability. The single-wire background debug mode (BDM) interface enables in-circuit flash programming and real-time debug without requiring additional program memory or pin resources.
The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer, 16-bit index registers (H:X), and an enhanced instruction set that improves code density over the legacy HC08. The on-chip voltage regulator generates the internal logic supply from the external 2.7 V to 5.5 V input, simplifying power design. Flash memory supports in-application reprogramming via the BDM interface, enabling firmware updates in the field.
Typical applications include industrial control systems, automotive body electronics, appliance motor control, HVAC controllers, and sensor-interface modules. The wide peripheral set also fits building automation, security panels, and low-cost consumer devices.
Designers should evaluate supply decoupling (0.1 uF plus bulk 1 uF to 10 uF ceramic), BDM interface pin protection, and PCB layout for the ADC analog input traces. The 64-LQFP package allows easy hand-soldering and prototyping, while the 2.7 V minimum supply enables direct Li-ion or 3.3 V system-rail operation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and engineering teams a single place to assess the MC9S08AW60MPUE557 for new designs and existing platform maintenance.
Alternativas drop-in para MC9S08AW60MPUE557 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S08AW60MPUE557 (mesmo formato e footprint) — diferindo em Package, Core Processor, Program Memory Size, RAM Size, Instruction Set.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S08AW60CPUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08AW48CPUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MC9S08AW32CPUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.1 / unidade
Ver ficha técnica →MC9S08AW16CPUE
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.2 / unidade
Ver ficha técnica →MC9S08AW60MFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
S9S08AW60E7MFGE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S08AW60MPUE557 Classificações máximas e características elétricas
| Core Architecture | HCS08 (enhanced S08) |
| Largura do barramento de dados | 8-bit |
| CPU Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 4 KB |
| Tensão de alimentação de operação | 2.7 V to 5.5 V |
| I/O Pins | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Tipo de montagem | Surface Mount |
| Serial Interfaces | SCI, SPI, I2C (per NXP family description) |
| Debug Interface | Single-wire Background Debug Mode (BDM) |
Configuração de pinos do MC9S08AW60MPUE557
| Pino 1 | PTD0 — Port D I/O bit 0 (shared with BKGD/MS on some AW family variants) |
| Pino 2 | PTD1 — Port D I/O bit 1 |
| Pino 3 | VDD — Supply voltage (2.7 V to 5.5 V) |
| Pino 4 | VSS — Ground |
| Pino 5 | PTA0 — Port A I/O bit 0 / TCLK input |
| Pino 6 | PTA1 — Port A I/O bit 1 |
| Pino 7 | PTA2 — Port A I/O bit 2 |
| Pino 8 | PTA3 — Port A I/O bit 3 |
| Pino 9 | PTA4 — Port A I/O bit 4 |
| Pino 10 | PTA5 — Port A I/O bit 5 |
| Pino 11 | PTA6 — Port A I/O bit 6 |
| Pino 12 | PTA7 — Port A I/O bit 7 |
| Pino 13 | PTB0 — Port B I/O bit 0 / ADC channel |
| Pino 14 | PTB1 — Port B I/O bit 1 / ADC channel |
| Pino 15 | PTB2 — Port B I/O bit 2 / ADC channel |
| Pino 16 | PTB3 — Port B I/O bit 3 / ADC channel |
| Pino 17 | PTB4 — Port B I/O bit 4 / ADC channel |
| Pino 18 | PTB5 — Port B I/O bit 5 / ADC channel |
| Pino 19 | PTB6 — Port B I/O bit 6 / ADC channel |
| Pino 20 | PTB7 — Port B I/O bit 7 / ADC channel |
| Pino 21 | PTC0 — Port C I/O bit 0 / SPI signal |
| Pino 22 | PTC1 — Port C I/O bit 1 / SPI signal |
| Pino 23 | PTC2 — Port C I/O bit 2 / SPI signal |
| Pino 24 | PTC3 — Port C I/O bit 3 / SPI signal |
