MPC5554MVR132 vs MPC5554AZP132 Vergleich
Detaillierter Direktvergleich von MPC5554MVR132 von NXP Semiconductors und MPC5554AZP132 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC5554AZP132 - 32-Bit 132MHz Power MCU, 2MB Flash, 416-PBGA | NXP
MPC5554AZP132 NrndSpezifikationsvergleich
| Parameter | MPC5554MVR132 | MPC5554AZP132 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,25 | $228,00 |
| Core Architecture | Power Architecture e200z6 | Power Architecture e200z6 |
| CPU Core | 32-bit, single-core | — |
| Maximum Operating Frequency | 132 MHz | — |
| Flash Memory Size | 2 MB (2M x 8) | — |
| SRAM Size | 64 KB | — |
| Instruction Cache / Data Cache | 64 KB unified | — |
| Gehäuse | 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) | 416-PBGA (TEPBGA-416), 27 x 27 mm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage range] | — |
| Supply Voltage (I/O) | 3.3 V (typical) | — |
| Betriebstemperaturbereich | -40 C to +125 C (junction) | [DATA_NEEDED: operating temperature range] |
| CAN Controllers | 2 x FlexCAN 2.0B, 64 message buffers each | — |
| ADC Channels | Up to 40 channels, 12-bit SAR | — |
| eTPU Channels | 64 channels (Enhanced Time Processing Unit) | — |
| DSPI Modules | 3 x DSPI (Deserial/Serial Peripheral Interface) | — |
| External Bus Interface | 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB | — |
| MMU / FPU | MMU present; FPU (single-precision) per e200z6 core | — |
| RoHS-Status | Compliant | Compliant (lead-free PBGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| Core Bit Width | — | 32-bit |
| Maximum Core Frequency | — | 132 MHz |
| Program Memory (Flash) | — | 2 MB (2M x 8) |
| Ball Pitch | — | 1.0 mm |
| Lead-Free Status | — | Lead free (per package marking MS-034AAL-1) |
| Product Family | — | Qorivva MPC55xx |
| Lifecycle Stage | — | NRND (Not Recommended for New Designs) |
| Peripheral Integration | — | FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual) |
| Instruction Set | — | Power Architecture with VLE extension |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| RAM Size | — | [DATA_NEEDED: on-chip SRAM size] |