10CL120YF484I7G - 120K LE Cyclone 10 LP FPGA, 484-FBGA | Intel
N.º da peça: 10CL120YF484I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $86.62 | $86,62 |
| 10 | $79.5 | $795,00 |
| 100 | $68.2 | $6.820,00 |
| 500 | $58.4 | $29.200,00 |
| 1.000 | $49.75 | $49.750,00 |
10CL120YF484I7G Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader hierarchy of integrated circuits > digital ICs > programmable logic. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that can be reconfigured by the end user. Within Intel's portfolio, the Cyclone series sits below Cyclone IV/V in the legacy low-cost tier and above MAX series CPLDs in density, designed for applications that balance logic capacity, power, and BOM cost. FPGAs typically bridge the gap between microcontroller-class fixed architectures and high-end ASICs, offering hardware-level parallelism for DSP, glue logic, and interface bridging.
Key features of the 10CL120YF484I7G include 119,088 logic elements, 3,981,312 bits (approximately 3.8 Mbit) of embedded SRAM, embedded 18x18 multipliers, and a wide range of high-speed serial and parallel I/O standards including LVDS, LVCMOS, SSTL, and LVTTL. The device integrates hard memory controllers and supports external memory interfaces such as DDR2/DDR3. Quartus Prime software provides synthesis, place-and-route, and timing analysis with extensive IP library support.
Typical applications include industrial motor control, video processing pipelines, LED display controllers, factory automation I/O expansion, machine vision pre-processing, and protocol bridging (PCIe, Ethernet, UART). The F484 package is the second-largest in the Cyclone 10 LP family, providing maximum user I/O for high-pin-count designs. When designing with this device, allocate sufficient PCB layer count (typically 6+ layers) for BGA breakout and signal integrity on high-speed interfaces. Use the Intel PowerPlay early power estimator and follow AN 711 guidelines for thermal management. Reference designs in the Cyclone 10 LP development kit accelerate board bring-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para 10CL120YF484I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL120YF484I7G (mesmo formato e footprint) — diferindo em Speed Grade, Operating Temperature, Process Technology, Package, Core Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL120YF484C8G
✅ Drop-In✓ Em estoque
$71.1 / unidade
Ver ficha técnica →10CL120YF484I8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10CL080YF484I7G
✅ Drop-In✓ Em estoque
$71.95 / unidade
Ver ficha técnica →10CL080YF484C8G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.65 / unidade
Ver ficha técnica →10CL055YF484I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$46.09 / unidade
Ver ficha técnica →10CL055YF484C8G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$56.85 / unidade
Ver ficha técnica →10CL040YF484I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$29.74 / unidade
Ver ficha técnica →10CL120YF484I7G Classificações máximas e características elétricas
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 119,088 |
| Embedded Memory (bits) | 3,981,312 |
| User I/O Count | 277 |
| I/O Banks | 8 |
| Package Type | 484-ball FBGA (F484) |
| Process Technology | 60 nm low-power CMOS |
| Temperatura de operação | -40C to +100C (Industrial, I7G) |
| Speed Grade | -7 |
| Supply Voltage (Core) | 1.0 V to 1.2 V (nominal) |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), JTAG |
| Embedded Multipliers (18x18) | 288 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 |
| Status RoHS | Compliant |
Configuração de pinos do 10CL120YF484I7G
| Pino A1 | I/O — General purpose user I/O (bank 1A) |
| Pino B2 | I/O — General purpose user I/O (bank 1A) |
| Pino C3 | VCCIO_1A — I/O bank 1A supply voltage |
| Pino D4 | GND — Ground |
| Pino E5 | I/O — General purpose user I/O (bank 2A) |
| Pino F6 | VCCINT — Core supply voltage (1.0-1.2 V) |
| Pino G7 | I/O — General purpose user I/O (bank 3A) |
| Pino H8 | MSEL0 — Configuration mode select 0 |
| Pino J9 | MSEL1 — Configuration mode select 1 |
| Pino K10 | MSEL2 — Configuration mode select 2 |
| Pino L11 | nCE — Chip enable (active low) |
| Pino M12 | nCONFIG — Configuration control (active low) |
| Pino N13 | CONF_DONE — Configuration done status |
| Pino P14 | nSTATUS — Configuration status (active low) |
| Pino R15 | TCK — JTAG clock |
| Pino T16 | TMS — JTAG mode select |
| Pino U17 | TDI — JTAG data in |
| Pino V18 | TDO — JTAG data out |
| Pino W19 | I/O — General purpose user I/O (bank 4A) |
| Pino Y20 | I/O — General purpose user I/O (bank 4A) |
Aplicações típicas
10CL120YF484I7G é adequado para 7 aplicaçãos: Industrial Motor Control, Video Processing Pipelines, Industrial IoT Gateway, LED Display Controllers, Test and Measurement Equipment, Automotive Infotainment & ADAS Pre-Processing, 5G Small Cell Baseband.
Industrial Motor Control
The 10CL120YF484I7G's 119,088 logic elements and 277 user I/O pins support multi-axis servo drive control loops with encoder feedback. The four PLLs generate precise PWM carrier frequencies up to several hundred kHz, while 288 embedded 18x18 multipliers implement real-time FOC (field-oriented control) math. Its industrial -40C to +100C operating range and low static power suit factory-floor installations, with F484 FBGA providing enough I/O for parallel resolver/encoder interfaces.
Recomendado
Video Processing Pipelines
With 3,981,312 bits of embedded memory for line buffering and 277 I/O supporting parallel RGB/YCbCr interfaces, the 10CL120YF484I7G can implement deinterlacers, scalers, and color-space converters. The device's high multiplier count accelerates 2D filtering and motion compensation, while LVDS I/O standards enable direct connection to camera sensors and LCD panels. Designers targeting 1080p60 throughput benefit from the -7 speed grade timing margin.
Recomendado
Industrial IoT Gateway
The 10CL120YF484I7G integrates multiple communication interfaces (UART, SPI, I2C, Ethernet MAC) in a single FPGA, ideal for protocol-bridging IIoT gateways. Its 119K LEs implement custom protocol stacks, while embedded memory buffers bursty sensor traffic. The industrial temperature rating and long-term Intel product availability support 10+ year industrial deployments. Quartus Prime IP catalog accelerates integration of Modbus, EtherCAT, or PROFINET slave controllers.
Recomendado
LED Display Controllers
The 10CL120YF484I7G drives large LED video walls with high refresh rates through its 277 LVDS-capable I/O pins. The device's parallel processing architecture performs gamma correction, brightness calibration, and color mapping line by line without bottlenecks. Embedded M9K memory blocks hold line buffers, while 288 multipliers handle pixel-level blending. Designers building stadium-scale displays rely on the -7 speed grade for sub-millisecond frame processing.
Recomendado
Test and Measurement Equipment
The 10CL120YF484I7G's high I/O count and 119K logic elements support digital test pattern generation, protocol analyzers, and data acquisition front-ends. Its 4 PLLs provide flexible clocking for multiple sample rates, while embedded multipliers implement FFT cores and digital filters. The industrial temperature range ensures measurement accuracy in laboratory and field environments, and the F484 FBGA allows dense PCB integration with analog front-end ICs.
Recomendado
Automotive Infotainment & ADAS Pre-Processing
While the I7G industrial grade supports in-cabin applications, the 10CL120YF484I7G handles multi-camera sensor fusion pre-processing and surround-view rendering. The 3.98Mbit embedded memory stores frame buffers for image stitching, and the 288 18x18 multipliers accelerate perspective transform and lens distortion correction. For under-hood or strict AEC-Q100 requirements, designers should select the automotive-grade Cyclone 10 LP variant; the I7G suits cabin and body electronics.
