MPC5554MVR132 vs MPC5554AZP132 Comparação

Comparação detalhada lado a lado de MPC5554MVR132 por NXP Semiconductors e MPC5554AZP132 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

Comparação de especificações

Parâmetro MPC5554MVR132 MPC5554AZP132
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $27,25 $228,00
Core Architecture Power Architecture e200z6 Power Architecture e200z6
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
Encapsulamento 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-PBGA (TEPBGA-416), 27 x 27 mm
Tipo de montagem Surface Mount Surface Mount (BGA)
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
Faixa de temperatura de operação -40 C to +125 C (junction) [DATA_NEEDED: operating temperature range]
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
Status RoHS Compliant Compliant (lead-free PBGA)
Nível MSL 3 (per JEDEC J-STD-020) —
Core Bit Width — 32-bit
Maximum Core Frequency — 132 MHz
Program Memory (Flash) — 2 MB (2M x 8)
Ball Pitch — 1.0 mm
Lead-Free Status — Lead free (per package marking MS-034AAL-1)
Product Family — Qorivva MPC55xx
Lifecycle Stage — NRND (Not Recommended for New Designs)
Peripheral Integration — FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual)
Instruction Set — Power Architecture with VLE extension
Tensão de alimentação — [DATA_NEEDED: supply voltage range]
RAM Size — [DATA_NEEDED: on-chip SRAM size]

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