10M16DAU324C8G - MAX 10 FPGA 16K LE 246 I/O UBGA-324 | Intel / Altera
N.º da peça: 10M16DAU324C8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $47.91 | $47,91 |
| 10 | $44.8 | $448,00 |
| 100 | $41.2 | $4.120,00 |
| 500 | $38.5 | $19.250,00 |
| 1.000 | $35.4 | $35.400,00 |
10M16DAU324C8G Visão geral
A MAX 10 FPGA is a low-cost, non-volatile family of programmable logic devices that combine an FPGA fabric, embedded flash configuration memory, analog-to-digital converters (ADCs), and on-chip dual-configuration flash on a single die. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting between simple CPLDs and high-performance FPGAs. MAX 10 devices target glue-logic, bridge, motor control, and I/O expansion designs that benefit from instant-on behavior without an external boot flash.
Key features include 16,000 logic elements (LEs), 562,176 bits of user flash memory (UFM) and embedded SRAM, up to 246 user I/O pins, integrated 12-bit SAR ADCs, on-die temperature-sensing diode, and hardened DDR3 memory interface support. The device supports up to 1.6 Gbps LVDS performance per pair, dual-boot configuration from internal flash, and a hardened Nios II soft-processor-ready fabric.
The architecture combines a look-up-table (LUT)-based logic fabric with embedded M9K memory blocks, 18x18 multipliers, and a tightly integrated analog and power-management block. Dual-configuration flash allows field upgrades and fail-safe fallback, while the embedded ADC enables precision analog sampling without an external mixed-signal IC.
Typical applications include industrial motor control, sensor fusion pre-processing, video bridging, low-cost ASIC prototyping, USB Type-C interface expansion, and factory automation I/O concentrators. The integrated ADC is also widely used for thermal and current monitoring in white-goods and motor-drive systems.
When designing with this device, allocate adequate BGA breakout routing and thermal copper on the 324-UBGA footprint. Use the Quartus Prime design suite and verify pin assignments against the device-specific pin-out file before PCB fabrication, since UBGA ball mapping differs across MAX 10 density grades.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single reference for evaluating the 10M16DAU324C8G for new designs and re-sourcing.
Alternativas drop-in para 10M16DAU324C8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M16DAU324C8G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Configuration Memory, Operating Temperature, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M16DAU324I7G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M25DAU324C8G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M08DAU324C8G
✅ Drop-In✓ Em estoque
$11.4 / unidade
Ver ficha técnica →10M16DCU324I6G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M16SAU324I7G
✅ Drop-In✓ Em estoque
$32.4 / unidade
Ver ficha técnica →10M40DAU324C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M50DAU324C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M16DAU324C8G Classificações máximas e características elétricas
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 |
| Maximum User I/O | 246 |
| Encapsulamento | 324-UBGA (Ultra FineLine BGA) |
| Core Supply Voltage | 1.2 V (on-chip regulator) |
| Process Technology | TSMC 55 nm CMOS (non-volatile) |
| Configuration Memory | Internal flash, dual-boot capable |
| Embedded ADC | 12-bit SAR ADC |
| LVDS Performance | Up to 1.6 Gbps per pair |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) |
| Temperatura de operação | Commercial (0C to +85C) - speed grade 8 |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
Configuração de pinos do 10M16DAU324C8G
| Pino A1 | IO — General-purpose user I/O pin (bank 1A) |
| Pino A2 | VCCIO1A — I/O supply voltage for bank 1A |
| Pino B1 | IO — General-purpose user I/O pin (bank 1A) |
| Pino B2 | GND — Ground reference for bank 1A |
| Pino C1 | IO — General-purpose user I/O pin (bank 1B) |
| Pino C2 | VCCIO1B — I/O supply voltage for bank 1B |
| Pino D1 | IO — General-purpose user I/O pin (bank 2) |
| Pino D2 | GND — Ground reference for bank 2 |
| Pino E1 | IO — General-purpose user I/O pin (bank 2) |
| Pino E2 | VCCIO2 — I/O supply voltage for bank 2 |
| Pino F1 | IO — General-purpose user I/O pin (bank 3) |
| Pino F2 | GND — Ground reference for bank 3 |
| Pino G1 | IO — General-purpose user I/O pin (bank 3) |
| Pino G2 | VCCIO3 — I/O supply voltage for bank 3 |
| Pino H1 | IO — General-purpose user I/O pin (bank 4) |
| Pino H2 | GND — Ground reference for bank 4 |
| Pino J1 | IO — General-purpose user I/O pin (bank 4) |
| Pino J2 | VCCIO4 — I/O supply voltage for bank 4 |
| Pino K1 | IO — General-purpose user I/O pin (bank 5) |
| Pino K2 | GND — Ground reference for bank 5 |
