XC3S400-4FT256I vs XC3S400A-4FTG256C Comparação
Comparação detalhada lado a lado de XC3S400-4FT256I por Xilinx e XC3S400A-4FTG256C por AMD. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | XC3S400-4FT256I | XC3S400A-4FTG256C |
|---|---|---|
| Marca | Xilinx | AMD |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Última compra | Ativo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-3 | — |
| System Gates | 400,000 gates | 400,000 |
| Logic Cells | 8,064 logic cells | 8,064 |
| User I/O | 173 I/Os | — |
| Encapsulamento | 256-ball FTBGA | 256-FTBGA (FTG256), 17 × 17 mm |
| Package Type | Lead-free FTBGA | — |
| Número de pinos | 256 pins | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage | 1.14 V to 1.26 V | — |
| Nominal Core Voltage | 1.2 V | — |
| Performance Grade | -4 speed grade | — |
| Maximum Performance | 630 MHz | — |
| Temperatura de operação | 0 °C to 85 °C | 0°C to +85°C (commercial) |
| Temperature Grade | Industrial | — |
| Logic Resource Count | 192 logic blocks | — |
| Tipo de montagem | Surface mount | Surface Mount (BGA) |
| Lead-Free Status | Lead free | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pinout] | — |
| Family | — | Spartan-3A |
| Manufacturer | — | AMD (Xilinx) |
| Block RAM Bits | — | 368,640 |
| Block RAM Blocks | — | 20 (18 Kbit each) |
| User I/Os | — | 195 |
| Dedicated Multipliers | — | 4 (18 × 18-bit signed) |
| Digital Clock Managers (DCMs) | — | 4 |
| Speed/Grade | — | -4 (commercial) |
| Max Internal Clock | — | 770 MHz |
| Process | — | 90 nm CMOS |
| Configuration Modes | — | SPI, BPI, JTAG |