10AX090S1F45E1SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel / Altera
N.º da peça: 10AX090S1F45E1SG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9947.84 | $9.947,84 |
| 10 | $9550 | $95.500,00 |
| 100 | $8990 | $899.000,00 |
| 500 | $8550 | $4.275.000,00 |
| 1.000 | $8200 | $8.200.000,00 |
10AX090S1F45E1SG Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor IC whose digital logic and routing are configured by the customer after manufacture, rather than fixed at fabrication. FPGAs sit within a hierarchy of programmable logic: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> system-on-chip (SoC) FPGA. The Arria 10 family occupies the mid-range node between Cyclone (low-power) and Stratix (high-performance) families, optimized for transceiver-rich, signal-processing workloads.
Key features include 28.05 Gbps transceivers, hardened floating-point DSP blocks, a 1.5 GHz core fabric via the Adaptive Logic Module, partial reconfiguration, and up to 24 transceiver channels at 14.1 Gbps. The -1 speed grade provides a balanced trade-off between performance and power versus the -2 and -3 grades.
Technically, the Arria 10 architecture combines a 20 nm process node with an enhanced core fabric and dedicated PCI Express Gen3 and DDR4 memory controller hard IP, eliminating soft IP overhead. The device integrates transceivers, variable-precision DSP, and on-chip memory to support 400G optical transport, radar processing, and ASIC prototyping.
Typical applications include 100G/400G optical transport line cards, military radar and electronic warfare systems, medical imaging accelerators, 4K/8K video broadcast infrastructure, and high-performance compute ASIC prototyping. The 1932-FCBGA package supports demanding signal-integrity layouts for high-speed serial links.
When designing with the 10AX090S1F45E1SG, ensure multi-layer PCB stack-up with low-loss dielectrics for 25 Gbps+ signals. Provide at least six independent power rails (VCC, VCCPT, VCCBAT, VCCA_PLL, VCCIO, VCC_HSSI) with proper decoupling per the Intel pin connection guidelines. JTAG and Active Serial configuration schemes must both be supported in the board design for design flexibility.
Alternativas drop-in para 10AX090S1F45E1SG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AX090S1F45E1SG (mesmo formato e footprint) — diferindo em Package, Speed Grade, DSP Blocks, Process Node, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AX090S2F45E2SG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2050 / unidade
Ver ficha técnica →10AX090S3F45E3SG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AX090N2F45E2SG
✅ Drop-In✓ Em estoque
$4943.22 / unidade
Ver ficha técnica →10AX090S1F45E1SG Classificações máximas e características elétricas
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| User I/Os | 624 |
| Encapsulamento | 1932-BBGA, FCBGA |
| Speed Grade | -1 |
| Transceiver Data Rate (max) | 28.05 Gbps |
| Process Node | 20 nm |
| Hardened PCI Express Gen3 | Yes |
| Hardened DDR4 Controller | Yes |
| Supply Voltage (Core) | 0.85 V (typ) |
| Configuration Mode | JTAG / Active Serial / Active Parallel |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10AX090S1F45E1SG 1932-bbga, fcbga
Configuração de pinos para 10AX090S1F45E1SG (pacote 1932-bbga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AX090S1F45E1SG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AX090S1F45E1SG é adequado para 6 aplicaçãos: 100G/400G Optical Transport Line Card, Military Radar and Electronic Warfare, Medical Imaging Accelerator, 4K/8K Video Broadcast Infrastructure, ASIC Prototyping and Emulation, Industrial Automation and Machine Vision.
100G/400G Optical Transport Line Card
The 10AX090S1F45E1SG fits 100G/400G optical transport line cards because its 28.05 Gbps transceivers support OTU4 and 100GbE with deterministic jitter. Its hardened PCS/PMA blocks offload 8x 25 Gbps lanes while leaving 900K LEs for MAC framing, FEC, and traffic management. In a typical CFP2-DCO module or router line card, the device interfaces with optical modules via CAUI-4 and runs OTN framing, monitoring, and hitless protection switching in fabric.
Recomendado
Military Radar and Electronic Warfare
For radar and EW systems, the 10AX090S1F45E1SG provides 900K LEs plus variable-precision DSP blocks running beamforming, pulse compression, and FFT processing on wide-bandwidth IF streams. The hardened DDR4 controllers handle high-rate ADC capture buffers, while transceivers digitize antenna arrays at multi-Gsps sample rates. Per the Arria 10 DSP architecture, this device delivers floating-point performance per watt that supports SWaP-constrained platform designs.
