10AX022C4U19E3SG - Arria 10 GX FPGA, 220K LE, 484-BGA | Intel
N.º da peça: 10AX022C4U19E3SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1250 | $1.250,00 |
| 10 | $1180 | $11.800,00 |
| 100 | $1050 | $105.000,00 |
| 500 | $920 | $460.000,00 |
| 1.000 | $850 | $850.000,00 |
10AX022C4U19E3SG Visão geral
What is a mid-range FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose digital logic is configured after manufacturing through a bitstream written to internal SRAM-based configuration memory. Within the FPGA taxonomy, the Arria 10 family belongs to the mid-range transceivers category: between Cyclone low-cost parts and Stratix high-end parts. Arria 10 GX specifically adds integrated multi-gigabit transceivers (up to 14.1 Gbps) and hardened PCIe Gen3 / Gen4 IP blocks, distinguishing it from the Arria 10 GT (telemetry) and Arria 10 SX (SoC with ARM cores) variants.
Key features include 8,033 Logic Array Blocks / Configurable Logic Blocks (LABs/CLBs), 156 embedded 18x19 multipliers, 1,560 embedded M20K memory blocks, and 24 transceivers with integrated signal conditioning. The FC-UFBGA 484 package supports high-density board integration while the industrial-grade 0 to 100 C junction temperature range suits controlled-environment industrial and communications equipment.
Technical architecture: the 20 nm process enables low static and dynamic power through hard IP for memory controllers, PCIe, and signal conditioning. Hardened transceivers reduce soft-IP LUT consumption, freeing programmable fabric for application logic. Adaptive logic modules (ALMs) provide 8-input fracturable look-up tables with dedicated adders, supporting efficient DSP and control-plane operations.
Typical applications include 10G/40G Ethernet aggregation switches, wireless baseband processing, broadcast video processing, medical imaging accelerator cards, and ASIC prototyping. The integrated PCIe Gen3 hard IP makes the device attractive for accelerator and adapter-card designs where host interface latency matters.
When designing with this part, plan the power tree for the 0.9 V core rail with strict sequencing relative to the 1.8 V and 2.5 V auxiliary rails. Use the Quartus Prime design suite (Standard or Pro edition) for synthesis, place-and-route, and bitstream generation; the device is fully supported in the Arria 10 device family library.
This page synthesizes distributor pricing, package-level drop-in alternatives, and PCB-layout guidance not found in the manufacturer datasheet alone - complementing the device handbook with practical sourcing intelligence.
Alternativas drop-in para 10AX022C4U19E3SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AX022C4U19E3SG (mesmo formato e footprint) — diferindo em Family, Logic Elements, Operating Temperature, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AX022C4U19E3LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AX022C4U19I3SG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AX022C4U19E2SG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AX022C4U19E3ES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10CX220YF672E5G
✅ Drop-In✓ Em estoque
$342 / unidade
Ver ficha técnica →10AX022C4U19E3SG Classificações máximas e características elétricas
| Family | Arria 10 GX |
| Logic Elements | 220000 |
| Number of LABs/CLBs | 80330 |
| Total RAM Bits | 13752320 |
| Number of I/O | 240 |
| Number of Gates | Not specified by manufacturer |
| Voltage - Supply | 0.87 V to 0.98 V |
| Process Technology | 20 nm |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to 100 C (TJ) |
| Encapsulamento | 484-FBGA / 484-Pin FC-UFBGA |
| Package Type Code | U19 |
| Status RoHS | Compliant |
| Series | Arria 10 GX |
| Part Status | Active |
Guia de Configuração de Pinos do 10AX022C4U19E3SG u19
Configuração de pinos para 10AX022C4U19E3SG (pacote u19). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AX022C4U19E3SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AX022C4U19E3SG é adequado para 6 aplicaçãos: 10G/40G Ethernet Aggregation Switch, Wireless Baseband Processing, Broadcast Video Processing and Conversion, Medical Imaging Accelerator Card, ASIC Prototyping and Emulation, Industrial Test and Measurement Equipment.
10G/40G Ethernet Aggregation Switch
The 10AX022C4U19E3SG's 24 integrated multi-gigabit transceivers (up to 14.1 Gbps per lane) and hardened PCIe Gen3 IP make it a strong fit for 10G/40G Ethernet aggregation switches. The 220K logic elements provide ample headroom for L2/L3 forwarding tables, ACLs, and queuing logic, while the 1.6 MB of on-chip M20K memory absorbs burst traffic without external DRAM access. Placed as the line-card FPGA between PHY devices and the switch ASIC, it handles port aggregation, statistics counters, and OAM processing; designers can leverage the Arria 10 transceiver toolkit in Quartus Prime to validate link margin before tape-out.
Recomendado
Wireless Baseband Processing
The 10AX022C4U19E3SG's combination of 156 embedded 18x19 multipliers and hardened CPRI/OBSAI transceiver support positions it well for wireless baseband processing in LTE and 5G NR fronthaul applications. The 20 nm process delivers the DSP throughput needed for channel estimation, FFT/iFFT, and turbo decoding while keeping dynamic power below mid-range FPGAs in higher nodes. With up to 14.1 Gbps transceivers the device can support CPRI line rates up to option 7 (9.8 Gbps), enabling 4T4R or 8T8R radio chains on a single FPGA.
