MPC855TVR50D4 vs MPC860TZQ50D4-FR Comparação

Comparação detalhada lado a lado de MPC855TVR50D4 por NXP Semiconductors e MPC860TZQ50D4-FR por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC855TVR50D4 MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA

MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA

MPC855TVR50D4 Nrnd
NXP Semiconductors
MPC860TZQ50D4-FR MPC860TZQ50D4-FR - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TZQ50D4-FR - 50MHz PowerQUICC MPU 357-PBGA | NXP

MPC860TZQ50D4-FR Obsolete

Comparação de especificações

Parâmetro MPC855TVR50D4 MPC860TZQ50D4-FR
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $48,10 $78,75
Core Architecture Power Architecture (PowerPC) 32-bit, 1 core PowerPC 32-bit
Core Frequency 50 MHz —
Series PowerQUICC I (MPC8xx) MPC860 PowerQUICC
Integrated Peripherals CPM, ENET, ATM, HDLC, PCMCIA —
Cache Size 8 KB unified instruction/data —
Tensão de alimentação 2.0 V to 3.6 V —
Temperatura de operação 0 C to +95 C (commercial) [DATA_NEEDED: operating temperature range]
Encapsulamento 357-Ball PBGA (25x25 mm) 357-PBGA (25 mm x 25 mm)
Tipo de montagem Surface Mount (BGA) Surface Mount
Ethernet 10/100 Mbps (FCC/FEC) —
Memory Controller SDRAM, ROM, Flash, PCMCIA —
Core Marking Family MPC85xx —
Nível MSL 3 —
Status RoHS [DATA_NEEDED: RoHS compliance status] Non-Compliant
Lead-Free [DATA_NEEDED: lead-free status] —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Core Count — 1
Operating Frequency — 50 MHz
Supply Voltage (I/O) — 3.3 V
Instruction Cache — 4 Kbytes
Data Cache — 4 Kbytes
External Data Bus — 32-bit
Integrated Module — CPM (Communications Processor Module)
Serial Controllers — SCC, SMC, SPI, I2C, HDLC, UART, Ethernet
Lead Free Status — Contains Lead
Packaging — Tray
Status do ciclo de vida — Obsolete (End of Life per NXP product page)

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação