P1011NXE2DFB vs P1011NSE2DFB Comparação

Comparação detalhada lado a lado de P1011NXE2DFB por NXP Semiconductors e P1011NSE2DFB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
P1011NXE2DFB P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB ✗ Fim de vida
NXP Semiconductors
P1011NSE2DFB P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB ✗ Fim de vida

Comparação de especificações

Parâmetro P1011NXE2DFB P1011NSE2DFB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $125,40 $27,50
Processor Type QorIQ P1 Communications Processor PowerPC e500v2
Core Architecture Power Architecture e500, 32-bit —
Maximum Core Frequency 533 MHz —
Platform Frequency 333 MHz —
Number of Cores 1 (single-core) —
L2 Cache [DATA_NEEDED: L2 cache size] 256 KB
Encapsulamento 689-TEPBGA II (31x31 mm) with exposed pad —
Ball Pitch 1.0 mm —
Temperatura de junção de operação -40C to +125C —
DDR Memory Controller 64-bit DDR2/DDR3 with ECC, up to 4 GB —
Ethernet 4x GbE MACs (SGMII/RGMII) 3x Gigabit Ethernet MACs
PCI Express 2x PCIe Gen 1.1 controllers —
USB 2x USB 2.0 (host + device) USB 2.0
Security Engine SEC 4.0 (IPSec/SSL/TLS acceleration) —
TDM Interface Yes (T1/E1) —
Silicon Revision 1.1 —
Process Technology 45 nm CMOS —
Status RoHS Compliant RoHS Compliant
Lead-Free Yes —
Nível MSL [DATA_NEEDED: MSL rating] —
Manufacturer — NXP Semiconductors
Series — QorIQ P1
Core Count — 1
Largura do barramento de dados — 32-Bit
Core Speed — 800 MHz
Core Speed (base) — 533 MHz (533/333/667 code)
Memory Controller — DDR2/DDR3 with ECC
PCIe — Yes (PCI Express)
TDM — Yes
Security Engine (SEC) — Yes
L1 Cache — 32 KB instruction + 32 KB data
Encapsulamento / Caixa — 689-TEPBGA II (31x31 mm) with exposed pad
Packaging — Tray
Temperatura de operação — 0 C to 125 C
Lead Free Status — Lead Free

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