MC9S08DN60AMLH vs S9S08DZ60F2MLH Comparação

Comparação detalhada lado a lado de MC9S08DN60AMLH por NXP Semiconductors e S9S08DZ60F2MLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd
NXP Semiconductors
S9S08DZ60F2MLH S9S08DZ60F2MLH - 8-bit S08 MCU, 60KB Flash, CAN | NXP

S9S08DZ60F2MLH - 8-bit S08 MCU, 60KB Flash, CAN | NXP

S9S08DZ60F2MLH ✓ Ativo

Comparação de especificações

Parâmetro MC9S08DN60AMLH S9S08DZ60F2MLH
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $8,58 $2,45
Product Type 8-bit microcontroller —
CPU Core Enhanced HCS08 core —
Maximum CPU Frequency 40 MHz —
System Bus Frequency 20 MHz —
Flash Memory 60 KB 60 KB (60K x 8)
Flash Organization 60K x 8 bits —
RAM 2 KB [DATA_NEEDED: RAM size]
ADC 10-bit —
Serial Interface Multiple serial interfaces —
LIN Capability LIN master —
LCD Support LCD driver —
Encapsulamento 64-LQFP, 10 x 10 mm 64-LQFP (10x10 mm)
Tipo de montagem Surface mount Surface Mount
Embedded Emulation and Debug Supported by HCS08 family documentation —
Instruction Set HCS08 instruction set —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Temperatura de operação [DATA_NEEDED: operating temperature range] -40 C to +125 C
Core Processor — S08 (HCS08), 8-bit
Core Architecture — CISC
Frequência máxima de clock — 40 MHz
EEPROM — [DATA_NEEDED: EEPROM size]
Tensão de alimentação — 3.3 V / 5 V
CAN Module — msCAN (CAN 2.0 A/B)
LCD Driver — Integrated (per NXP product page)
ADC Resolution — 12-bit
Qualification — Automotive Qualified
Packaging — Tray
Peripherals — SCI, SPI, IIC, RTC, PWM

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