| Pino L1 | IO — General-purpose user I/O pin (bank 5) |
| Pino L2 | VCCIO5 — I/O supply voltage for bank 5 |
| Pino M1 | IO — General-purpose user I/O pin (bank 6) |
| Pino M2 | GND — Ground reference for bank 6 |
| Pino N1 | IO — General-purpose user I/O pin (bank 6) |
| Pino N2 | VCCIO6 — I/O supply voltage for bank 6 |
| Pino P1 | IO — General-purpose user I/O pin (bank 7) |
| Pino P2 | GND — Ground reference for bank 7 |
| Pino R1 | IO — General-purpose user I/O pin (bank 7) |
| Pino R2 | VCCIO7 — I/O supply voltage for bank 7 |
| Pino T1 | IO — General-purpose user I/O pin (bank 8) |
| Pino T2 | GND — Ground reference for bank 8 |
| Pino U1 | VCCIO8 — I/O supply voltage for bank 8 |
| Pino U2 | VCC — Core 1.2 V supply (on-chip regulated) |
Aplicações típicas
10M16DAU324C8G é adequado para 7 aplicaçãos: Industrial Motor Control and BLDC Drive, Sensor Fusion and Industrial IoT Gateway, Video Interface Bridging and Display Aggregation, USB Type-C and High-Speed I/O Expansion, Low-Cost ASIC Prototyping and FPGA Mezzanine Card, Power Supply Sequencing and Digital Point-of-Load Control, Automotive Driver Assistance and HIL Test Equipment.
Industrial Motor Control and BLDC Drive
The 10M16DAU324C8G fits industrial motor control and BLDC / PMSM drive designs because its 16K logic elements, 18x18 multipliers, and integrated 12-bit SAR ADC handle trapezoidal and field-oriented control (FOC) algorithms in a single chip. Its on-die temperature-sensing diode enables drive-stage thermal monitoring, while the 1.2 V core with on-chip regulator simplifies 24V industrial bus designs. Used between the MCU and the IGBT/MOSFET gate driver, it generates the commutation PWM and processes back-EMF feedback from current-sense amplifiers in real time.
Recomendado
Sensor Fusion and Industrial IoT Gateway
The 10M16DAU324C8G serves as the programmable sensor-fusion front-end in Industrial IoT gateways, where 16K LEs are enough to implement multi-protocol bridging (RS-485, CAN, Modbus) and pre-processing for accelerometer, gyroscope, and pressure sensors. Its dual-boot internal flash supports secure field firmware updates, and the 246 user I/O enable direct connection to multiple sensor buses without external muxing. Placed between the sensor array and the host SoC, it reduces host CPU interrupt load while preserving raw data for edge analytics.
Recomendado
Video Interface Bridging and Display Aggregation
The 10M16DAU324C8G bridges legacy parallel RGB / LVDS display interfaces to modern MIPI-DSI or eDP panels in industrial HMIs and digital signage, using its hardened DDR3 memory controller for line-buffer frame storage and 1.6 Gbps LVDS performance for high-speed pixel links. The 562 Kb of embedded memory supports small frame buffering without external SDRAM, reducing BOM cost. Designers typically place it between the video source SoC and the panel, performing color-space conversion and timing regeneration in the fabric.
Recomendado
USB Type-C and High-Speed I/O Expansion
The 10M16DAU324C8G enables USB Type-C, USB 3.0, and high-speed I/O expansion in industrial PCs and embedded systems, where 16K LEs implement USB Type-C port controllers, PD negotiation logic, and downstream port multiplexing. The MAX 10 device's dual-boot flash supports in-field PD firmware updates to track the evolving USB-PD specification. Its 246 I/O provide ample pin budget for multi-port hubs without external mux ICs, reducing board area and BOM cost in industrial PC designs.
Recomendado
Low-Cost ASIC Prototyping and FPGA Mezzanine Card
The 10M16DAU324C8G is well-suited as a low-cost ASIC prototyping and FPGA mezzanine card (FMC) carrier for low-to-mid complexity ASIC verification, where 16K LEs emulate sub-modules before tape-out and the integrated ADC samples analog test points in real time. Its 324-UBGA footprint fits standard industrial SBC carrier boards, and the Quartus Prime toolchain supports incremental compile for fast iteration. Used in bring-up labs, it provides a low-NRE path to verify register-transfer-level (RTL) functionality before committing to mask costs.
Recomendado
Power Supply Sequencing and Digital Point-of-Load Control
The 10M16DAU324C8G implements digital point-of-load (PoL) control and multi-rail power supply sequencing for telecom, server, and industrial systems, using its 16K LEs to run PID compensation loops in the fabric and its hardened ADC to sample output voltage and current telemetry. Dual-boot flash stores multiple golden firmware images for safe field updates without bricking the power system. Placed between the analog controller and the supervisor, it adds telemetry, fault logging, and adaptive voltage scaling (AVS) interfaces without disturbing the analog control loop.
