10CL016YU484C8G - Cyclone 10 LP FPGA, 15K LE, 484-UBGA | Intel
N.º da peça: 10CL016YU484C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85.5 | $855,00 |
| 100 | $76 | $7.600,00 |
| 500 | $68.4 | $34.200,00 |
| 1.000 | $60.8 | $60.800,00 |
10CL016YU484C8G Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows hardware designers to implement arbitrary digital logic, including complex state machines, DSP blocks, memory controllers, and high-speed serial interfaces. Within the broader semiconductor taxonomy, the 10CL016 sits as a programmable logic device under the FPGA category, itself a sibling to CPLDs (Complex Programmable Logic Devices) and ASICs. The Cyclone 10 LP family sits below Cyclone IV/V and above MAX series CPLDs in Intel's programmable logic portfolio.
The 10CL016YU484C8G integrates 56 embedded 18x18 multipliers, four general-purpose PLLs for clock management, and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks. Its 1.0 V core voltage combined with on-chip voltage regulation enables low static power consumption. The device is configured via industry-standard JTAG (IEEE 1149.1) or Active Serial (AS) configuration schemes using commodity flash memories.
Typical applications include industrial motor control, video bridging and image processing, low-cost software-defined radio front-ends, machine vision interfaces, and consumer electronics requiring custom glue logic. The 340 user I/Os make the 484-UBGA variant well-suited to high-pin-count parallel buses and parallel RGB video capture pipelines.
Design consideration: the UBGA-484 package requires a 4-layer PCB minimum with via-in-pad recommended for the 0.8 mm pitch BGA; signal integrity for LVDS pairs demands 100 ohm differential impedance and matched trace lengths within 20 mils. Designers migrating from Cyclone IV should consult the Intel port-and-migration guide to reuse existing Quartus Prime designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, package-compatible UBGA-484 variants, and practical design notes not consolidated in any single manufacturer or distributor resource.
Alternativas drop-in para 10CL016YU484C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL016YU484C8G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Core Voltage, PLLs.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL016YU484I7G
✅ Drop-In✓ Em estoque
$55.27 / unidade
Ver ficha técnica →10CL016YU484C6G
✅ Drop-In✓ Em estoque
$47.9 / unidade
Ver ficha técnica →10CL016YU484A7G
✅ Drop-In✓ Em estoque
$43.88 / unidade
Ver ficha técnica →10CL016YF484I7G
✅ Drop-In✓ Em estoque
$21.5 / unidade
Ver ficha técnica →10CL016YF484C8G
✅ Drop-In✓ Em estoque
$20.75 / unidade
Ver ficha técnica →10CL016YU484C8G Classificações máximas e características elétricas
| Family | Cyclone 10 LP |
| Series | 10CL016 |
| Logic Elements | 15,408 |
| Embedded Memory | 504 Kbits |
| Embedded 18x18 Multipliers | 56 |
| General Purpose PLLs | 4 |
| Maximum User I/O | 340 |
| I/O Banks | 8 |
| Core Voltage | 1.0 V (with on-chip regulator) |
| Process Technology | 60 nm low-power |
| Encapsulamento | 484-pin UBGA (U484) |
| Pitch | 0.8 mm |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration Method | JTAG / Active Serial (AS) |
| Status RoHS | Compliant |
Configuração de pinos do 10CL016YU484C8G
| Pino A1 | I/O — User I/O (bank 1A) |
| Pino A2 | I/O — User I/O (bank 1A) |
| Pino A3 | VCCIO — I/O supply bank 1A |
| Pino B1 | I/O — User I/O (bank 1A) |
| Pino B2 | I/O — User I/O (bank 1A) |
| Pino B3 | I/O — User I/O (bank 1A) |
| Pino C1 | I/O — User I/O (bank 1B) |
| Pino C2 | GND — Ground |
| Pino C3 | I/O — User I/O (bank 1B) |
| Pino D1 | I/O — User I/O (bank 1B) |
| Pino D2 | I/O — User I/O (bank 1B) |
| Pino D3 | VCCIO — I/O supply bank 1B |
| Pino E1 | I/O — User I/O (bank 2) |
| Pino E2 | I/O — User I/O (bank 2) |
| Pino E3 | I/O — User I/O (bank 2) |
| Pino F1 | GND — Ground |
| Pino F2 | I/O — User I/O (bank 2) |
| Pino F3 | I/O — User I/O (bank 2) |
| Pino G1 | I/O — User I/O (bank 3) |
| Pino G2 | VCCIO — I/O supply bank 3 |
| Pino G3 | I/O — User I/O (bank 3) |
| Pino H1 | I/O — User I/O (bank 3) |
| Pino H2 | I/O — User I/O (bank 3) |
| Pino H3 | I/O — User I/O (bank 3) |
| Pino J1 | I/O — User I/O (bank 4) |
| Pino J2 | GND — Ground |
| Pino J3 | I/O — User I/O (bank 4) |
| Pino K1 | I/O — User I/O (bank 4) |
| Pino K2 | I/O — User I/O (bank 4) |
| Pino K3 | VCCINT — Core voltage 1.0V |
Aplicações típicas
10CL016YU484C8G é adequado para 6 aplicaçãos: Industrial Motor Control and Drive, Video Bridging and Image Processing, Low-Cost Software Defined Radio Front End, Parallel Bus Expansion and Glue Logic Replacement, Machine Vision and Industrial Inspection, Custom Consumer Electronics and Edge Devices.
