10M08DCV81C7G - MAX 10 FPGA, 8K LE, 81-UFBGA | Altera / Intel
N.º da peça: 10M08DCV81C7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $23.5 | $23,50 |
| 10 | $21.18 | $211,80 |
| 100 | $18.83 | $1.883,00 |
| 500 | $17.5 | $8.750,00 |
| 1.000 | $16.2 | $16.200,00 |
10M08DCV81C7G Visão geral
A field-programmable gate array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as multipliers and block RAM that the user defines via a hardware description language (HDL). Within the broader taxonomy, the 10M08 belongs to Altera/Intel's MAX 10 family, which sits below Cyclone V/10 and above legacy MAX II/MAX V CPLDs; it is a non-volatile, flash-based FPGA targeting low-power, instant-on, and cost-sensitive applications that previously required CPLDs or small ASICs.
Key differentiating features of this part include 1.2 V core operation, integrated 12-bit SAR ADC support, on-chip dual-configuration flash allowing instant-on behavior, and the very small 81-ball WLCSP/UFBGA footprint. It is also lead-free and RoHS-compliant, suitable for industrial temperature operation, and provides hardened peripherals (PLL, I/O buffers, JTAG) without requiring external configuration memory.
Architecturally, MAX 10 devices combine a LUT-based logic fabric with 18x18 multipliers, M9K block RAM, a hardened ADC subsystem, and on-die flash for configuration. The 8K LE variant occupies the lower-density end of the family (2K, 4K, 8K, 16K, 25K, 40K, 50K), making it ideal for glue-logic, sensor aggregation, and low-cost I/O expansion.
Typical applications include industrial motor and process control, consumer display controllers, I/O expansion for microcontrollers, sensor hubs, and portable/handheld embedded systems. The combination of small package, integrated ADC, and instant-on flash makes it well-suited to compact, power-constrained designs.
When designing with this part, ensure the WLCSP/UFBGA land pattern is correctly fabricated because the 0.4 mm-or-finer ball pitch requires precise PCB stencil design and reflow profile. Verify Quartus Prime device support, JTAG chain, and dual-boot image configuration during board bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical design notes not aggregated on any single distributor product page.
Alternativas drop-in para 10M08DCV81C7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M08DCV81C7G (mesmo formato e footprint) — diferindo em Mounting Type, Configuration Memory, Operating Temperature, Package, Integrated ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M08DAV81C7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08DCV81C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08DCV81A7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08DCV81I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$26.85 / unidade
Ver ficha técnica →10M04DCV81C7G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M08DCV81C7G Classificações máximas e características elétricas
| Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Memory Bits | 387072 bits |
| Multipliers (18x18) | 56 |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Encapsulamento | 81-UFBGA, WLCSP |
| Package Code | V81 |
| On-chip Configuration Flash | Yes (dual-configuration) |
| Integrated ADC | Yes (12-bit SAR, hardened) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead Free | Yes |
Guia de Configuração de Pinos do 10M08DCV81C7G v81
Configuração de pinos para 10M08DCV81C7G (pacote v81). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10M08DCV81C7G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10M08DCV81C7G é adequado para 6 aplicaçãos: Industrial Process Control, I/O Expansion for Microcontrollers, Consumer Display Controllers, Sensor Hub Aggregation, Motor Control and Drive, Portable Embedded Systems.
Industrial Process Control
The 10M08DCV81C7G fits industrial process control by providing 8000 logic elements and 56 hardware 18x18 multipliers inside a compact 81-UFBGA package that mounts on small DIN-rail or PLC-format PCBs. Its integrated 12-bit SAR ADC (up to 1 MSPS) handles analog sensor inputs such as 4-20 mA loops and thermocouple amplifiers without external ADC ICs, while the on-chip dual-configuration flash supports instant-on boot for safety-critical loops. The MAX 10 family's non-volatile fabric eliminates external boot PROM, reducing BOM and improving long-term reliability in 24/7 industrial environments.
Recomendado
I/O Expansion for Microcontrollers
When pairing with low-pin-count microcontrollers, the 10M08DCV81C7G provides a flexible I/O expansion path via SPI or parallel interfaces. The 8000 logic elements handle protocol translation (UART, SPI, I2C, GPIO aggregation) and timing-sensitive glue logic, while the small 81-UFBGA package occupies less than 4x4 mm of board area. Its instant-on dual-configuration flash enables deterministic startup without boot delays, and the 12-bit SAR ADC can offload analog monitoring from the host MCU. Designers use MAX 10 I/O expansion when the host MCU runs out of pins but the system must remain low cost.
Recomendado
Consumer Display Controllers
The 10M08DCV81C7G serves well in consumer display controllers where 8000 logic elements are sufficient to drive TFT panels, RGB-to-MIPI bridges, or LVDS signal conditioning at moderate resolutions. Its 56 hardware multipliers can handle video scaling, color-space conversion, and basic image-processing filters in real time without taxing a host processor. The 1.2 V core with low-power modes makes it suitable for battery-powered portable displays, while the integrated ADC supports ambient-light sensing for backlight adjustment. The 81-UFBGA package keeps total BOM small enough for sub-$50 retail products.
