MSC8144ETVT800A vs MSC8157SVT1000A Vergleich
Detaillierter Direktvergleich von MSC8144ETVT800A von NXP Semiconductors und MSC8157SVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoleteSpezifikationsvergleich
| Parameter | MSC8144ETVT800A | MSC8157SVT1000A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,50 | $198,40 |
| Core Architecture | SC3400 StarCore (4-core) | — |
| Number of Cores | 4 | — |
| Core Clock Rate | 800 MHz | — |
| On-Chip RAM | 10.5 MB | — |
| Non-Volatile Memory | External (NOR/NAND boot ROM) | — |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 3.30 V | — |
| Betriebstemperatur | -40C to +105C | -40C to +105C |
| Operating Temperature Grade | Extended Industrial | — |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse | 783-FCBGA (29x29 mm) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 783 | — |
| Package Code | BGA / FCBGA | — |
| Package Shape | Square | — |
| Interfaces | Ethernet (UTOPIA), I2C, SPI, TDM, UART | — |
| Technology | High-performance multi-core DSP, SIMD | — |
| RoHS-Status | [DATA_NEEDED: RoHS status not in web data] | Compliant |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Datenbusbreite | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Versorgungsspannung | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Pin-Anzahl | — | 783 |
| Lead Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |