10M08DFV81I7G - MAX 10 FPGA, 8K LE, 81-BGA | Intel
N.º da peça: 10M08DFV81I7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $37.52 | $37,52 |
| 10 | $33.77 | $337,70 |
| 100 | $30.02 | $3.002,00 |
| 500 | $26.27 | $13.135,00 |
| 1.000 | $22.51 | $22.510,00 |
10M08DFV81I7G Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program in the field after manufacturing. FPGAs sit alongside ASICs and microcontrollers in the programmable logic hierarchy, offering higher performance and parallelism than MCUs while costing less than full-custom ASICs at low volumes. The MAX 10 family specifically targets low-power, cost-sensitive, and instant-on designs by integrating dual-configuration flash, eliminating the need for an external boot PROM.
Key features of the 10M08DFV81I7G include its 8K logic element count, embedded 12-bit ADC up to 1 MSPS with up to 18 analog channels, on-chip flash with instant-on capability, dedicated DSP blocks for fixed- and floating-point arithmetic, and embedded PLLs for flexible clock synthesis. The integrated flash also enables user flash memory (UFM) for data logging and parameter storage. The 81-ball UFBGA package provides a compact footprint suitable for space-constrained PCB designs while supporting up to 56 user I/Os.
Architecturally, the MAX 10 family uses logic array blocks (LABs) built from adaptive logic modules (ALMs), each containing an 8-input fracturable look-up table, two dedicated adders, and four registers. This architecture, combined with hard DSP blocks and embedded memory, gives the 10M08DFV81I7G solid DSP performance and efficient memory utilization in a low-power envelope.
Typical applications for the 10M08DFV81I7G include industrial control and I/O expansion, motor control, portable instrumentation, video bridging, and low-volume ASIC prototyping. Its instant-on flash and integrated ADC make it particularly attractive for system management, sensor fusion, and bridging legacy interfaces in factory automation.
When designing with this FPGA, ensure the Quartus Prime toolchain supports the 10M08DFV81I7G device variant. Use Intel's MAX 10 development kits or partner boards for prototyping, and follow the package-specific PCB layout guidelines for UFBGA/WLCSP fanout and via-in-pad considerations to maintain signal integrity.
This page synthesizes distributor pricing, vertical-migration alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para 10M08DFV81I7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M08DFV81I7G (mesmo formato e footprint) — diferindo em Mounting Type, Configuration Memory, Operating Temperature, Package, Integrated ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M08DFV81C8G
✅ Drop-In✓ Em estoque
$7.4 / unidade
Ver ficha técnica →10M08DCV81I7G
✅ Drop-In✓ Em estoque
$26.85 / unidade
Ver ficha técnica →10M08DCV81C7G
✅ Drop-In✓ Em estoque
$16.2 / unidade
Ver ficha técnica →10M08DFV81I7G Classificações máximas e características elétricas
| Series | MAX 10 |
| Logic Elements | 8000 |
| Embedded Memory (Bits) | 387072 |
| User I/O Count | 56 |
| Encapsulamento | 81-UFBGA, WLCSP |
| Tipo de montagem | Surface Mount |
| Configuration Memory | Internal Flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 1 MSPS |
| Temperatura de operação | -40C to +100C (Industrial) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Toolchain | Intel Quartus Prime |
Guia de Configuração de Pinos do 10M08DFV81I7G 81-ufbga, wlcsp
Configuração de pinos para 10M08DFV81I7G (pacote 81-ufbga, wlcsp). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10M08DFV81I7G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10M08DFV81I7G é adequado para 6 aplicaçãos: Industrial Control and I/O Expansion, Motor Control (BLDC / Stepper / FOC), Portable Instrumentation and Data Logging, Video Bridging and Display Interfaces, Low-Volume ASIC Prototyping, Sensor Fusion and System Management.
Industrial Control and I/O Expansion
The 10M08DFV81I7G is well suited to industrial control systems and I/O expansion modules. Its 8,000 logic elements and 56 user I/Os can aggregate multiple legacy interfaces (SPI, I2C, UART, parallel) into a single industrial bus such as EtherCAT or PROFINET. The integrated 12-bit SAR ADC eliminates an external ADC for analog sensor inputs. The industrial temperature rating (-40C to +100C) and on-chip flash provide reliable operation in factory automation panels without external boot memory.
