2TPSF270M9G - 270µF 2V 9mΩ POSCAP Polymer Tantalum | 1411
N.º da peça: 2TPSF270M9G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0.62 | $0,62 |
| 10 | $0.58 | $5,80 |
| 100 | $0.5 | $50,00 |
| 500 | $0.44 | $220,00 |
| 1.000 | $0.38 | $380,00 |
2TPSF270M9G Visão geral
A POSCAP (Polymer Tantalum Solid Capacitor) is a solid-state capacitor that uses a conductive polymer cathode instead of a wet or MnO2 electrolyte. POSCAP belongs to the polymer capacitor hierarchy: polymer capacitor → solid tantalum capacitor → tantalum capacitor → electrolytic-style capacitor family. Compared with MnO2 tantalum, POSCAP offers lower ESR, benign failure mode (no thermal runaway), and superior high-frequency impedance, at the cost of lower maximum voltage (typically ≤ 35 V). POSCAPs are widely used as output bulk capacitors on point-of-load (POL) converters and as decoupling capacitors near FPGAs, ASICs, and high-speed SerDes.
Key features include 270 µF nominal capacitance at 2 V rated voltage, 9 mΩ ESR at 100 kHz, ≤ 0.7 nH ESL, RoHS compliance, halogen-free construction, and a face-down terminal layout that minimizes the current loop between the capacitor and the IC. The B2S case footprint (3.5 × 2.8 × 1.9 mm) provides mechanical robustness while keeping the PCB area under 10 mm², and the tape-and-reel packaging supports high-speed SMT assembly.
The 2TPSF270M9G is engineered for low-impedance, high-transient-current applications where conventional MLCCs would require many parallel devices. The polymer cathode's very low ESR flattens the impedance curve at high frequencies, while the solid construction eliminates the dry-out and acoustic-noise issues of ceramic or electrolytic capacitors. With 9 mΩ ESR, ripple-current capability per derating is high for its case size, enabling reliable operation adjacent to multi-amp switching regulators.
Typical applications include CPU/GPU POL output filtering, FPGA/ASIC core-rail decoupling, server and DC-DC point-of-load bulk hold-up, USB-PD and quick-charge adapter output smoothing, and graphics-card memory-rail bypass. The 2 V rating aligns naturally with 1.0–1.8 V core rails produced by step-down converters with 3.3 V or 5 V inputs.
When designing with this part, derate the applied voltage to ≤ 70 % (≤ 1.4 V for a 2 V part) in low-impedance circuits to ensure long-term reliability. Use wide, short copper pours between the POSCAP pads and the load to minimize trace inductance, and pair with 0.1 µF / 1 µF MLCCs to cover the high-frequency notch above the POSCAP self-resonant frequency.
This page synthesizes distributor pricing, drop-in alternatives, and practical decoupling guidance not found in the manufacturer datasheet.
Alternativas drop-in para 2TPSF270M9G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
2TPSF270M6E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
6TPF270M9L
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
TPSF270M9R0V1E
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
2R5TPSF270M9G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EEEFP0J271AP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
2TPSF270M9G Classificações máximas e características elétricas
| Capacitance | 270 µF |
| Capacitance Tolerance | ±20 % |
| Rated Voltage | 2 V DC |
| ESR | 9 mΩ at 100 kHz |
| ESL | 0.7 nH max |
| Dissipation Factor (tan δ) | 1.5× initial limit |
| Maximum Operating Temperature | 105 °C |
| Encapsulamento / Caixa | 1411 (3528 metric), Case B2S, 3.5 × 2.8 × 1.9 mm |
| Tipo de montagem | Surface Mount (face-down terminal) |
| Dielectric / Cathode | Conductive polymer tantalum (POSCAP) |
| Capacitance Change After Endurance | Within initial value |
| Packaging | Tape & Reel (TR) |
| RoHS | Compliant |
| Livre de halogênio | Yes |
| Series | POSCAP TPSF |
Guia de Configuração de Pinos do 2TPSF270M9G 1411 (3528 metric), case b2s, 3.5 × 2.8 × 1.9 mm
Configuração de pinos para 2TPSF270M9G (pacote 1411 (3528 metric), case b2s, 3.5 × 2.8 × 1.9 mm). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para 2TPSF270M9G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
2TPSF270M9G é adequado para 6 aplicaçãos: Point-of-Load (POL) DC-DC Converter Output Filtering, FPGA / ASIC Core Rail Decoupling, Server / Storage DC-DC Bulk Hold-up, USB-PD / Quick-Charge Adapter Output Smoothing, Graphics Card Memory Rail Bypass, Battery-Powered Portable Device Decoupling.