Industrial Motor Control and Drive
The 10CL016YU484C8G is well suited for industrial motor-control applications where deterministic PWM generation, encoder feedback decoding, and field-oriented control (FOC) loops are required. The 56 embedded 18x18 multipliers handle Park/Clarke transforms and PI controllers in hardware-software co-design, while 4 PLLs generate jitter-free PWM carrier frequencies up to the speed-grade 8 Fmax. The 484-pin UBGA exposes up to 340 user I/Os, enough for multi-axis control plus isolated communication (RS-485, CAN, UART).
Recomendado
Video Bridging and Image Processing
Parallel RGB/CMOS image-sensor bridging is a strong fit for the 10CL016YU484C8G thanks to its 340 available user I/Os. Designers can ingest 24-bit parallel video at 1080p60 using LVCMOS 1.8V/2.5V/3.3V banks, perform pixel-level preprocessing (white balance, gamma, scaling) in fabric logic, and output via BT.656 or LVDS. The 504 Kbits of embedded memory serve as line buffers without external SRAM.
Recomendado
Low-Cost Software Defined Radio Front End
The 10CL016YU484C8G is used as baseband processing for narrow-band SDR receivers in the HF/VHF range. With 15,408 LEs the device can implement digital down-conversion, FIR filtering, and demodulation (FM/AM/SSB) in real time. The 56 hardware multipliers accelerate polyphase filter banks; 4 PLLs derive low-jitter ADC sampling clocks. The commercial grade C8 spec is adequate for indoor lab and consumer ham-radio applications.
Recomendado
Parallel Bus Expansion and Glue Logic Replacement
Designers migrating legacy 5V TTL or CMOS glue-logic boards often consolidate discrete 74-series logic into a single FPGA. The 10CL016YU484C8G provides 340 I/Os for multi-bus consolidation (ISA, SRAM, parallel NOR/NAND, multiplexed address/data), plus JTAG for board-test access. Its 504 Kbits of embedded RAM substitute small FIFOs and register files without external memory, saving PCB area and BOM cost.
Recomendado
Machine Vision and Industrial Inspection
In-line machine vision systems require deterministic line-scan or area-scan processing at conveyor speeds. The 10CL016YU484C8G runs custom histogram, threshold, and edge-detection pipelines on 8- to 16-bit pixel data, while 340 I/Os interface to multiple area-scan sensors and GigE Vision trigger lines. The 484-pin package handles sensor data plus Camera Link integration; speed-grade 8 suits typical 100-MHz pixel clocks.
Recomendado
Custom Consumer Electronics and Edge Devices
Low-cost Cyclone 10 LP variants power custom consumer hubs, smart appliances, and edge AI preprocessors. The 10CL016YU484C8G with 15K LEs hosts simple classifier or keyword-spotting models, USB 2.0 device stacks (via ULPI interface), and multi-touch button scanning. The commercial temperature grade covers indoor consumer deployments; industrial variants extend range for outdoor smart-city cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL016YU484C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL016YU484I7G | 10CL016YU484C6G | 10CL016YU484A7G | 10CL016YF484I7G | 10CL016YF484C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U484) | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-ball FBGA (F484) - different ball, same pattern | 484-ball FBGA (F484) - different ball, same pattern |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Maximum User I/O | 340 | 340 | 340 | 340 | 340 | 340 |
| Speed Grade | 8 | 7 (faster) | 6 (fastest) | 7 (faster) | 7 (faster) | 8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive AEC-Q100 | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Embedded Memory (Kbits) | 504 | 504 | 504 | 504 | 504 | 504 |
Principais diferenciais
- Commercial-grade C8 in U484 with low power consumption (vs 10CL040YF484I7G)
- Same U484 footprint as industrial I7G drop-in alternative (vs 10CL016YU484I7G)
- Long lifecycle commitment through 2030 (vs Cyclone IV EP4CE15F484)
Notas de projeto
The 484-pin UBGA package uses a 0.8 mm ball pitch and requires a 4-layer PCB minimum with the substrate ground plane on layer 2 directly under the BGA. Use via-in-pad (VIP) with 0.2 mm laser-drilled vias and filled/capped plating to route inner-row balls; without VIP, fan-out to inner balls costs significant signal-routing area. Estimated: standard 1 oz copper on outer layers and 0.5 oz on inner power/ground planes.
Decouple every VCCIO bank with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package ball, plus a 10 uF bulk capacitor per bank group. VCCINT (1.0 V core) requires a low-ESR decoupling network of three 4.7 uF X5R plus five 0.1 uF capacitors within 10 mm. Use a 4-layer PCB with a continuous ground plane to keep the high-frequency decoupling loop area minimal.
Do not confuse U484 UBGA (Ultra FineLine BGA) with F484 FBGA (FineLine BGA). The U484 uses 0.8 mm pitch lead-free tin balls; the F484 is a similar pitch but different substrate ball metallurgy. Intel community discussions note that F484 and U484 are usually pin-compatible at the PCB layout level but verify against the package symbol before substitution. Always check the Intel device pin-out file (.qsf) in Quartus Prime 18.1+ before committing to layout.
For LVDS output, place 100 ohm differential termination resistors within 7 mm of the FPGA receiver ball. Match intra-pair trace lengths within 5 mils and inter-pair skew within 20 mils to maintain eye opening at >500 Mbps. Use series-impedance calculation: differential impedance = 2*(Z0 - delta) where Z0 is the controlled-impedance target on your stack-up. Estimated: 50 ohm single-ended trace requires 4-5 mil width on 0.5 oz copper with FR-4 dielectric.
Informações de conformidade
RoHS compliant per Intel product substance declaration. Lead-free BGA balls (Sn). Halogen-free per JEDEC JS709B. Not AEC-Q100 qualified; choose 10CL016YU484A7G for automotive applications.
