10AX090S1F45E1SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel / Altera
MPN: 10AX090S1F45E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9947.84 | $9,947.84 |
| 10 | $9550 | $95,500.00 |
| 100 | $8990 | $899,000.00 |
| 500 | $8550 | $4,275,000.00 |
| 1,000 | $8200 | $8,200,000.00 |
Drop-in alternatives for 10AX090S1F45E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S2F45E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2050 / Unit
View Datasheet →10AX090S3F45E3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX090N2F45E2SG
✅ Drop-In✓ In Stock
$4943.22 / Unit
View Datasheet →10AX090S1F45E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| User I/Os | 624 |
| Package | 1932-BBGA, FCBGA |
| Speed Grade | -1 |
| Transceiver Data Rate (max) | 28.05 Gbps |
| Process Node | 20 nm |
| Hardened PCI Express Gen3 | Yes |
| Hardened DDR4 Controller | Yes |
| Supply Voltage (Core) | 0.85 V (typ) |
| Configuration Mode | JTAG / Active Serial / Active Parallel |
| RoHS Status | Compliant |
10AX090S1F45E1SG 1932-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090S1F45E1SG (1932-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S1F45E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S1F45E1SG is suitable for 6 applications: 100G/400G Optical Transport Line Card, Military Radar and Electronic Warfare, Medical Imaging Accelerator, 4K/8K Video Broadcast Infrastructure, ASIC Prototyping and Emulation, Industrial Automation and Machine Vision.
100G/400G Optical Transport Line Card
The 10AX090S1F45E1SG fits 100G/400G optical transport line cards because its 28.05 Gbps transceivers support OTU4 and 100GbE with deterministic jitter. Its hardened PCS/PMA blocks offload 8x 25 Gbps lanes while leaving 900K LEs for MAC framing, FEC, and traffic management. In a typical CFP2-DCO module or router line card, the device interfaces with optical modules via CAUI-4 and runs OTN framing, monitoring, and hitless protection switching in fabric.
Recommended
Military Radar and Electronic Warfare
For radar and EW systems, the 10AX090S1F45E1SG provides 900K LEs plus variable-precision DSP blocks running beamforming, pulse compression, and FFT processing on wide-bandwidth IF streams. The hardened DDR4 controllers handle high-rate ADC capture buffers, while transceivers digitize antenna arrays at multi-Gsps sample rates. Per the Arria 10 DSP architecture, this device delivers floating-point performance per watt that supports SWaP-constrained platform designs.
Recommended
Medical Imaging Accelerator
In CT and MRI image reconstruction, the 10AX090S1F45E1SG accelerates back-projection, filtered back-projection (FBP), and iterative reconstruction algorithms. Its 900K LEs and 59 Mbits of on-chip memory tile large data working sets, eliminating off-chip access latency. DSP blocks at 1.5 GHz enable parallel arithmetic with deterministic latency required for medical certification paths under IEC 62304. Per Arria 10 documentation, the floating-point DSP achieves up to 1.5 TFLOPs per device.
Recommended
4K/8K Video Broadcast Infrastructure
The 10AX090S1F45E1SG supports 4K/8K broadcast infrastructure by handling 12G-SDI aggregation, HDR/WCG processing, and HEVC proxy decode within fabric. Its transceers receive SDI and SMPTE 2110 IP video streams, while the 900K LEs run multi-channel color-space conversion, scaling, and overlay composition. The DDR4 controllers feed uncompressed video frame buffers, and the device meets the bandwidth needs of single- and multi-camera live production workflows at 60 fps.
Recommended
ASIC Prototyping and Emulation
The 10AX090S1F45E1SG functions as a single-FPGA ASIC prototype platform for designs up to 5-10 million gates. Quartus Prime synthesis and TimeQuest timing closure tools support RTL bring-up, while the device's 624 user I/Os and high-speed transceivers permit full-chip I/O validation. Multi-FPGA partitioning is straightforward with hardened PCI Express Gen3 and 100G Ethernet IP cores, enabling prototyping of complex SoCs and ASIC designs.
Recommended
Industrial Automation and Machine Vision
In industrial machine vision, the 10AX090S1F45E1SG delivers deterministic latency for multi-camera inspection lines processing 4K+ image streams. Transceivers aggregate CoaXPress or 10 GigE Vision cameras while LEs run defect detection CNN inference at the edge. The hardened DDR4 controllers and variable-precision DSP enable real-time processing within factory cycle budgets. Per Intel's industrial IoT guidance, the device suits harsh-environment deployments with industrial-grade variants.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S1F45E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45E2SG | 10AX090S3F45E3SG | 10AX090N2F45E2SG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory Bits | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| User I/Os | 624 | 624 | 624 | 624 |
| Speed Grade | -1 | -2 | -3 | -2 |
| Transceiver Max Data Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 12.5 Gbps (Arria 10 GT base) |
| Sub-Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GT |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Mid-tier speed grade balances performance and power (vs 10AX090S3F45E3SG)
- Arria 10 GX variant with hardened Gen3 PCIe and DDR4 controllers (vs 10AX090N2F45E2SG)
- Same 900K LE density and 1932-FCBGA package across all speed grades (vs 10AX090R2F40E2SG)
Design Notes
The 1932-FCBGA package requires a multi-layer PCB stack-up with controlled-impedance routing for 28.05 Gbps transceivers. Use low-loss dielectric (Df < 0.005) for high-speed serial layers, and provide 100-ohm differential pairs for transceivers and 50-ohm single-ended for general I/O. Pin escape requires microvia-in-pad (VIP) or laser-drilled microvias due to 1.0 mm ball pitch. Ensure full ground reference plane beneath BGA field for signal integrity and thermal dissipation.
The 10AX090S1F45E1SG requires multiple power rails per the Intel Arria 10 Hardware Reference: VCC (core, 0.85 V typical), VCCPT (1.0 V), VCCBAT (battery backup for AES key retention), VCCA_PLL (1.5-2.5 V depending on PLL configuration), VCCIO (1.2-3.0 V bank-dependent), and VCC_HSSI (1.0-1.2 V for transceivers). Decoupling must follow the Intel pin connection guidelines, with high-frequency ceramic capacitors placed as close to the BGA balls as possible. Power sequencing requires VCC before VCCIO before VCC_HSSI.
Do not confuse the S1 (speed grade -1) suffix with the S3 (speed grade -3) suffix when sourcing. -3 grade parts achieve higher Fmax but consume more power and have tighter timing margins. Verify the OPN matches your Quartus Prime pin assignment file before PCB assembly. Also confirm configuration mode (JTAG, Active Serial AS, Active Parallel AP) is supported in your board design, as missing configuration hardware is a common prototype failure mode.
Estimated: At full utilization (900K LE + 28 Gbps transceivers), the device may dissipate 25-30 W. The 1932-FCBGA package requires substantial PCB thermal relief: a thermal pad array under the BGA connected to inner copper planes, with thermal vias (0.3 mm drill, 1.0 mm pitch). Without proper thermal management, junction temperature can exceed 100 C and trigger silicon thermal shutdown. Refer to Intel AN 745 for thermal modeling guidance.
Compliance Information
RoHS and REACH compliant per Intel/Altera environmental compliance documentation. AEC-Q100 not applicable (FPGA is not automotive-qualified by default; check Intel automotive program for qualified variants).
