MC9S12DT256MFUE vs MC9S12D64MFUER Comparação

Comparação detalhada lado a lado de MC9S12DT256MFUE por NXP Semiconductors e MC9S12D64MFUER por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ Ativo

Comparação de especificações

Parâmetro MC9S12DT256MFUE MC9S12D64MFUER
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $19,20 $1,05
Core Architecture HCS12 (CPU12), 16-bit CISC HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz —
Flash Memory 256 KB (256K x 8) —
RAM [DATA_NEEDED: RAM size] —
EEPROM [DATA_NEEDED: EEPROM size] —
Largura do barramento de dados 16-bit —
Operating Supply Voltage (Core) 2.35 V to 2.75 V —
I/O Supply Voltage 5V-tolerant I/O on VDDR/VSSR —
Number of I/O Pins 91 —
Package Type 80-QFP (PQFP/LQFP-80, 14x14 mm) —
Tipo de montagem Surface Mount Surface Mount (SMD/SMT)
Terminal Form GULL WING —
Number of Terminals 80 —
Temperature Grade Automotive —
Nível MSL [DATA_NEEDED: MSL level] —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
On-chip CAN Module MSCAN (CAN 2.0A/B) —
ADC 16-channel, 10-bit (per family) 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Module 8-channel 16-bit PWM —
Communication Peripherals SCI, SPI, IIC, BDLC —
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
Encapsulamento — 80-QFP (14 x 14 mm), also called PQFP-80
Tensão de alimentação — 2.5 V / 5 V
Number of I/O — 59
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Faixa de temperatura de operação — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação