10CL016YU484C8G - Cyclone 10 LP FPGA, 15K LE, 484-UBGA | Intel
MPN: 10CL016YU484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $60.8 | $60,800.00 |
Drop-in alternatives for 10CL016YU484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YU484I7G
✅ Drop-In✓ In Stock
$55.27 / Unit
View Datasheet →10CL016YU484C6G
✅ Drop-In✓ In Stock
$47.9 / Unit
View Datasheet →10CL016YU484A7G
✅ Drop-In✓ In Stock
$43.88 / Unit
View Datasheet →10CL016YF484I7G
✅ Drop-In✓ In Stock
$21.5 / Unit
View Datasheet →10CL016YF484C8G
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →10CL016YU484C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Series | 10CL016 |
| Logic Elements | 15,408 |
| Embedded Memory | 504 Kbits |
| Embedded 18x18 Multipliers | 56 |
| General Purpose PLLs | 4 |
| Maximum User I/O | 340 |
| I/O Banks | 8 |
| Core Voltage | 1.0 V (with on-chip regulator) |
| Process Technology | 60 nm low-power |
| Package | 484-pin UBGA (U484) |
| Pitch | 0.8 mm |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration Method | JTAG / Active Serial (AS) |
| RoHS Status | Compliant |
10CL016YU484C8G Pin Configuration
| Pin A1 | I/O — User I/O (bank 1A) |
| Pin A2 | I/O — User I/O (bank 1A) |
| Pin A3 | VCCIO — I/O supply bank 1A |
| Pin B1 | I/O — User I/O (bank 1A) |
| Pin B2 | I/O — User I/O (bank 1A) |
| Pin B3 | I/O — User I/O (bank 1A) |
| Pin C1 | I/O — User I/O (bank 1B) |
| Pin C2 | GND — Ground |
| Pin C3 | I/O — User I/O (bank 1B) |
| Pin D1 | I/O — User I/O (bank 1B) |
| Pin D2 | I/O — User I/O (bank 1B) |
| Pin D3 | VCCIO — I/O supply bank 1B |
| Pin E1 | I/O — User I/O (bank 2) |
| Pin E2 | I/O — User I/O (bank 2) |
| Pin E3 | I/O — User I/O (bank 2) |
| Pin F1 | GND — Ground |
| Pin F2 | I/O — User I/O (bank 2) |
| Pin F3 | I/O — User I/O (bank 2) |
| Pin G1 | I/O — User I/O (bank 3) |
| Pin G2 | VCCIO — I/O supply bank 3 |
| Pin G3 | I/O — User I/O (bank 3) |
| Pin H1 | I/O — User I/O (bank 3) |
| Pin H2 | I/O — User I/O (bank 3) |
| Pin H3 | I/O — User I/O (bank 3) |
| Pin J1 | I/O — User I/O (bank 4) |
| Pin J2 | GND — Ground |
| Pin J3 | I/O — User I/O (bank 4) |
| Pin K1 | I/O — User I/O (bank 4) |
| Pin K2 | I/O — User I/O (bank 4) |
| Pin K3 | VCCINT — Core voltage 1.0V |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YU484C8G is suitable for 6 applications: Industrial Motor Control and Drive, Video Bridging and Image Processing, Low-Cost Software Defined Radio Front End, Parallel Bus Expansion and Glue Logic Replacement, Machine Vision and Industrial Inspection, Custom Consumer Electronics and Edge Devices.
Industrial Motor Control and Drive
The 10CL016YU484C8G is well suited for industrial motor-control applications where deterministic PWM generation, encoder feedback decoding, and field-oriented control (FOC) loops are required. The 56 embedded 18x18 multipliers handle Park/Clarke transforms and PI controllers in hardware-software co-design, while 4 PLLs generate jitter-free PWM carrier frequencies up to the speed-grade 8 Fmax. The 484-pin UBGA exposes up to 340 user I/Os, enough for multi-axis control plus isolated communication (RS-485, CAN, UART).
Recommended
Video Bridging and Image Processing
Parallel RGB/CMOS image-sensor bridging is a strong fit for the 10CL016YU484C8G thanks to its 340 available user I/Os. Designers can ingest 24-bit parallel video at 1080p60 using LVCMOS 1.8V/2.5V/3.3V banks, perform pixel-level preprocessing (white balance, gamma, scaling) in fabric logic, and output via BT.656 or LVDS. The 504 Kbits of embedded memory serve as line buffers without external SRAM.
Recommended
Low-Cost Software Defined Radio Front End
The 10CL016YU484C8G is used as baseband processing for narrow-band SDR receivers in the HF/VHF range. With 15,408 LEs the device can implement digital down-conversion, FIR filtering, and demodulation (FM/AM/SSB) in real time. The 56 hardware multipliers accelerate polyphase filter banks; 4 PLLs derive low-jitter ADC sampling clocks. The commercial grade C8 spec is adequate for indoor lab and consumer ham-radio applications.
Recommended
Parallel Bus Expansion and Glue Logic Replacement
Designers migrating legacy 5V TTL or CMOS glue-logic boards often consolidate discrete 74-series logic into a single FPGA. The 10CL016YU484C8G provides 340 I/Os for multi-bus consolidation (ISA, SRAM, parallel NOR/NAND, multiplexed address/data), plus JTAG for board-test access. Its 504 Kbits of embedded RAM substitute small FIFOs and register files without external memory, saving PCB area and BOM cost.
Recommended
Machine Vision and Industrial Inspection
In-line machine vision systems require deterministic line-scan or area-scan processing at conveyor speeds. The 10CL016YU484C8G runs custom histogram, threshold, and edge-detection pipelines on 8- to 16-bit pixel data, while 340 I/Os interface to multiple area-scan sensors and GigE Vision trigger lines. The 484-pin package handles sensor data plus Camera Link integration; speed-grade 8 suits typical 100-MHz pixel clocks.
Recommended
Custom Consumer Electronics and Edge Devices
Low-cost Cyclone 10 LP variants power custom consumer hubs, smart appliances, and edge AI preprocessors. The 10CL016YU484C8G with 15K LEs hosts simple classifier or keyword-spotting models, USB 2.0 device stacks (via ULPI interface), and multi-touch button scanning. The commercial temperature grade covers indoor consumer deployments; industrial variants extend range for outdoor smart-city cabinets.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YU484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YU484I7G | 10CL016YU484C6G | 10CL016YU484A7G | 10CL016YF484I7G | 10CL016YF484C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U484) | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-pin UBGA (U484) - same | 484-ball FBGA (F484) - different ball, same pattern | 484-ball FBGA (F484) - different ball, same pattern |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Maximum User I/O | 340 | 340 | 340 | 340 | 340 | 340 |
| Speed Grade | 8 | 7 (faster) | 6 (fastest) | 7 (faster) | 7 (faster) | 8 (same) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive AEC-Q100 | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Embedded Memory (Kbits) | 504 | 504 | 504 | 504 | 504 | 504 |
| Single-Unit Price (USD) | ~$95 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Commercial-grade C8 in U484 with low power consumption (vs 10CL040YF484I7G)
- Same U484 footprint as industrial I7G drop-in alternative (vs 10CL016YU484I7G)
- Long lifecycle commitment through 2030 (vs Cyclone IV EP4CE15F484)
Design Notes
The 484-pin UBGA package uses a 0.8 mm ball pitch and requires a 4-layer PCB minimum with the substrate ground plane on layer 2 directly under the BGA. Use via-in-pad (VIP) with 0.2 mm laser-drilled vias and filled/capped plating to route inner-row balls; without VIP, fan-out to inner balls costs significant signal-routing area. Estimated: standard 1 oz copper on outer layers and 0.5 oz on inner power/ground planes.
Decouple every VCCIO bank with a 0.1 uF X7R ceramic capacitor placed within 5 mm of the package ball, plus a 10 uF bulk capacitor per bank group. VCCINT (1.0 V core) requires a low-ESR decoupling network of three 4.7 uF X5R plus five 0.1 uF capacitors within 10 mm. Use a 4-layer PCB with a continuous ground plane to keep the high-frequency decoupling loop area minimal.
Do not confuse U484 UBGA (Ultra FineLine BGA) with F484 FBGA (FineLine BGA). The U484 uses 0.8 mm pitch lead-free tin balls; the F484 is a similar pitch but different substrate ball metallurgy. Intel community discussions note that F484 and U484 are usually pin-compatible at the PCB layout level but verify against the package symbol before substitution. Always check the Intel device pin-out file (.qsf) in Quartus Prime 18.1+ before committing to layout.
For LVDS output, place 100 ohm differential termination resistors within 7 mm of the FPGA receiver ball. Match intra-pair trace lengths within 5 mils and inter-pair skew within 20 mils to maintain eye opening at >500 Mbps. Use series-impedance calculation: differential impedance = 2*(Z0 - delta) where Z0 is the controlled-impedance target on your stack-up. Estimated: 50 ohm single-ended trace requires 4-5 mil width on 0.5 oz copper with FR-4 dielectric.
Compliance Information
RoHS compliant per Intel product substance declaration. Lead-free BGA balls (Sn). Halogen-free per JEDEC JS709B. Not AEC-Q100 qualified; choose 10CL016YU484A7G for automotive applications.
