MPC8547EVTAUJD vs MPC8547EVTATGD557 Comparação

Comparação detalhada lado a lado de MPC8547EVTAUJD por NXP Semiconductors e MPC8547EVTATGD557 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8547EVTAUJD MPC8547EVTAUJD - PowerQUICC III SoC, 1.333 GHz, 783-FCPBGA | NXP

MPC8547EVTAUJD - PowerQUICC III SoC, 1.333 GHz, 783-FCPBGA | NXP

MPC8547EVTAUJD ✓ Ativo
NXP Semiconductors
MPC8547EVTATGD557 MPC8547EVTATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD557 - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD557 ⚠ Última compra

Comparação de especificações

Parâmetro MPC8547EVTAUJD MPC8547EVTATGD557
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Última compra
Status do estoque In Stock In Stock
Preço unitário (USD) $118,40 $113,45
Manufacturer NXP Semiconductors —
Series / Family PowerQUICC III, MPC85xx (MPC8547E) —
Core Architecture Power Architecture e500, single core PowerPC e500, 32-bit, Book-E
Core Data Width 32-bit —
Maximum Core Frequency 1.333 GHz 1.2 GHz
Maximum System Bus Frequency 533 MHz —
Encapsulamento 783-ball FCPBGA, 29 mm x 29 mm 783-FCPBGA (29x29 mm)
Memory Controllers Dual DDR2 SDRAM, 64-bit, with ECC —
Ethernet Interfaces Up to 4 x Gigabit Ethernet (SGMII / RGMII) —
PCI Express 2 x PCI Express interfaces —
PCI-X 1 x PCI-X controller —
Serial RapidIO 2 x Serial RapidIO endpoints —
Security Engine SEC 3.3 (AES, 3DES, SHA, public-key) Integrated (encryption / hashing acceleration)
Local Bus 8/16/32-bit, supports NAND flash —
Junction Temperature Range 0 C to +105 C —
Silicon Revision R3.0 —
Process Node [DATA_NEEDED: process node] —
Typical Power [DATA_NEEDED: typical power dissipation] —
Status RoHS Compliant (lead-free FCPBGA) [DATA_NEEDED: RoHS status for /557 variant]
Family — PowerQUICC III (MPC85xx)
Number of Cores — 1
Tipo de montagem — Surface Mount
Temperatura de operação — -40C to +105C (industrial variant)
Memory Controller — 64-bit DDR2 with ECC support
Integrated Ethernet MACs — 4 x 10/100/1000 Mbps (SGMII, RGMII)
High-Speed Serial I/O — PCI Express, Serial RapidIO, SGMII
Legacy Peripheral I/O — I2C, SPI, UART, GPIO, timers
L1 Cache per Core — 32 KB instruction + 32 KB data
L2 Cache — Integrated on-die
Original Manufacturer — Freescale Semiconductor (now NXP)
Lead-Free — [DATA_NEEDED: lead-free status for /557 variant]
Tray Qty — [DATA_NEEDED: standard tray quantity]

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