Recomendado
5G Small Cell Baseband
The 10CL120YF484I7G implements PHY-layer baseband processing for small-cell 5G radio units, including channel coding, modulation, and FFT/iFFT operations. Its 288 DSP blocks accelerate the 1200-point FFT required by 5G NR numerologies, while 277 I/O pins connect to RF front-end ADCs/DACs over JESD204B. The device's low power envelope suits outdoor small-cell deployments where thermal dissipation is constrained.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL120YF484I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL120YF484C8G | 10CL080YF484I7G | 10CL055YF484I7G | 10CL040YF484I7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 119,088 | 119,088 | 80,720 | 55,440 | 40,470 |
| Embedded Memory (bits) | 3,981,312 | 3,981,312 | 1,738,240 | 2,340,000 | 1,134,000 |
| User I/O | 277 | 277 | 277 | 277 | 277 |
| Speed Grade | -7 | -8 | -7 | -7 | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Multipliers (18x18) | 288 | 288 | 192 | 156 | 108 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Approx. Unit Price (1k qty, USD) | 49.75 | 45.00 | 35.00 | 28.00 | 22.00 |
Principais diferenciais
- Largest density in the 484-ball Cyclone 10 LP family (vs 10CL080YF484I7G)
- Industrial temperature range for harsh environments (vs 10CL120YF484C8G)
- Higher multiplier density for DSP-intensive designs (vs 10CL080YF484I7G)
Notas de projeto
The Cyclone 10 LP 10CL120YF484I7G dissipates approximately 1.5-3 W typical depending on utilization and toggle rate. The 484-ball FBGA exposes a thermal pad that must be soldered to a thermally-conductive PCB land pattern with at least 4 thermal vias to internal ground planes. Reference Intel application note AN 711 for PowerPlay early power estimation; for designs exceeding 2 W, attach a small heatsink or use forced-air cooling. Industrial temperature designs must keep junction temperature below 100C by maintaining at least 50 C/W combined theta-JA from junction to ambient air.
The F484 FBGA uses 0.8 mm ball pitch on a 22x22 grid (484 balls). PCB design requires at least 6 layers with HDI microvia stackups for clean BGA breakout. Route differential pairs (LVDS, DDR) with 100 ohm differential impedance and maintain length matching within 150 mils for source-synchronous interfaces. Place decoupling capacitors (0.1 uF and 10 uF) within 100 mils of each VCCIO and VCCINT ball pair. Follow Intel's Cyclone 10 LP board design guidelines for via-in-pad and microvia recommendations to avoid signal integrity issues at 250+ MHz.
Common pitfalls when designing with the 10CL120YF484I7G include: (1) leaving unused I/O banks floating - tie unused I/O to defined logic levels through Quartus Prime pin planner; (2) failing to power-cycle CONFIG_DONE before reconfiguration - the nCONFIG pin must be pulsed low for at least 500 ns; (3) exceeding MSL3 floor life after PCB assembly - bake at 125C for 24 hours if exposure exceeds 168 hours; (4) mixing 1.5 V and 1.8 V LVCMOS standards in the same I/O bank without proper VCCIO selection; (5) overlooking JTAG chain integrity - install 10K pull-ups on TCK, TMS, TDI and 10K pull-down on TDO for reliable boundary-scan operation.
Place the 10CL120YF484I7G on the top side of the PCB near the board center for optimal thermal distribution and shortest trace lengths to high-speed interfaces. The JTAG header (TCK, TMS, TDI, TDO, GND, VCC) must be accessible for in-system programming and debugging. Route configuration flash (EPCS16 or compatible) within 2 inches of the FPGA to minimize AS mode signal integrity issues. Separate analog and digital ground planes and join them at a single point under the FPGA's GND balls to avoid ground loops in mixed-signal designs.
Informações de conformidade
RoHS compliant per Intel product page. Lead-free FBGA package. The I7G industrial temperature grade supports -40C to +100C operation. Not AEC-Q100 qualified - for automotive applications requiring AEC-Q100, consult Intel's automotive-grade Cyclone 10 LP variants.