Recomendado
Sensor Hub Aggregation
The 10M08DCV81C7G acts as a sensor hub aggregator, fusing inputs from multiple I2C/SPI sensors (IMU, pressure, temperature, humidity) into a single high-bandwidth output stream to the application processor. Its 387072 bits of M9K block RAM buffer sensor data bursts, while 8000 LEs handle digital filtering (Kalman, complementary) and protocol arbitration. The on-chip 12-bit ADC supplements digital sensors with analog channels like battery voltage or current sensing. The non-volatile MAX 10 architecture boots instantly from flash, ensuring the sensor hub is ready before the host processor powers up.
Recomendado
Motor Control and Drive
The 10M08DCV81C7G implements field-oriented control (FOC) for small BLDC and stepper motors in industrial or appliance applications. The 56 dedicated 18x18 multipliers execute the Park/Clarke transforms and PI controllers in real time at PWM switching frequencies up to 100 kHz. Its small 81-UFBGA footprint fits inside the motor housing, reducing EMI by shortening the analog feedback path. The integrated ADC samples phase currents and back-EMF directly, while the MAX 10's deterministic single-chip boot eliminates configuration delays at power-up.
Recomendado
Portable Embedded Systems
The 10M08DCV81C7G is well-suited to portable embedded designs (handheld instruments, field tools, wearables) thanks to its 1.2 V low-power core, instant-on flash boot, and minimal 81-UFBGA footprint under 4x4 mm. The 8000 LEs and 387 Kbit block RAM handle UI rendering, sensor fusion, and low-bandwidth DSP, while the 12-bit ADC monitors battery voltage and current without external components. Because MAX 10 does not require external boot memory, total BOM cost and PCB area drop significantly compared with SRAM-based FPGAs that need a separate configuration flash, extending battery life in portable products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M08DCV81C7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M08DAV81C7G | 10M08DCV81C8G | 10M08DCV81A7G | 10M08DCV81I7G | 10M04DCV81C7G |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 81-UFBGA (V81) | 81-UFBGA (V81) - same | 81-UFBGA (V81) - same | 81-UFBGA (V81) - same | 81-UFBGA (V81) - same | 81-UFBGA (V81) - same |
| Family | MAX 10 (DC compact) | MAX 10 (DA analog-rich) | MAX 10 (DC compact) | MAX 10 (DC compact) | MAX 10 (DC compact) | MAX 10 (DC compact) |
| Logic Elements | 8000 | 8000 | 8000 | 8000 | 8000 | 4000 |
| Speed Grade | C7 | C7 | C8 (faster) | A7 (slower) | C7 | C7 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Industrial | Commercial |
| Integrated ADC | Yes (12-bit SAR, dual config) | Yes (more channels) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Principais diferenciais
- Compact flash-based FPGA with integrated ADC in smallest 81-ball UFBGA (vs 10CX105YF672E6G (Cyclone 10 GX))
- Lower-density MAX 10 with smaller package footprint (vs 10M08DAF256C8G (256-ball BGA))
- Instant-on non-volatile boot from internal flash (vs 10CL025YE144I7G (Cyclone V E, SRAM-based))
Notas de projeto
The 81-UFBGA package uses a fine ball pitch (typically 0.4 mm-0.5 mm) and requires laser-cut or precision-etched PCB land patterns with non-solder-mask-defined (NSMD) pads. Use 0.1 mm-0.125 mm microvias in a dog-bone or via-in-pad topology to escape the BGA. Apply a Type 4 or Type 5 solder paste stencil with 80-100 micron apertures for reliable reflow without bridging. Reflow profile must follow JEDEC J-STD-020 MSL classification; moisture-sensitive handling per the MSL label on the reel is mandatory.
MAX 10 devices require a clean 1.2 V core supply capable of delivering up to several hundred milliamps during configuration. Use a low-dropout regulator (LDO) with sub-30 mV peak-to-peak ripple, or a buck converter with output ripple below 1% of VCCINT. Decouple every VCCINT and VCCEHT/GXB ball with a 0.1 uF ceramic capacitor placed within 2 mm of the ball, plus a bulk 10 uF-22 uF capacitor near the package. The on-chip ADC analog supply (VCCA) must be filtered separately from VCCINT to avoid digital switching noise coupling into ADC measurements.
Do not confuse the C7G / C8G / A7G speed-grade and temperature suffixes: C7G denotes commercial temperature (0C to +85C) with -7 speed grade, while I7G denotes industrial (-40C to +100C). Mixing commercial and industrial parts in a design causes PCN-related availability issues. Ensure JTAG chain includes all MAX 10 devices on the board with proper TMS/TCK pull-ups (10 kohm to VCCIO). Dual-configuration image switching (nCONFIG/nSTATUS) must follow Altera's documented timing or the device will fall back to default image.
Informações de conformidade
RoHS compliant per Arrow listing (Reel packaging noted). AEC-Q100 not applicable - this is a commercial/industrial FPGA. Halogen-free status not explicitly stated in verified data.
