10CL080YF484I7G - Cyclone 10 LP FPGA 80K LE 484-FBGA | Intel
MPN: 10CL080YF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $102.13 | $102.13 |
| 10 | $96.5 | $965.00 |
| 100 | $88.2 | $8,820.00 |
| 500 | $79.4 | $39,700.00 |
| 1,000 | $71.95 | $71,950.00 |
Drop-in alternatives for 10CL080YF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL080YF484C8G
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View Datasheet →10CL080YF484C6G
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View Datasheet →10CL080YF484I7G
✅ Drop-In✓ In Stock
$71.95 / Unit
View Datasheet →10CL055YF484I7G
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View Datasheet →10CL040YF484I7G
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View Datasheet →10CL016YF484I7G
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View Datasheet →10CL080YF484I7G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 81,264 |
| Embedded Memory (Bits) | 2,810,880 |
| Maximum User I/Os | 289 |
| Embedded 18x18 Multipliers | 244 |
| Package | 484-ball FBGA (F484) |
| Core Voltage | 1.0 V / 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| Operating Temperature | -40C to +100C (industrial, -I7 grade) |
| Speed Grade | -I7 (industrial, mid-tier) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, RSDS, HSTL, PCI |
| Memory Controller Hard IP | DDR3, DDR2, LPDDR2 |
| Mounting Type | Surface Mount (FBGA) |
| RoHS Status | Compliant |
10CL080YF484I7G 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10CL080YF484I7G (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL080YF484I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL080YF484I7G is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, ASIC Prototyping and Emulation, Factory Automation I/O Expansion, Portable Medical Instrument Signal Conditioning, LED Video Wall Scan and Refresh Logic.
Industrial Motor Control
The 10CL080YF484I7G is well suited for multi-axis industrial motor and motion control applications. Its 81,264 logic elements handle field-oriented control (FOC), space-vector PWM generation, and encoder interface logic simultaneously. The 244 embedded 18x18 multipliers execute the Park, Clarke, and inverse transforms plus PID loops in real time at sub-microsecond latency. The 2,810,880 bits of embedded memory buffer position trajectories and current-loop state without external SRAM. The 289 user I/Os in the F484 package route multi-axis quadrature encoder feedback, Hall sensors, and gate-driver PWM signals. Industrial -I7 grade operation (-40C to +100C junction) handles factory floor ambient conditions.
Recommended
Video Surveillance and Image Processing
The 10CL080YF484I7G implements video pipeline bridging, sensor aggregation, and on-the-fly image processing at HD and 4K resolutions. Its 244 18x18 multipliers run Sobel, Laplacian, and motion-detection kernels in real time on 1080p60 streams. The M9K memory blocks implement line buffers and frame FIFOs without external DDR. The hard DDR3 controller in the F484 package variant interfaces external SDRAM for larger frame stores. LVDS I/O support allows direct MIPI-CSI or LVDS camera deserialization. Low static power (~0.5 W typical at 81K LE) keeps fanless camera enclosures cool during 24/7 operation.
Recommended
ASIC Prototyping and Emulation
Engineers use the 10CL080YF484I7G as an ASIC prototyping target for mid-complexity SoC designs. Its 81,264 logic elements accommodate mid-sized CPU subsystems, custom peripherals, and memory-mapped bus fabrics. The 289 I/Os in the 484-ball BGA expose ample signal probing to logic analyzers during bring-up. Quartus Prime Standard integrates with industry RTL simulation flows (Synopsys VCS, Mentor Questa) for partition-based prototyping. Multiple 10CL080YF484I7G boards can be stacked via LVDS interconnect for designs larger than 81K LE. Industrial -I7 grade is suitable for in-vehicle and aerospace bench validation environments.
Recommended
Factory Automation I/O Expansion
The 10CL080YF484I7G serves as a flexible I/O aggregator and protocol bridge on the factory floor. Its 289 user I/Os convert between Ethernet/IP, PROFINET, EtherCAT, RS-485, and discrete 24V signals at deterministic latency. The hard DSP blocks implement industrial protocol stacks (EtherCAT distributed clocks, PROFINET IRT) at 100 Mbps line rate. The -I7 industrial temperature grade handles -40C to +100C junction operation in cabinets without forced cooling. The F484 BGA footprint fits standard industrial SOM form factors for modular PLC backplane integration.
