Robotiq 2FC Launch Adds Tactile Intelligence for Robotic Handling
Robotiq's production-ready 2FC combines tactile sensing, local AI and upgrade paths for existing 2F grippers, with shipping planned for the first quarter of 2027.
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MasterGaN7 expands 650V GaN design options for power-conversion BOMs
STMicroelectronics added 650V, 6A MasterGaN7 devices with integrated drivers, higher switching capability and package compatibility for power-conversion designs.
ESP-Mosaico AI Coding Could Reshape Microcontroller Prototyping
ESP-Mosaico combines an ESP32-S31 development platform with AI workflows that generate, deploy and test firmware on physical hardware.
Getac B360X refresh raises design-in questions for rugged notebook buyers
Getac launched the B360X and B360X Pro with AI processing, 14-inch displays and expanded connectivity, giving field-computing buyers a new rugged-platform option.
WD Fiscal Q1 2027 Results: Storage Capacity and Sourcing Implications
WD reported 55% revenue growth and higher margins for fiscal Q1 2027, signaling sustained storage demand that buyers should assess against capacity and lead-time plans. [S1]
Over-$500M Gears of War: E-Day budget report raises publisher risk questions
TechPowerUp relays an insider claim that Gears of War: E-Day cost over $500 million to produce, raising questions about revenue recovery and studio staffing.
What VinFast’s U.S. electric-bus plan means for fleet sourcing
VinFast plans a service-based U.S. electric-bus offering with NexMove, including charging, maintenance and operations, with certified deliveries expected in 2028.
SAMA S32 WOOD bundles bring compact cases and 650 W or 850 W ATX 3.1 PSUs to US buyers
SAMA is offering the S32 WOOD compact microATX case with 650 W or 850 W 80 Plus Gold power supplies through Amazon US and Newegg US.
Micron 245TB SSD density reshapes data-center storage planning
Micron’s 245TB QLC SSD targets warm-tier workloads, but buyers must validate network throughput, cooling, indirection, workload fit, and availability.
·3 min de leitura
NVIDIA books substrate, packaging and test capacity across Amkor, KYEC, SPIL and others: what it means for AI build-out lead times
NVIDIA pairs with seven partners to lift substrate output 2.5x, Amkor interposer wafer capacity over 300%, and double test capacity by 2027; ramps run into 2028.
ESP32-S3 Internet Radio Design Uses WiFi, OLED and Class-D Audio
A compact desktop internet radio combines an ESP32-S3, 1.3-inch OLED, rotary encoder and MAX98357 amplifier, offering a reference design for connected-audio products.
·3 min de leitura
CapMetro deployment puts Camber pantograph charging on two Rapid bus routes
Two all-electric Austin bus routes now use Camber Charging systems, including 2.9 MW of depot capacity and overhead charging at both terminals.
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