MPC855TVR50D4 vs MPC860TZQ50D4-FR Vergleich
Detaillierter Direktvergleich von MPC855TVR50D4 von NXP Semiconductors und MPC860TZQ50D4-FR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC855TVR50D4 | MPC860TZQ50D4-FR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,10 | $78,75 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | PowerPC 32-bit |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | MPC860 PowerQUICC |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | — |
| Cache Size | 8 KB unified instruction/data | — |
| Versorgungsspannung | 2.0 V to 3.6 V | — |
| Betriebstemperatur | 0 C to +95 C (commercial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 357-Ball PBGA (25x25 mm) | 357-PBGA (25 mm x 25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| MSL-Level | 3 | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Count | — | 1 |
| Operating Frequency | — | 50 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Instruction Cache | — | 4 Kbytes |
| Data Cache | — | 4 Kbytes |
| External Data Bus | — | 32-bit |
| Integrated Module | — | CPM (Communications Processor Module) |
| Serial Controllers | — | SCC, SMC, SPI, I2C, HDLC, UART, Ethernet |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | Obsolete (End of Life per NXP product page) |