Recommended
Portable Medical Instrument Signal Conditioning
The 10CL080YF484I7G conditions biosignal inputs (ECG, EMG, SpO2) in portable patient monitors and diagnostic instruments. Its 244 multipliers implement FIR/IIR filters, FFT spectral analysis, and adaptive noise cancellation on multi-channel arrays. Low static power (~0.5 W at 81K LE) extends battery runtime in ambulatory monitors. The 2.8 Mbit embedded memory buffers waveform captures before display transfer. Industrial -I7 grade accommodates clinical environment thermal conditions. The F484 BGA's small footprint supports compact handheld form factors required by wearable diagnostic devices.
Recommended
LED Video Wall Scan and Refresh Logic
The 10CL080YF484I7G drives scan-and-refresh logic for medium-resolution LED video walls and digital signage. Its 81K logic elements and 244 multipliers generate gamma correction, brightness calibration, and pixel remap tables at 60 Hz refresh rates. The 289 I/Os in the F484 BGA drive multi-port HUB75E chains across 1/16, 1/32, and 1/64 scan panels simultaneously. Embedded M9K memory buffers line data without external SDRAM. Low static power eliminates fan cooling in ceiling-mounted signage cabinets. Industrial -I7 grade handles 24/7 operational duty in unconditioned retail environments.
Recommended
Recommended Products Summary
Engineering reference data for 10CL080YF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL080YF484C8G | 10CL080YF484C6G | 10CL055YF484I7G | 10CL040YF484I7G | 10CL016YF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements (LE) | 81,264 | 81,264 | 81,264 | 55,856 | 39,600 | 15,408 |
| Embedded Memory (Bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,142,720 | 1,161,216 | 504,576 |
| Speed Grade | I7 (industrial -40C to +100C) | C8 (commercial 0C to +85C) | C6 (commercial 0C to +85C, faster) | I7 | I7 | I7 |
| Operating Temperature | -40C to +100C (junction) | 0C to +85C (junction) | 0C to +85C (junction) | -40C to +100C (junction) | -40C to +100C (junction) | -40C to +100C (junction) |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 156 | 81 | 56 |
| Approximate Unit Price (USD, qty 1, as of 2026-09-05) | $102.13 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade at standard F484 density (vs 10CL080YF484C8G)
- High logic density in 484-ball FBGA (vs 10CL040YF484I7G)
- Better timing margin than faster speed grade drop-ins (vs 10CL080YF484C6G)
Design Notes
The 484-ball FBGA package at 0.8 mm ball pitch requires a 6-layer PCB minimum with via-in-pad or microvia technology for fan-out. Use Intel's F484 land pattern with non-solder-mask-defined (NSMD) pads to ensure reliable BGA solder joint formation. Maintain 50-ohm controlled impedance for LVDS pairs, 100-ohm differential for LVDS, and matched trace lengths within 50 mils for DDR3 DQS groups. Reference Intel's Cyclone 10 LP handbook (PDF) pin connection guidelines for unused I/O bank power supply connections.
Estimated: at maximum toggle rate on 81K LE (~80% utilization) and 1.0 V core, total power dissipation is approximately 1.5 W (static 0.5 W + dynamic 1.0 W). With F484 theta_JA approximately 18 C/W (still-air, 4-layer JEDEC test board), junction temperature rise is ~27C above ambient, well within the +100C industrial limit. For sealed enclosures with no air flow, add thermal vias under the central BGA thermal balls and consider a heat spreader for continuous 100% utilization workloads.
Do not connect JTAG configuration pins (TCK, TMS, TDI, TDO) without Intel-recommended 10 kohm pull-ups on TDI and TMS; missing pull-ups can cause configuration failure. The Cyclone 10 LP configuration scheme supports AS (active serial), PS (passive serial), JTAG, and FPP (fast passive parallel). When using EPCQ flash for AS mode, ensure the MSEL pins are correctly set to the configuration scheme voltage. Verify CRC error checking is enabled in the Quartus device options to detect configuration bitstream corruption.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page; AEC-Q100 not applicable for general-purpose FPGAs (use Cyclone 10 GX automotive variants if required); halogen-free status not explicitly stated in verified data.
