MC9S12DT256MFUE vs MC9S12D64MFUER Vergleich

Detaillierter Direktvergleich von MC9S12DT256MFUE von NXP Semiconductors und MC9S12D64MFUER von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12DT256MFUE MC9S12D64MFUER
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $19,20 $1,05
Core Architecture HCS12 (CPU12), 16-bit CISC HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz —
Flash Memory 256 KB (256K x 8) —
RAM [DATA_NEEDED: RAM size] —
EEPROM [DATA_NEEDED: EEPROM size] —
Datenbusbreite 16-bit —
Operating Supply Voltage (Core) 2.35 V to 2.75 V —
I/O Supply Voltage 5V-tolerant I/O on VDDR/VSSR —
Number of I/O Pins 91 —
Package Type 80-QFP (PQFP/LQFP-80, 14x14 mm) —
Montageart Surface Mount Surface Mount (SMD/SMT)
Terminal Form GULL WING —
Number of Terminals 80 —
Temperature Grade Automotive —
MSL-Level [DATA_NEEDED: MSL level] —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
On-chip CAN Module MSCAN (CAN 2.0A/B) —
ADC 16-channel, 10-bit (per family) 2 x 10-bit, 8 channels each (16 ADC channels total)
PWM Module 8-channel 16-bit PWM —
Communication Peripherals SCI, SPI, IIC, BDLC —
CPU Core — S12 CPU V2
Operating Frequency — 25 MHz
Program Memory Type — Flash
Program Memory Size — 64 KB (64K x 8)
Gehäuse — 80-QFP (14 x 14 mm), also called PQFP-80
Versorgungsspannung — 2.5 V / 5 V
Number of I/O — 59
PWM Channels — 8 channels
Capture/Compare Timers — 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces — 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC
Betriebstemperaturbereich — -40 C to +125 C
Automotive Qualification — AEC-Q100
Packaging Method (tray / reel) — Tray
Approximate Weight — 0.033 oz (per supplier catalog)
Debug Interface — BDM (Background Debug Mode)
Watchdog / COP — Yes (COP reset, watchdog timer)

Datenblätter & Ressourcen

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