MPC8360EVVAGDGA vs MPC8360VVAGDGA Comparação
Comparação detalhada lado a lado de MPC8360EVVAGDGA por NXP Semiconductors e MPC8360VVAGDGA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraComparação de especificações
| Parâmetro | MPC8360EVVAGDGA | MPC8360VVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Fim de vida |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Largura do barramento de dados | 32-bit | 32-bit |
| Frequência máxima de clock | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | 32-bit PCI v2.3 |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 1 x 10/100/1000 Mbps MAC (RGMII) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | 1 x USB 2.0 (host/device) |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Faixa de temperatura de operação | 0C to +105C (TA) | 0C to +105C |
| Encapsulamento | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| Status RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | MPC83xx (PowerQUICC II Pro) |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Tipo de montagem | Surface Mount (TBGA ball grid) | Surface Mount |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Core Architecture | — | PowerPC e300 (Power Architecture technology) |
| Core Frequency | — | 400 MHz |
| Core Supply Voltage (Vcore) | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 / 2.5 / 3.3 V |
| Memory Interface | — | DDR1 / DDR2 memory controller |
| Communications Engine | — | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | — | UART, I2C, SPI, TDM |
| Lead Free / RoHS | — | No-Pb (non-ENC, NO-PB variant per Mouser listing) |