| Pino 25 | PTC4 — Port C I/O bit 4 / SCI TX |
| Pino 26 | PTC5 — Port C I/O bit 5 / SCI RX |
| Pino 27 | PTC6 — Port C I/O bit 6 / I2C SCL |
| Pino 28 | PTC7 — Port C I/O bit 7 / I2C SDA |
| Pino 29 | VSS — Ground |
| Pino 30 | VDD — Supply voltage |
| Pino 31 | RESET — Active-low reset input |
| Pino 32 | PTE0 — Port E I/O bit 0 / PWM channel |
| Pino 33 | PTE1 — Port E I/O bit 1 / PWM channel |
| Pino 34 | PTE2 — Port E I/O bit 2 / PWM channel |
| Pino 35 | PTE3 — Port E I/O bit 3 / PWM channel |
| Pino 36 | PTE4 — Port E I/O bit 4 |
| Pino 37 | PTE5 — Port E I/O bit 5 |
| Pino 38 | PTE6 — Port E I/O bit 6 |
| Pino 39 | PTE7 — Port E I/O bit 7 |
| Pino 40 | PTF0 — Port F I/O bit 0 |
| Pino 41 | PTF1 — Port F I/O bit 1 |
| Pino 42 | PTF2 — Port F I/O bit 2 |
| Pino 43 | PTF3 — Port F I/O bit 3 |
| Pino 44 | PTF4 — Port F I/O bit 4 |
| Pino 45 | PTF5 — Port F I/O bit 5 |
| Pino 46 | PTF6 — Port F I/O bit 6 |
| Pino 47 | PTF7 — Port F I/O bit 7 |
| Pino 48 | PTG0 — Port G I/O bit 0 |
| Pino 49 | PTG1 — Port G I/O bit 1 |
| Pino 50 | PTG2 — Port G I/O bit 2 |
| Pino 51 | PTG3 — Port G I/O bit 3 |
| Pino 52 | PTG4 — Port G I/O bit 4 |
| Pino 53 | PTG5 — Port G I/O bit 5 |
| Pino 54 | PTG6 — Port G I/O bit 6 |
| Pino 55 | PTG7 — Port G I/O bit 7 |
| Pino 56 | PTH0 — Port H I/O bit 0 |
| Pino 57 | PTH1 — Port H I/O bit 1 |
| Pino 58 | PTH2 — Port H I/O bit 2 |
| Pino 59 | PTH3 — Port H I/O bit 3 |
| Pino 60 | PTH4 — Port H I/O bit 4 |
| Pino 61 | PTH5 — Port H I/O bit 5 |
| Pino 62 | PTH6 — Port H I/O bit 6 |
| Pino 63 | PTH7 — Port H I/O bit 7 |
| Pino 64 | BKGD/MS — Background Debug Mode / Mode Select |
Aplicações típicas
MC9S08AW60MPUE557 é adequado para 6 aplicaçãos: Industrial Motor Control, Appliance Control (White Goods), Automotive Body Electronics, HVAC Climate Controllers, Security and Fire-Alarm Panels, Sensor-Interface Modules.
Industrial Motor Control
The MC9S08AW60MPUE557 fits industrial motor-control designs where its 40 MHz HCS08 core runs FOC or trapezoidal commutation loops at typical PWM frequencies of 10-20 kHz. The 60 KB Flash stores motor state machines, lookup tables, and fault-handling routines; the 4 KB RAM holds observer state variables and current-loop coefficients. Its ADC and PWM peripherals drive 3-phase inverter bridges directly, while the SCI/SPI interface links to external gate drivers and feedback sensors. Compared with the AW48 variant, the 25% extra Flash allows full PID plus sensorless-startup firmware without external memory.
Recomendado
Appliance Control (White Goods)
The MC9S08AW60MPUE557 targets washing-machine, dishwasher, and refrigerator control boards where the HCS08 core handles user-interface, motor-driver sequencing, and safety-monitoring tasks. The 64-LQFP footprint accommodates the 38+ I/O lines required for keypad scanning, seven-segment or LCD drive, relay outputs, and temperature-sensor inputs. Its 2.7 V to 5.5 V supply range supports both 3.3 V and 5 V system rails common in white goods. Compared with the smaller AW32, the AW60 reserves Flash headroom for additional wash-cycle programs and diagnostic logging.
Recomendado
Automotive Body Electronics
The MC9S08AW60MPUE557 supports automotive body-control modules including door-lock controllers, seat-position memory, and lighting drivers. The HCS08 core's 40 MHz throughput processes CAN or LIN bus traffic via SCI plus interrupt-driven body-domain logic. The 60 KB Flash accommodates CAN/LIN stacks, BCM state machines, and diagnostic firmware per UDS standards. Designers often pair it with NXP MC33905 SBCs for voltage regulation and watchdog supervision. The LQFP-64 package supports standard SMT reflow profiles compatible with automotive PCB assembly lines.