Recomendado
Motor Control (BLDC / Stepper / FOC)
For motor control, the 10M08DFV81I7G's DSP blocks deliver fixed- and floating-point arithmetic for field-oriented control (FOC) loops, while the integrated 12-bit ADC samples phase currents and back-EMF. The 8K logic elements easily accommodate space-vector PWM, commutation tables, and protection logic. The 81-ball UFBGA package keeps the design compact on small inverter PCBs, and the instant-on flash enables fast fault-recovery startup.
Recomendado
Portable Instrumentation and Data Logging
The 10M08DFV81I7G is ideal for portable test and measurement instruments. Its non-volatile flash enables instant data logging on power-up without boot delay, and user flash memory (UFM) stores calibration constants and configuration parameters. The integrated 12-bit ADC with up to 18 channels supports multi-sensor data acquisition, while 56 user I/Os interface LCDs, keypads, and serial ports. Low-power operation extends battery life in field-portable instruments.
Recomendado
Video Bridging and Display Interfaces
The 10M08DFV81I7G can bridge video formats between CMOS cameras, LCDs, and HDMI/DVI transmitters. The 8K logic elements implement timing controllers, color-space converters, and limited scaling, while 56 user I/Os accommodate parallel RGB or LVDS data buses. The integrated ADC and DSP blocks enable on-screen overlay and graphics processing, making this part suitable for industrial HMIs and digital signage controllers.
Recomendado
Low-Volume ASIC Prototyping
The 10M08DFV81I7G serves as an ASIC prototyping platform for designs that will later convert to structured ASIC or full-custom silicon. Its 8K logic elements, 387 Kbits of block RAM, and DSP blocks closely match mid-range ASIC gate counts. Quartus Prime supports rapid design iteration, and the integrated flash enables production-ready configuration memory. Engineers can validate firmware, timing, and I/O behavior before committing to NRE.
Recomendado
Sensor Fusion and System Management
The 10M08DFV81I7G's combination of logic elements, embedded SRAM, ADC, and user flash makes it ideal for sensor-fusion hubs that aggregate temperature, pressure, current, and voltage data into a single I2C/SPI/CAN interface. The on-chip flash stores calibration coefficients, and the instant-on capability ensures sensor readings begin immediately at power-up. The 81-ball UFBGA footprint supports compact PCB designs in space-constrained embedded systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M08DFV81I7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M08DFV81C8G | 10M08DCV81I7G | 10M08DCV81C7G |
|---|---|---|---|---|
| Package | 81-UFBGA, WLCSP | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 |
| Embedded Memory (Kbits) | 378 | 378 | 378 | 378 |
| User I/O | 56 | 56 | 56 | 56 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Flash Configuration | Single | Single | Dual | Dual |
| Lifecycle Status | Active | Active | Active | Active |
Principais diferenciais
- Same-package upgrade with dual-configuration flash (vs 10M08DCV81I7G)
- Industrial temperature grade (vs 10M08DFV81C8G)
- Instant-on non-volatile configuration (vs XC7A35T (Xilinx))
Notas de projeto
The 81-ball UFBGA (WLCSP) package has a 0.4 mm ball pitch and small 4 mm x 4 mm body, requiring via-in-pad PCB technology with filled and plated-over vias for reliable assembly. Use NSMD (non-solder-mask-defined) pads and follow Intel's MAX 10 package-specific layout guidelines for fanout escape routing. Decoupling capacitors should be placed as close as possible to each power pin.
Estimated: with the UFBGA package's small body size, thermal dissipation is limited. At typical 1.0V core voltage and 50% utilization, expect ~0.5-1W dissipation. Ensure the PCB has sufficient copper pour connected to the package thermal balls to dissipate heat. The industrial temperature rating supports ambient up to +100C with adequate thermal management.
Do not confuse the 10M08DFV81I7G (single-config flash, 81-UFBGA) with the 10M08DAU324I7G (dual-config flash, 324-UBGA). The packages are not pin-compatible. When migrating density within the MAX 10 family, verify both the package code and configuration mode (single vs dual) match. Use Intel's MAX 10 vertical migration table for guidance.
Informações de conformidade
RoHS compliant per distributor listings. Halogen-free status not stated in verified web data - defaulting to unknown. Industrial temp grade; not AEC-Q100 qualified.