Recomendado
Medical Imaging Accelerator
In CT and MRI image reconstruction, the 10AX090S1F45E1SG accelerates back-projection, filtered back-projection (FBP), and iterative reconstruction algorithms. Its 900K LEs and 59 Mbits of on-chip memory tile large data working sets, eliminating off-chip access latency. DSP blocks at 1.5 GHz enable parallel arithmetic with deterministic latency required for medical certification paths under IEC 62304. Per Arria 10 documentation, the floating-point DSP achieves up to 1.5 TFLOPs per device.
Recomendado
4K/8K Video Broadcast Infrastructure
The 10AX090S1F45E1SG supports 4K/8K broadcast infrastructure by handling 12G-SDI aggregation, HDR/WCG processing, and HEVC proxy decode within fabric. Its transceers receive SDI and SMPTE 2110 IP video streams, while the 900K LEs run multi-channel color-space conversion, scaling, and overlay composition. The DDR4 controllers feed uncompressed video frame buffers, and the device meets the bandwidth needs of single- and multi-camera live production workflows at 60 fps.
Recomendado
ASIC Prototyping and Emulation
The 10AX090S1F45E1SG functions as a single-FPGA ASIC prototype platform for designs up to 5-10 million gates. Quartus Prime synthesis and TimeQuest timing closure tools support RTL bring-up, while the device's 624 user I/Os and high-speed transceivers permit full-chip I/O validation. Multi-FPGA partitioning is straightforward with hardened PCI Express Gen3 and 100G Ethernet IP cores, enabling prototyping of complex SoCs and ASIC designs.
Recomendado
Industrial Automation and Machine Vision
In industrial machine vision, the 10AX090S1F45E1SG delivers deterministic latency for multi-camera inspection lines processing 4K+ image streams. Transceivers aggregate CoaXPress or 10 GigE Vision cameras while LEs run defect detection CNN inference at the edge. The hardened DDR4 controllers and variable-precision DSP enable real-time processing within factory cycle budgets. Per Intel's industrial IoT guidance, the device suits harsh-environment deployments with industrial-grade variants.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AX090S1F45E1SG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AX090S2F45E2SG | 10AX090S3F45E3SG | 10AX090N2F45E2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| User I/Os | 624 | 624 | 624 | 624 |
| Speed Grade | -1 | -2 | -3 | -2 |
| Transceiver Max Data Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 12.5 Gbps (Arria 10 GT base) |
| Sub-Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GT |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm |
Principais diferenciais
- Mid-tier speed grade balances performance and power (vs 10AX090S3F45E3SG)
- Arria 10 GX variant with hardened Gen3 PCIe and DDR4 controllers (vs 10AX090N2F45E2SG)
- Same 900K LE density and 1932-FCBGA package across all speed grades (vs 10AX090R2F40E2SG)
Notas de projeto
The 1932-FCBGA package requires a multi-layer PCB stack-up with controlled-impedance routing for 28.05 Gbps transceivers. Use low-loss dielectric (Df < 0.005) for high-speed serial layers, and provide 100-ohm differential pairs for transceivers and 50-ohm single-ended for general I/O. Pin escape requires microvia-in-pad (VIP) or laser-drilled microvias due to 1.0 mm ball pitch. Ensure full ground reference plane beneath BGA field for signal integrity and thermal dissipation.
The 10AX090S1F45E1SG requires multiple power rails per the Intel Arria 10 Hardware Reference: VCC (core, 0.85 V typical), VCCPT (1.0 V), VCCBAT (battery backup for AES key retention), VCCA_PLL (1.5-2.5 V depending on PLL configuration), VCCIO (1.2-3.0 V bank-dependent), and VCC_HSSI (1.0-1.2 V for transceivers). Decoupling must follow the Intel pin connection guidelines, with high-frequency ceramic capacitors placed as close to the BGA balls as possible. Power sequencing requires VCC before VCCIO before VCC_HSSI.
Do not confuse the S1 (speed grade -1) suffix with the S3 (speed grade -3) suffix when sourcing. -3 grade parts achieve higher Fmax but consume more power and have tighter timing margins. Verify the OPN matches your Quartus Prime pin assignment file before PCB assembly. Also confirm configuration mode (JTAG, Active Serial AS, Active Parallel AP) is supported in your board design, as missing configuration hardware is a common prototype failure mode.
Estimated: At full utilization (900K LE + 28 Gbps transceivers), the device may dissipate 25-30 W. The 1932-FCBGA package requires substantial PCB thermal relief: a thermal pad array under the BGA connected to inner copper planes, with thermal vias (0.3 mm drill, 1.0 mm pitch). Without proper thermal management, junction temperature can exceed 100 C and trigger silicon thermal shutdown. Refer to Intel AN 745 for thermal modeling guidance.
Informações de conformidade
RoHS and REACH compliant per Intel/Altera environmental compliance documentation. AEC-Q100 not applicable (FPGA is not automotive-qualified by default; check Intel automotive program for qualified variants).