XC7Z100-2FF900I vs XC7Z100-1FF900I Comparação
Comparação detalhada lado a lado de XC7Z100-2FF900I por AMD e XC7Z100-1FF900I por AMD. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | XC7Z100-2FF900I | XC7Z100-1FF900I |
|---|---|---|
| Marca | AMD | AMD |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Device Type | Zynq-7000 Kintex-7 programmable system-on-chip | — |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | — |
| Processor Clock Rating | 800 MHz | — |
| FPGA Logic Cells | 444K logic cells | 444K logic cells |
| FPGA Family | Kintex-7 | — |
| Encapsulamento | 900-FCBGA, 31 mm x 31 mm | — |
| Package Pin Count | 900 pins | — |
| Device Speed Grade | -2 | — |
| Temperature Grade | Industrial | — |
| Tipo de montagem | Surface mount | Surface mount |
| Integrated Programmable Logic | 444K Kintex-7 logic cells | — |
| Debug Support | ARM CoreSight debug resources | — |
| Design Toolchain | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: minimum and maximum operating temperature] | [DATA_NEEDED: operating temperature range] |
| Number of High-Speed Transceivers | [DATA_NEEDED: transceiver count] | — |
| Maximum Transceiver Data Rate | [DATA_NEEDED: maximum transceiver data rate] | — |
| Programmable I/O Count | [DATA_NEEDED: programmable I/O count] | — |
| Memory Interface Details | [DATA_NEEDED: memory interface types and supported rates] | — |
| Power Supply Inputs | [DATA_NEEDED: supply rail names and voltage ranges] | — |
| Typical Power Consumption | [DATA_NEEDED: typical and maximum power consumption] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance declaration] | RoHS |
| REACH Status | [DATA_NEEDED: REACH compliance declaration] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free packaging declaration] | — |
| AEC-Q100 Qualification | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component | — |
| Package Thermal Resistance | [DATA_NEEDED: package thermal resistance] | — |
| Product Type | — | Zynq-7000 system on chip |
| Processor Configuration | — | Dual Arm Cortex-A9 MPCore |
| Processor Operating Frequency | — | 667 MHz |
| FPGA Architecture | — | Kintex-7 |
| Debug and Trace | — | CoreSight |
| Package Type | — | 900-FCBGA |
| Package Dimensions | — | 31 x 31 mm |
| Package Ball Count | — | 900 balls |
| Device Family | — | Zynq-7000 |
| Architecture | — | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Manufacturer Qualification | — | [DATA_NEEDED: industrial or automotive qualification] |