Point-of-Load (POL) DC-DC Converter Output Filtering
The 2TPSF270M9G is a classic output bulk capacitor for step-down POL converters delivering 1.0–1.8 V core rails from a 3.3 V or 5 V input. Its 270 µF capacitance and 9 mΩ ESR at 100 kHz flatten the converter's output impedance above the regulator loop bandwidth, reducing peak-to-peak ripple by 30–50 % versus a single 22 µF X5R MLCC bank. The POSCAP's face-down B2S 1411 terminals minimize the current-loop area to the IC, lowering high-frequency ESL (≤ 0.7 nH). Compared to MnO2 tantalum, the polymer cathode avoids ignition failure under inrush. Place one 2TPSF270M9G adjacent to the POL output plus a 0.1 µF / 1 µF MLCC pair for the high-frequency notch.
Recomendado
FPGA / ASIC Core Rail Decoupling
The 2TPSF270M9G is well-suited to FPGA and ASIC core-rail decoupling at 0.85–1.8 V. A single 270 µF POSCAP delivers the bulk charge reservoir needed for large load transients (e.g. 10 A/µs steps on a high-utilization logic block), keeping supply droop within the FPGA's tolerance window. Its 9 mΩ ESR is far below that of 330 µF / 25 mΩ aluminum polymer alternatives, reducing IR-drop during transient peaks by ~40 %. Pairing the POSCAP with 0402/0201 MLCCs spreads the impedance spectrum: the POSCAP covers 100 kHz–1 MHz, MLCCs cover 1–100 MHz. The B2S 1411 footprint fits beneath or beside the BGA, freeing routing channels.
Recomendado
Server / Storage DC-DC Bulk Hold-up
In server and storage systems, the 2TPSF270M9G provides bulk hold-up capacitance on intermediate bus POL outputs. With 270 µF at 2 V and 9 mΩ ESR, it stores enough energy (E = ½CV² ≈ 0.54 mJ per part) to ride through brief input-voltage interruptions during hot-swap events. Face-down SMD terminals reduce thermal resistance, helping the part sustain continuous ripple current at 105 °C ambient in 1U server chassis. Stack two in parallel on the load side for 540 µF / 4.5 mΩ when higher hold-up is required, sharing thermal load across both B2S footprints. RoHS and halogen-free construction suit data-center environmental requirements.
Recomendado
USB-PD / Quick-Charge Adapter Output Smoothing
The 2TPSF270M9G is used on the output side of USB-Power-Delivery and quick-charge adapters to smooth the 5 V or 9 V VBUS rail. Its 270 µF capacitance and 9 mΩ ESR reduce VBUS ripple well below the USB-PD 100 mV peak-to-peak spec, even under fast load steps from devices entering high-power modes. The polymer cathode handles the inrush current at cable attach more benignly than MLCC banks, avoiding flex-cracking failures common with X5R 1210/1812 stacks. The B2S 1411 footprint places the bulk cap on the output side of the PD controller, sized for the 9 V / 12 V / 15 V / 20 V PDO transitions by stacking multiple units.
Recomendado
Graphics Card Memory Rail Bypass
On GDDR6/GDDR7 memory rails, the 2TPSF270M9G serves as a bulk bypass capacitor adjacent to each memory device, holding the rail steady during burst-write events. Its 9 mΩ ESR keeps voltage droop below the 30 mV memory tolerance, and the 0.7 nH ESL ensures stable behavior above the 100 MHz memory-clock fundamental. Stack two 2TPSF270M9G per memory channel for 540 µF / 4.5 mΩ bulk, and pair with 0201 / 0402 MLCCs for high-frequency bypass. The face-down terminal layout keeps the current loop tight to the memory device's power pins, critical at the multi-GHz data rates of modern GDDR.