Recomendado
HVAC Climate Controllers
The MC9S08AW60MPUE557 serves HVAC controller boards where the HCS08 core runs temperature-control loops, fan-speed PID, and user-interface tasks. Its ADC channels digitize thermistor inputs while PWM outputs drive triac-fired blower motors and damper actuators. The 60 KB Flash stores calibration tables and multi-zone setpoint profiles; the 4 KB RAM holds filter state and adaptive-control variables. Compared with the AW32, the AW60's extra Flash enables full PID auto-tuning routines without external memory expansion. The industrial temperature grade handles -40C to +85C environments.
Recomendado
Security and Fire-Alarm Panels
The MC9S08AW60MPUE557 is a strong match for intrusion-alarm and fire-alarm control panels where reliability and code-density matter more than raw CPU speed. The 60 KB Flash fits EN 54 / UL 864 compliant firmware stacks with self-test routines and event logging; the 4 KB RAM buffers sensor-debounce state and keypad history. Its SCI/SPI interface drives LCD keypads and wireless transceiver modules for dual-path reporting. Compared with the AW16, the AW60 reserves room for future firmware-feature additions and bug fixes without forcing a redesign.
Recomendado
Sensor-Interface Modules
The MC9S08AW60MPUE557 fits multi-sensor interface modules such as industrial-data-acquisition front-ends and IoT gateways where the HCS08 core aggregates analog and digital sensor data before forwarding to a host. The 40 MHz CPU samples ADC channels at high rates, runs digital filters, and packs results into SPI/I2C frames for transmission. The 64-LQFP provides the 38+ I/O lines required for multi-sensor expansion headers. Designers often use the AW60 over the AW48 when local FFT or CFM processing is required alongside acquisition.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S08AW60MPUE557 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S08AW60CPUE | MC9S08AW48CPUE | MC9S08AW32CPUE | MC9S08AW16CPUE | MC9S08AW60MFGE | S9S08AW60E7MFGE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz | HCS08 8-bit, 40 MHz |
| Flash | 60 KB | 60 KB | 48 KB (-20%) | 32 KB (-47%) | 16 KB (-73%) | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB (-50%) | 4 KB | 4 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Debug Interface | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM |
| Param Match Score | 100% | 95% | 80% | 70% | 70% | 100% | 100% |
Principais diferenciais
- Largest Flash in the HCS08 AW60 sub-family (vs MC9S08AW48CPUE)
- Same silicon as the canonical NXP MC9S08AW60 family (vs MC9S08AW32CPUE)
- NXP/Freescale authorized stocking via Rochester Electronics (vs MC9S08AW16CPUE)
Notas de projeto
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pair (typically pins 3/4 and 29/30 on the LQFP-64). Add a bulk 1 uF to 10 uF ceramic on the main VDD rail to handle the 40 MHz core's switching transients. The internal voltage regulator generates the 1.8 V core supply from the external 2.7 V to 5.5 V input, so clean external decoupling directly impacts ADC and PWM analog noise performance.
Keep analog ADC input traces (PTA/PTB pins) short and routed away from high-frequency switching signals such as PWM outputs and clock traces to minimize ADC crosstalk. Use a ground plane under the LQFP-64 to provide low-impedance return paths; thermal relief pads on all 64 LQFP pins improve hand-soldering and inspection. For BDM programming, route the BKGD/MS pin (pin 64) to a 2-pin header with ESD protection for in-circuit programming access.
Do not exceed 5.5 V on any VDD pin or apply reverse polarity; the device has no reverse-battery protection. The single-wire BDM interface requires careful signal integrity - excessive capacitance on BKGD/MS prevents reliable programming. The internal Flash is rated for a finite erase/write cycle count - implement wear-leveling or external EEPROM for frequently updated parameters. Always configure the watchdog timer before enabling interrupts in production firmware.
Informações de conformidade
Compliance status not present in Verified Web Data. Industrial and Automotive industry support noted per NXP family datasheet; specific AEC-Q100 grade not confirmed in extracted snippets. RoHS/REACH/lead-free status to be verified against the NXP product page or distributor environmental documentation.