MRF8S21100HSR3 vs MRF8P26080HSR3 Comparação

Comparação detalhada lado a lado de MRF8S21100HSR3 por NXP Semiconductors e MRF8P26080HSR3 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MRF8S21100HSR3 MRF8S21100HSR3 - 100W RF Power MOSFET, 2.11-2.17 GHz | NXP

MRF8S21100HSR3 - 100W RF Power MOSFET, 2.11-2.17 GHz | NXP

MRF8S21100HSR3 ✓ Ativo
NXP Semiconductors
MRF8P26080HSR3 MRF8P26080HSR3 - 14W, 2.6GHz W-CDMA/LTE RF Power MOSFET | NXP

MRF8P26080HSR3 - 14W, 2.6GHz W-CDMA/LTE RF Power MOSFET | NXP

MRF8P26080HSR3 ✓ Ativo

Comparação de especificações

Parâmetro MRF8S21100HSR3 MRF8P26080HSR3
Marca NXP Semiconductors NXP Semiconductors
Categoria MOSFETs MOSFETs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $65,00 $99,85
Tipo de transistor N-Channel Enhancement-Mode Lateral MOSFET N-Channel Enhancement-Mode Lateral MOSFET
Technology LDMOS (Laterally Diffused MOSFET) Gen8 LDMOS (Silicon, Lateral)
Drain-Source Voltage (V(BR)DSS) 65 V —
Operating Drain Voltage (VDD) 28 V nominal 28 V nominal
Frequency Range 2110 MHz to 2170 MHz 2500 MHz to 2700 MHz
Test Frequency 2.14 GHz —
Output Power (CW, typical) 100 W —
Average Output Power (W-CDMA) 24 W —
Power Gain (typ) 18.3 dB at 2.14 GHz —
Drain Current (ID, max) [DATA_NEEDED: max ID rating] —
Encapsulamento / Caixa NI-780S (Case 465A-06), 3-pin ceramic flange —
Configuration Single, push-pull N/A —
Tipo de montagem Chassis / flange mount, screw-down Through-hole flange-mount with screw attachment
Operating Class Class AB or Class C —
Application W-CDMA, LTE base-station power amplifiers —
Status RoHS Compliant (per NXP product family) —
Lead-Free Yes —
Average Output Power (P3dB) — 14 W (W-CDMA, single-carrier)
Peak Output Power (CW) — 80 W
Drain-Source Voltage (VDSS max) — 65 V
Test Mode — Typical Doherty Single-Carrier W-CDMA
Application Class — Class AB or Class C capable
Modulation Formats — W-CDMA, LTE, OFDM, multi-carrier
Encapsulamento — NI-780S-4 (ceramic, flange-mount, air-cavity)
Lead Finish — Gold-plated (NiPdAu)
Lead-Free / RoHS — Compliant
Faixa de temperatura de operação — -40C to +150C (junction)

Fichas técnicas e recursos

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