Recomendado
Battery-Powered Portable Device Decoupling
In battery-powered portable devices, the 2TPSF270M9G provides bulk decoupling for sub-2 V rails such as 1.8 V I/O and 1.2 V core, accepting a single-cell Li-ion (3.0–4.2 V) or LiFePO4 (3.0–3.3 V) supply after the buck stage. Its 270 µF holds the rail flat during Wi-Fi/Bluetooth TX bursts that draw 500 mA peak in 100 µs pulses, while the 9 mΩ ESR minimizes I²R drop. Halogen-free and RoHS construction suits consumer-electronics environmental compliance. The B2S 1411 footprint is small enough to place adjacent to the SoC, and the polymer cathode is more shock-resistant than MnO2 tantalum for handheld products.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 2TPSF270M9G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 2TPSF270M6E | 6TPF270M9L | TPSF270M9R0V1E | 2R5TPSF270M9G | EEEFP0J271AP |
|---|---|---|---|---|---|---|
| Brand | Panasonic | Panasonic | Panasonic | Panasonic | Panasonic | Panasonic |
| Package | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm - same | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm - same | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm - same | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm - same | 1411 (3528 Metric), Case B2S, 3.5 x 2.8 x 1.9 mm - same |
| Capacitance | 270 µF | 270 µF | 270 µF | 270 µF | 270 µF | 270 µF |
| Rated Voltage | 2 V DC | 2 V DC | 6.3 V DC | 2 V DC | 2.5 V DC | 2.5 V DC |
| ESR at 100 kHz | 9 mΩ | 9 mΩ | 9 mΩ | 9 mΩ | 9 mΩ | 9 mΩ |
| Dielectric / Cathode | Polymer Tantalum (POSCAP) | Polymer Tantalum (POSCAP) | Polymer Tantalum (POSCAP) | Polymer Tantalum (POSCAP) | Polymer Tantalum (POSCAP) | Polymer Aluminum (SP-CAP) |
| Max Operating Temperature | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
Principais diferenciais
- Industry-standard 9 mΩ ESR with 105 °C rating in B2S 1411 footprint (vs 6TPF270M9L)
- Polymer-tantalum cathode vs polymer-aluminum alternative (vs EEEFP0J271AP)
- Compact face-down terminal SMD package (vs Larger D-case polymer-tantalum alternatives)
Notas de projeto
Voltage derating is critical for POSCAP long-term reliability. Apply ≤ 70 % of rated voltage (≤ 1.4 V on a 2 V part) in low-impedance circuits and ≤ 50 % in high-reliability applications. Exceeding the rated voltage — even transiently above 2 V — accelerates polymer cathode degradation and can cause permanent capacitance loss or ESR rise. Verify ripple peaks and load-transient overshoot stay below the derated ceiling with worst-case input voltage (e.g., 5 V → 1.8 V POL with overshoot to 2.1 V will damage the part).
Use wide, short copper pours between the B2S pads and the load IC, and place the POSCAP as close as physically possible to the IC power pins. The face-down terminal layout is designed to minimize current-loop inductance; long thin traces between the cap and IC defeat this benefit and add ESL. Pair with 0.1 µF / 1 µF X7R MLCCs adjacent to the IC (within 1 mm) to cover the high-frequency notch above the POSCAP self-resonant frequency (~3 MHz for 270 µF / 0.7 nH).
Observe polarity — the marked face of the B2S case denotes the positive (anode) terminal per IEC 60384-3. Reverse-polarity mounting will short-circuit the part during charging and may cause the polymer cathode to overheat. Use the IPC-7352 land pattern for B2S (3.5 × 2.8 mm) and follow the recommended reflow profile: preheat 150–200 °C for 60 s, peak ≤ 250 °C for ≤ 5 s. Exceeding peak temperature degrades the polymer cathode.
Informações de conformidade
RoHS compliant and halogen-free per Panasonic POSCAP datasheet. AEC-Q100 not applicable for tantalum polymer capacitors. REACH compliance inferred from Panasonic environmental policy.
