RTAX4000DL-CQ352V vs RTAX4000SL-1CQ352B Comparação
Comparação detalhada lado a lado de RTAX4000DL-CQ352V por Microchip Technology e RTAX4000SL-1CQ352B por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
RTAX4000DL-CQ352V - 4M-Gate Radiation-Tolerant FPGA | Microchip
RTAX4000DL-CQ352V ✓ AtivoMicrochip Technology
RTAX4000SL-1CQ352B - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX4000SL-1CQ352B ✓ AtivoComparação de especificações
| Parâmetro | RTAX4000DL-CQ352V | RTAX4000SL-1CQ352B |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4.200,00 | $0,00 |
| Family | RTAX-S/SL and RTAX-DSP (RTAX-DSP) | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 4,000,000 | 4,000,000 gates |
| Logic Cells | 55,440 | 60,480 |
| CLB Organization | 36,960 CLBs | — |
| Process Technology | CMOS, antifuse (one-time programmable) | 0.15 um |
| Core Supply Voltage | 1.5 V nominal | 1.5 V |
| Temperatura de operação | -55C to +125C | — |
| Package Type | 352-terminal S-CQFP ceramic metal-sealed cofired flatpack (CQ352) | — |
| Package Dimensions | 48 mm x 48 mm, square, with guard ring | — |
| JEDEC-30 Package Code | S-CQFP | — |
| Radiation Tolerance Class | Radiation-tolerant (space-flight) | — |
| Configuration | Live at power up, single-chip | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| Routing Features | Segmentable clocks, chip-wide highway routing, carry logic | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Total User I/O | [DATA_NEEDED: total user I/O count] | — |
| CLBs (Clocked Logic Blocks) | — | 40,320 |
| Encapsulamento | — | 352-Pin CQFP (ceramic quad flat pack) |
| Speed Grade | — | -1 |
| Programming Technology | — | Anti-fuse, one-time programmable |
| Power-Up Behavior | — | Live at power-up (no external configuration device) |
| Clock Features | — | Segmentable clocks, chip-wide resources |
| Radiation Tolerance | — | Radiation-tolerant, for space flight systems |
| Base Architecture | — | Axcelerator (commercial) derived |
| Faixa de temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| I/O Voltage | — | [DATA_NEEDED: I/O bank voltage range] |