Recomendado
Automotive Driver Assistance and HIL Test Equipment
The 10M16DAU324C8G is used in hardware-in-the-loop (HIL) test equipment and industrial driver-assistance subsystems where 16K LEs emulate sensor interfaces (CAN, LIN, Ethernet) and run protocol decoders in parallel. The integrated SAR ADC samples analog sensor channels for fault injection in test rigs, while the dual-configuration flash enables safe remote firmware rollback. Designers integrate it into test fixtures that simulate automotive ECUs in development, providing deterministic, repeatable stimulus generation at a fraction of the cost of full automotive-qualified parts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M16DAU324C8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M16DAU324I7G | 10M25DAU324C8G | 10M08DAU324C8G | 10M16DCU324I6G | 10M16SAU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-UBGA (U324) | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same | 324-UBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 25,000 | 8,000 | 16,000 | 16,000 |
| Embedded Memory (bits) | 562,176 | 562,176 | 819,200 | 387,072 | 562,176 | 562,176 |
| Configuration Flash | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DA) | Dual (DC) | Single (SA) |
| Speed Grade | 8 | 7 | 8 | 8 | 6 | 7 |
| Temperature Grade | Commercial (0C to 85C) | Industrial (-40C to 100C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial (-40C to 100C) | Industrial (-40C to 100C) |
| Embedded ADC | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR | 12-bit SAR |
| Approx. Unit Price (USD, qty-1) | 47.91 | Higher (industrial temp) | Higher (25K LEs) | Lower (8K LEs) | Similar | Similar |
Principais diferenciais
- 16K LE mid-density option in the largest MAX 10 package (vs 10M08DAU324C8G (8K LE))
- Dual-configuration internal flash with field firmware rollback (vs 10M16SAU324I7G (single-config))
- Integrated 12-bit SAR ADC with on-die temperature sensor (vs 10CL055YU484C8G (Cyclone IV))
- Hardened DDR3 memory controller in the fabric (vs 10M40DAU324C8G (higher density but same package))
Notas de projeto
The 324-UBGA package has a 1.0 mm ball pitch requiring 0.5 mm via-pad antipads and microvia stack-up (laser-drilled, 0.1 mm capture pad). Route signals on outer layers with 0.1 mm trace and space; inner layers need via-in-pad plating for clean breakout. Use 8-layer stack-up with 2 dedicated ground planes adjacent to the BGA row for return-path integrity and to control impedance for DDR3 interfaces routed from the dedicated DQS pins.
The MAX 10 device uses an internal linear regulator to derive the 1.2 V core from a 2.5 V or 3.3 V VCCINT supply - connect VCCINT to a clean 2.5 V rail decoupled with at least 10 uF bulk and 100 nF high-frequency ceramic per supply pin. Each VCCIO bank requires its own 1.2/1.5/1.8/2.5/3.3 V rail matching the I/O standard; group banks with shared voltage to minimize LDO count. Keep the VCCA supply (analog PLL/ADC) quiet and isolated from noisy digital rails.
Estimated: at full fabric utilization (~85% LEs toggling at 100 MHz with all 246 I/O active), the 10M16DAU324C8G dissipates approximately 0.6-0.9 W - within the commercial-grade UBGA-324 thermal envelope without an external heatsink. For industrial environments above 70C ambient or with sustained high toggle rates, add a thermal copper land under the center BGA balls (per Quartus thermal guidelines) and 4 thermal vias to an internal ground plane to reduce theta_JA below 25 C/W.
Do not route the JTAG pins (TCK/TMS/TDO/TDI) near switching I/O or clock signals - noise on JTAG can cause configuration failures. Always pull TMS high through a 10 kohm resistor and TCK low through 10 kohm for proper Quartus programmer behavior. Verify CONFIG_MODE pin settings against the boot mode you intend (dual-boot vs single) before PCB fabrication, as these pins are sampled at power-up and cannot be changed without a hardware revision.
For LVDS operation up to 1.6 Gbps per pair, match trace lengths within 5 mils of differential pairs and keep 100 ohm differential impedance on the outer layers with continuous reference ground plane. The MAX 10 LVDS serializer/deserializer (SERDES) is implemented in the fabric using soft IP - allocate dedicated clock pins (CLK[0:3]) to drive the SERDES reference clock for best jitter performance. Use IBIS models from Intel to simulate channel loss before PCB sign-off.
Informações de conformidade
RoHS compliance per Intel / Altera MAX 10 product page. Commercial temperature grade (speed grade 8). AEC-Q100 not applicable for this commercial-grade variant - choose an automotive MAX 10 variant for vehicle applications. Lead-free per JEDEC J-STD-020 MSL-3 packaging.