Recomendado
Broadcast Video Processing and Conversion
The 10AX022C4U19E3SG's high logic density and embedded memory bandwidth suit broadcast video processing workflows including SDI/HDMI bridging, up/down/cross-conversion, and color-space transforms. The 240 user I/O pins support multi-channel SDI (SD/HD/3G/6G/12G-SDI) ingest and output, while 13.75 Mbit embedded memory provides line buffering for scaling and deinterlacing. Designers can integrate the IP for SMPTE ST 425 / ST 2082 and HDMI 2.0 directly in Quartus Prime, with the Arria 10 hard memory controllers managing external DDR4 frame buffers.
Recomendado
Medical Imaging Accelerator Card
The 10AX022C4U19E3SG's PCIe Gen3 x8 hard IP and DSP capability make it attractive for medical imaging accelerator cards (reconstruction, filtering, AI inference) installed in hospital imaging workstations. The 1.6 MB on-chip memory plus external DDR4 controller accelerates CT/MRI back-projection and convolutional layers, while the 0.9 V core supply keeps card power within PCIe slot limits. The hardened PCIe Gen3 endpoint reduces latency versus soft IP, critical for real-time image streaming at 30+ fps.
Recomendado
ASIC Prototyping and Emulation
The 10AX022C4U19E3SG, with its 220K logic elements and 13.75 Mbit embedded memory, can host large SoC ASIC prototypes and pre-silicon verification models. Multi-FPGA partitioning tools in Quartus Prime can split a target ASIC across several Arria 10 devices with deterministic time-division multiplexing between chips. This use case benefits from the FC-UFBGA 484 package's high signal integrity for multi-FPGA debug boards running at 200+ MHz with thousands of cut traces.
Recomendado
Industrial Test and Measurement Equipment
The 10AX022C4U19E3SG's combination of 240 user I/O, transceiver channels, and DSP blocks enables compact PXIe / LXI test instruments for semiconductor ATE, RF signal analysis, and protocol analyzers. The 0 to 100 C junction temperature and surface-mount 484-FBGA package suit chassis-mounted instruments with controlled airflow, while the PCIe hard IP enables Gen3 host connectivity for high-throughput data upload to the test executive PC. Quartus Prime DSP Builder accelerates FFT/spectral-analysis IP integration.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AX022C4U19E3SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AX022C4U19E3LG | 10AX022C4U19I3SG | 10AX022C4U19E2SG | 10AX022C4U19E3ES | 10CX220YF672E5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (U19) | 484-FBGA (U19) | 484-FBGA (U19) | 484-FBGA (U19) | 484-FBGA (U19) | 484-FBGA (U19) |
| Logic Elements | 220000 | 220000 | 220000 | 220000 | 220000 | 220000 |
| Speed Grade | E3 | E3 | E3 | E2 | E3 | E5 |
| Operating Temperature (TJ) | 0 C to 100 C | 0 C to 100 C | 0 C to 100 C | 0 C to 100 C | 0 C to 100 C | 0 C to 100 C |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Integrated 14.1 Gbps transceivers with hardened PCIe Gen3 IP (vs 10CX220YF672E5G (Cyclone 10 GX))
- Lead-free packaging variant on the same die (vs 10AX022C4U19E3LG (lead-free variant))
- Speed grade flexibility within the same package (vs 10AX022C4U19E2SG (speed grade E2))
- Industrial temperature variant available (vs 10AX022C4U19I3SG (industrial))
- 20 nm process node enables low dynamic power (vs 10AX022E4F27E3SG (672-pin F27 package))
Notas de projeto
The Arria 10 core supply must be sequenced relative to the 1.8 V and 2.5 V auxiliary rails per the device handbook. Use a dedicated power management IC such as the LTC2956 or EN6347QI with PG (power-good) feedback to ensure monotonic ramp; violating the sequence can latch up I/O buffers. Decouple each rail with a 1 uF + 0.1 uF + 10 nF capacitor stack placed within 5 mm of each BGA supply ball.
The 484-FBGA package requires microvia (laser-drilled) stack-up on the PCB. Use a 1-2-1 or 1-3-1 stack-up with 0.4 mm pitch BGA escape routing on the top layer, then fan out to inner layers through blind vias. Maintain a continuous ground plane beneath the BGA to control return-path impedance for the multi-gigabit transceivers; impedance-controlled traces must follow the Intel pin-out guide with 85 ohm differential routing for transceiver pairs.
Estimated: with all 24 transceivers active at 14.1 Gbps and ~50% logic toggle rate, the FPGA can dissipate 12-18 W. The 484-FBGA junction-to-ambient thermal resistance is approximately 12 C/W with a 4-layer JEDEC test board, implying a 144-216 C junction rise over 25 C ambient without airflow. Attach a heatsink with thermal interface material or use 200 LFM forced-air cooling for production deployments to keep TJ below 100 C.
Do not configure unused transceiver channels as GPIO - this causes internal pull-down conflicts. Always bind unbonded I/O to logic high in the Quartus Prime pin planner. Verify the configuration mode (AS x4, JTAG, or FPP x8) matches your board's boot memory; mismatches are the most common cause of 'FPGA does not configure after POR' failures in the field.
Multi-gigabit transceiver channels require strict length-matching within a transceiver bank: 14 Gbps links typically need <0.1 mm length tolerance between P and N of a differential pair and <1.5 mm tolerance across lanes of a multi-lane link. Use the Arria 10 transceiver toolkit in Quartus Prime to validate link margin before PCB fabrication; pre-emphasis and equalization settings should be validated against your specific channel loss budget.
Informações de conformidade
RoHS compliant per manufacturer product page. AEC-Q100 not applicable for FPGAs (FPGAs do not carry automotive-grade qualification unless explicitly marketed; consult Intel automotive-grade Arria 10 OPNs separately). REACH, halogen-free, and conflict-minerals status not specified in the verified distributor data.
