MPC8313EVRAFFB vs MPC8313ECZQAFFB Comparação

Comparação detalhada lado a lado de MPC8313EVRAFFB por NXP Semiconductors e MPC8313ECZQAFFB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8313EVRAFFB MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB ✓ Ativo
NXP Semiconductors
MPC8313ECZQAFFB MPC8313ECZQAFFB - 333MHz PowerQUICC II Pro MPU | NXP

MPC8313ECZQAFFB - 333MHz PowerQUICC II Pro MPU | NXP

MPC8313ECZQAFFB ✓ Ativo

Comparação de especificações

Parâmetro MPC8313EVRAFFB MPC8313ECZQAFFB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $42,85 $28,40
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Part Status Active —
Core Architecture PowerPC e300c3 —
Processor Series MPC83xx (PowerQUICC II Pro) MPC83xx (PowerQUICC II Pro)
Core Count 1 —
Largura do barramento de dados 32-bit 32 bit
Maximum CPU Frequency 333 MHz —
Package Type 516-TEPBGA (27 mm x 27 mm) with exposed die pad —
Tipo de montagem Surface Mount (BGA) Surface Mount
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Encryption Engine Yes (AES, DES, 3DES, IPsec) —
Ethernet Controllers [DATA_NEEDED: ethernet port count and speed] —
Memory Controller DDR1/DDR2 (up to 256 MB addressable) DDR1 / DDR2 SDRAM
PCI Express [DATA_NEEDED: PCIe lane count] —
USB Interface [DATA_NEEDED: USB revision] —
RoHS Details per manufacturer (status not confirmed by web data snippet) —
Supplier Device Package 516-TEPBGA —
Core — PowerPC e300c3
Maximum Core Frequency — 333 MHz
Number of Cores — 1
Instruction Set Architecture — PowerPC
L1 Instruction Cache — [DATA_NEEDED: L1 I-cache size]
L1 Data Cache — [DATA_NEEDED: L1 D-cache size]
Security Engine — Yes (DES / 3DES / AES, public-key acceleration)
Ethernet Interfaces — 2x 10/100/1000 (RGMII + SGMII selectable)
USB — USB 2.0 Full/Low Speed
Operating Voltage (Core) — 1.0 V
I/O Voltage — 1.8 V / 2.5 V / 3.3 V (selectable)
Encapsulamento — 516-ball TE-PBGA (27x27 mm)
Temperatura de operação — -40C to +105C (extended industrial, per datasheet)
Status RoHS — Not RoHS (per one distributor listing)
Encryption Acceleration — Hardware IPsec / SSL assist

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação