10CX220YF672E5G - Cyclone 10 GX 220K LE FPGA | Intel | 672-FBGA
MPN: 10CX220YF672E5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $421 | $42,100.00 |
| 500 | $378 | $189,000.00 |
| 1,000 | $342 | $342,000.00 |
Drop-in alternatives for 10CX220YF672E5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX150YF672E5G
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →10CX105YF672E5G
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →10CX085YF672E5G
✅ Drop-In✓ In Stock
$289 / Unit
View Datasheet →10CX220YF672E5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 LE |
| Adaptive Logic Modules (ALMs) | 80,330 ALM |
| Embedded Memory | 11.46 Mbit |
| MLAB Memory | 5.7 Mbit |
| Number of I/Os | 236 I/O |
| DSP Blocks (18x19 Multipliers) | 48 |
| Transceivers | Up to 12.5 Gbps |
| Hard Memory Controllers | 4 (DDR3/DDR4/LPDDR3) |
| PCIe Hard IP | Gen2 x4 |
| Process Technology | 20 nm |
| Package | 672-ball FBGA (F672) |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 27 mm x 27 mm |
| Operating Temperature | 0 C to +100 C (industrial extended) |
| Speed Grade | 5 (E5G - mid-speed, industrial) |
| Mounting Type | Surface Mount |
| Configuration Modes | AS x4, FPP x8, JTAG |
| RoHS Status | Compliant |
10CX220YF672E5G 27 mm x 27 mm Pin Configuration Guide
Complete pinout information for 10CX220YF672E5G (27 mm x 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF672E5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF672E5G is suitable for 7 applications: Industrial Machine Vision Frame Grabber, Broadcast Video Protocol Bridging, PCI Express Endpoint Add-In Card, Industrial Motor Control and Servo Drive, Wireless Backhaul and Small Cell Baseband, Medical Imaging Signal Processing, Test and Measurement Instrumentation.
Industrial Machine Vision Frame Grabber
The 10CX220YF672E5G suits industrial machine vision frame grabbers because its 220,000 logic elements support Camera Link HS and CoaXPress video decoding pipelines while 11.46 Mbit embedded memory buffers image lines before DMA transfer. The PCIe Gen2 x4 hard IP provides up to 2 GB/s host throughput without consuming FPGA fabric. Designers place the FPGA on a PCIe x4 card with the F672 672-ball FBGA package enabling co-layout of 4 transceiver channels for multi-camera aggregation. Compared to a soft-IP PCIe implementation, the hardened blocks free approximately 15-20K LE for application-specific image processing. Industrial vision systems benefit from the 0 C to +100 C operating range supporting factory floor enclosures.
Recommended
Broadcast Video Protocol Bridging
The 10CX220YF672E5G fits broadcast video protocol bridging between SDI, HDMI, and DisplayPort because its 12.5 Gbps transceivers handle SDI 6G and 12G rates natively while the 220K LE fabric supports color-space conversion and audio de-embedding. The 80,330 ALMs allow parallel processing of 4K video streams at 60 fps without timing closure issues. Designers place the FPGA between source and display with HDMI 2.0 transmitters downstream. The F672 footprint supports 8 transceiver channels enabling multi-port SDI routing matrices. Compared to ASSP video processors, the FPGA architecture allows firmware-level protocol updates for emerging broadcast standards without PCB redesign.
Recommended
PCI Express Endpoint Add-In Card
The 10CX220YF672E5G targets PCIe Gen2 x4 endpoint add-in cards because the hard PCIe blocks deliver up to 2 GB/s throughput without soft-logic overhead. Its 220K LE count supports data acquisition preprocessing, custom DMA engines, and on-card buffering in 11.46 Mbit embedded memory. Designers integrate the FPGA on standard PCIe x4 form factor cards with the F672 672-ball FBGA co-located to the edge connector for optimal signal integrity. The 12.5 Gbps transceivers enable simultaneous PCIe and SATA or 10GbE connectivity on a single card. Compared to discrete PCIe controller solutions, the FPGA consolidation reduces BOM cost by 40-60% for multi-protocol cards.
Recommended
Industrial Motor Control and Servo Drive
The 10CX220YF672E5G serves industrial motor control and servo drive applications because its 48 18x19 DSP blocks execute multiple field-oriented control (FOC) loops concurrently while 236 user I/Os support multi-axis encoder feedback and PWM generation. The 20 nm process delivers low static power suitable for continuous-operation factory equipment. Designers implement torque, speed, and position loops in the FPGA fabric with sub-microsecond control periods. The F672 package provides adequate I/O for 4-axis servo drives with encoder interfaces. Compared to microcontroller-based servo controllers, the FPGA parallel architecture enables higher switching frequencies (up to 100 kHz) reducing motor audible noise.
Recommended
Wireless Backhaul and Small Cell Baseband
The 10CX220YF672E5G supports wireless backhaul and small cell baseband processing because its 12.5 Gbps transceivers handle CPRI rates up to option 6 while 220K LE fabric implements PHY-layer functions and 48 DSP blocks accelerate FFT/iFFT and channel estimation. The PCIe Gen2 hard IP connects to baseband SoCs for higher-layer processing. The 1.0 mm BGA pitch enables compact outdoor radio unit form factors. Compared to ASIC-based small cell solutions, the FPGA architecture allows protocol updates for 5G NR migration without hardware replacement. The 0 C to +100 C industrial temperature grade supports outdoor deployment in weatherized enclosures.
Recommended
Medical Imaging Signal Processing
The 10CX220YF672E5G fits medical imaging signal processing applications such as ultrasound beamforming and endoscopy because its 220K LE fabric supports parallel processing of multiple transducer channels while 48 DSP blocks execute FFT and matched-filter operations for image reconstruction. The 11.46 Mbit embedded memory buffers raw RF sample data before beamforming. Designers place the FPGA on PCIe imaging cards with the F672 footprint accommodating full ultrasound channel counts. Compared to GPU-based image processing, the FPGA deterministic latency eliminates real-time variability critical for diagnostic equipment. The industrial temperature range supports medical cart and bedside equipment deployments.
Recommended
Test and Measurement Instrumentation
The 10CX220YF672E5G targets test and measurement instrumentation including protocol analyzers, logic analyzers, and arbitrary waveform generators because its 12.5 Gbps transceivers capture and generate high-speed serial data while 220K LE fabric implements protocol-aware analysis logic. The 11.46 Mbit embedded memory buffers captured traces before host transfer. Designers place the FPGA on instrument mainboards with the F672 footprint supporting multi-channel probe interfaces. Compared to ASIC-based T&M equipment, the FPGA flexibility allows firmware-only support for new protocols as standards evolve. The industrial temperature grade supports benchtop and portable instrument form factors in laboratory environments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF672E5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YF672E5G | 10CX105YF672E5G | 10CX085YF672E5G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 672-ball FBGA (F672) | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same |
| Logic Elements | 220,000 LE | 150,000 LE (-31.8%) | 105,000 LE (-52.3%) | 85,000 LE (-61.4%) |
| Embedded Memory | 11.46 Mbit | 7.65 Mbit (-33%) | 5.51 Mbit (-52%) | 4.45 Mbit (-61%) |
| User I/Os | 236 I/O | 236 I/O (same) | 236 I/O (same) | 236 I/O (same) |
| PCIe Hard IP | Gen2 x4 | Gen2 x4 (same) | Gen2 x4 (same) | Gen2 x2 |
| Transceivers | Up to 12.5 Gbps | Up to 12.5 Gbps (same) | Up to 12.5 Gbps (same) | Up to 6.144 Gbps |
| Speed Grade | E5G (speed grade 5) | E5G (same) | E5G (same) | E5G (same) |
Key Differentiators
- Highest logic density in the F672 672-ball FBGA package (vs 10CX150YF672E5G)
- Maximum transceiver count at 220K LE density (vs 10CX085YF672E5G)
- PCIe Gen2 x4 versus PCIe Gen2 x2 in lower-density variants (vs 10CX085YF672E5G)
Design Notes
The 672-ball FBGA package uses 1.0 mm ball pitch, requiring via-in-pad (VIP) or dog-bone fanout on the PCB. For transceiver signal integrity, use a 4-1-4 stackup with the inner stripline layers dedicated to Gbps-rate channels. Estimated: with standard FR4 (Dk=4.2), 50 ohm single-ended trace width is approximately 6 mils on a 4 mil dielectric. Allocate at least 4 PCB layers for power distribution to keep core supply impedance below 1 milliohm at 100 MHz.
Estimated: at typical industrial workloads with 4 active transceivers at 10 Gbps and 60% logic utilization, the 10CX220YF672E5G dissipates approximately 4-6 W. The F672 package has junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with a properly designed 4-layer PCB thermal pad pattern. For sealed enclosures without airflow, derate by 30% or add a heatsink attached to the package top. Use Intel's Early Power Estimator (EPE) tool for design-specific power analysis before PCB commitment.
The 10CX220YF672E5G requires multiple supply rails: core (VCC = 0.9V), transceiver (VCCH_GXB = 1.0-1.1V), auxiliary (VCCAUX = 1.8V), and I/O (VCCIO = 1.2V-3.3V depending on bank). Per the Intel Cyclone 10 GX pin connection guidelines, place a minimum of 24 decoupling capacitors (0.1 uF X7R) within 100 mils of the package balls, plus bulk capacitors (22 uF) on each rail. Sequence power rails according to the datasheet power-up sequencing requirements to avoid latch-up damage.
Compliance Information
RoHS and REACH compliant per Intel product declaration. Industrial extended temperature grade (0 C to +100 C). Halogen-free per Intel product roadmap. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade part.
