MC9S08DV60AMLF vs MC9S08DZ60ACLF Comparação
Comparação detalhada lado a lado de MC9S08DV60AMLF por NXP Semiconductors e MC9S08DZ60ACLF por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndComparação de especificações
| Parâmetro | MC9S08DV60AMLF | MC9S08DZ60ACLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,60 | $6,85 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | — |
| Core Processor | HCS08 (enhanced HC08 with BGND) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | 24-channel, 12-bit, 2.5 us conversion |
| Timers | Multiple TPM (per datasheet family) | — |
| Encapsulamento | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -40C to +125C | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Status RoHS | ROHS3 Compliant | Compliant |
| Debug Interface | Single-wire BDM | — |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| LCD Driver | — | Yes (on-chip segment LCD driver) |
| Nível MSL | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |