MSC8144ETVT800A vs MSC8157SVT1000A Comparação
Comparação detalhada lado a lado de MSC8144ETVT800A por NXP Semiconductors e MSC8157SVT1000A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteComparação de especificações
| Parâmetro | MSC8144ETVT800A | MSC8157SVT1000A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $195,50 | $198,40 |
| Core Architecture | SC3400 StarCore (4-core) | — |
| Number of Cores | 4 | — |
| Core Clock Rate | 800 MHz | — |
| On-Chip RAM | 10.5 MB | — |
| Non-Volatile Memory | External (NOR/NAND boot ROM) | — |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 3.30 V | — |
| Temperatura de operação | -40C to +105C | -40C to +105C |
| Operating Temperature Grade | Extended Industrial | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Encapsulamento | 783-FCBGA (29x29 mm) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 783 | — |
| Package Code | BGA / FCBGA | — |
| Package Shape | Square | — |
| Interfaces | Ethernet (UTOPIA), I2C, SPI, TDM, UART | — |
| Technology | High-performance multi-core DSP, SIMD | — |
| Status RoHS | [DATA_NEEDED: RoHS status not in web data] | Compliant |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Largura do barramento de dados | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tensão de alimentação | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Contagem de pinos | — | 783 |
| Lead Free | — | Yes |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |