MC9S12DT256MPVE vs MC9S12DJ256MPVE Comparação

Comparação detalhada lado a lado de MC9S12DT256MPVE por NXP Semiconductors e MC9S12DJ256MPVE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd

Comparação de especificações

Parâmetro MC9S12DT256MPVE MC9S12DJ256MPVE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $14,36 $17,95
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz 25 MHz (some sources cite 50 MHz bus)
Program Memory (Flash) 256 KB —
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
Largura do barramento de dados 16-bit —
Tensão de alimentação 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V core; 5 V typical with on-chip regulator
I/O Pins 91 59 (some package variants expose 91)
ADC 2 x 10-bit, 8 channels each (16 channels total) Two 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
Encapsulamento 112-LQFP (20x20 mm) 112-LQFP (20x20 mm), gull-wing
Tipo de montagem Surface Mount Surface Mount
Temperatura de operação -40C to +125C (automotive grade) -40C to +125C (automotive AEC-Q100 grade)
Debug Interface Background Debug Mode (BDM) + JTAG —
Status RoHS Compliant Compliant (lead-free matte-tin finish)
Status do ciclo de vida NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core Architecture — HCS12 (16-bit CISC)
CPU Bit Width — 16-bit
Program Flash — 256 KB (256K x 8)
PWM Channels — 8-channel
Enhanced Capture Timer — 8-channel IC/OC
SCI (UART) Modules — 2 asynchronous
CAN Module — 1 x CAN 2.0 (per family datasheet)
SPI Module — 1 synchronous serial (per family)
Moisture Sensitivity Level — MSL 3 (per JEDEC J-STD-020)
Background Debug Mode — Yes (BDM)

Fichas técnicas e recursos

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