5CSXFC2C6U23A7N - Cyclone V SX SoC FPGA 25K LE | Altera | 672-UBGA
N.º da peça: 5CSXFC2C6U23A7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $43.83 | $43,83 |
| 10 | $41.5 | $415,00 |
| 100 | $38.9 | $3.890,00 |
| 500 | $35.2 | $17.600,00 |
| 1.000 | $31.75 | $31.750,00 |
5CSXFC2C6U23A7N Visão geral
A SoC FPGA is a class of programmable device that merges a general-purpose processor subsystem with an FPGA fabric on the same silicon. In the broader taxonomy, the 5CSXFC2C6U23A7N belongs to the SoC FPGA family, which sits between pure ASSPs (Application-Specific Standard Products) and traditional standalone FPGAs, offering a balance of software programmability, hardware parallelism, and per-unit cost efficiency. The HPS section includes peripherals such as EMAC, USB, NAND flash controller, DDR3 controller, and SPI/I2C, while the FPGA fabric implements user-defined glue logic, DSP pipelines, and high-speed I/O.
Key features include automotive temperature grade support, ARM Cortex-A9 dual-core CPU with NEON media engine, integrated peripheral controllers, 32-bit DDR3 memory controller in the HPS, FPGA-side LVDS I/O up to several hundred pins, and variable-precision DSP blocks supporting 18x18 and 27x27 multipliers. The SX variant pairs the HPS with a Cyclone V SX-class FPGA fabric, distinguishing it from the SE (SoC + enhanced logic) and ST (SoC + transceivers) siblings. The 1.1 V core operating voltage reduces dynamic power versus prior 40 nm Cyclone IV generations.
Architecturally, the device uses a low-power 28 nm process and supports Altera's Quartus Prime design suite. Designers implement FPGA logic in Verilog/VHDL, configure the HPS pin mux and clock tree, and bring up Linux (typically with the Angstrom or Yocto-based SoC EDS distribution) on the dual Cortex-A9 cores. The integrated CoreSight debug enables JTAG-based trace and cross-triggering between the HPS and FPGA domains.
Typical applications include industrial machine vision, factory automation controllers, automotive driver-assistance modules, motor control, and portable medical instrumentation. The single-chip SoC reduces BOM and PCB complexity versus a discrete host CPU plus FPGA design.
When designing with this part, ensure the PCB accommodates the 23x23 mm BGA with controlled-impedance routing for DDR3, and validate Quartus II/Quartus Prime timing closure across HPS-FPGA bridge interfaces before tape-out.
This page synthesizes distributor pricing, verified drop-in Cyclone V SX alternatives, and design notes not aggregated on the manufacturer product page, providing a single-source reference for procurement and FPGA bring-up teams.
Alternativas drop-in para 5CSXFC2C6U23A7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC2C6U23A7N (mesmo formato e footprint) — diferindo em Package, DSP Blocks, Operating Temperature, Process Technology, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC4C6U23A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$136.24 / unidade
Ver ficha técnica →5CSXFC2C7U23A7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5CSXFC2C6U23I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$285 / unidade
Ver ficha técnica →5CSEBA6U23A7N
✅ Drop-In✓ Em estoque
$225 / unidade
Ver ficha técnica →5CSEBA6U23I7N
✅ Drop-In✓ Em estoque
$51.8 / unidade
Ver ficha técnica →5CSXFC2C6U23A7N Classificações máximas e características elétricas
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 25,000 |
| Process Technology | 28 nm low-power |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| Encapsulamento | 672-UBGA (UFBGA) 23x23 mm |
| Pin/Ball Count | 672 |
| Terminal Form | Ball |
| Package Code | FBGA |
| Operating Temperature Grade | Automotive |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do 5CSXFC2C6U23A7N fbga
Configuração de pinos para 5CSXFC2C6U23A7N (pacote fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC2C6U23A7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC2C6U23A7N é adequado para 6 aplicaçãos: Industrial Machine Vision Systems, Automotive ADAS Front Camera Pre-Processor, Motor Control and Industrial Drives, Portable Medical Instrumentation, Industrial IoT Edge Gateways, Software-Defined Radio Baseband Pre-Processing.
Industrial Machine Vision Systems
The 5CSXFC2C6U23A7N fits industrial machine vision by combining a dual-core ARM Cortex-A9 HPS running Linux-based image classification with FPGA-fabric pre-processing pipelines for Bayer demosaic, lens distortion correction, and edge detection. Its 25K logic elements and variable-precision DSP blocks handle 1080p @ 60 fps pixel streams in real time while the HPS runs OpenCV on the Cortex-A9 cores. The 672-UBGA package exposes enough LVDS pairs for direct MIPI CSI-2 or LVDS image-sensor interfacing, eliminating an external bridge ASIC. Power stays within typical industrial budgets because the 28 nm low-power process minimizes dynamic dissipation versus prior 40 nm Cyclone generations, making it well suited for factory-floor vision modules where reliability and BOM consolidation matter.
Recomendado
Automotive ADAS Front Camera Pre-Processor
The 5CSXFC2C6U23A7N is rated for the automotive temperature grade and pairs a dual Cortex-A9 HPS with FPGA logic for sensor-fusion front-camera pre-processing in driver-assistance systems. FPGA hardware accelerates lane-mark detection, object bounding-box generation, and H.264 encoding, while the HPS runs RTOS or Linux stacks for sensor fusion. Automotive qualification and the wide HPS peripheral set (CAN, LIN, FlexRay via external PHY, DDR3) support integration into body-domain controllers. For ASIL-B or higher functional-safety targets, designers augment with external watchdog and lockstep SoC, but the 5CSXFC2C6U23A7N delivers the heterogeneous compute density needed for ADAS front-camera modules.
Recomendado
Motor Control and Industrial Drives
The 5CSXFC2C6U23A7N supports industrial motor drives by allocating FPGA hardware to field-oriented control (FOC) loops, PWM generation, encoder decoding, and current-sampling sequencing, while the dual Cortex-A9 HPS runs higher-level motion controllers and EtherCAT/CANopen stacks. The HPS-side DDR3 controller buffers trajectory data and the FPGA fabric executes sub-microsecond torque loops, deterministic timing that is hard to achieve on a CPU-only architecture. The 672-UBGA U23 package provides sufficient GPIO for multi-axis servo drives with three-phase IGBT gate drivers. Engineers choose the 5CSXFC2C6U23A7N when the design needs Linux networking on HPS plus tight FPGA-side control loops, reducing part count versus separate MCU + CPLD designs.
Recomendado
Portable Medical Instrumentation
The 5CSXFC2C6U23A7N fits portable medical instrumentation such as patient monitors, ultrasound front-ends, and handheld diagnostics because the 28 nm low-power process minimizes battery drain while the dual Cortex-A9 HPS runs the Qt/Linux application stack. FPGA fabric implements DSP filtering, decimation, and signal conditioning for ECG/EEG/SpO2 channels, offloading compute from the application processor and reducing end-to-end latency. The 672-UBGA U23 package supports LVDS ADC interfacing at hundreds of MSPS, and the integrated CoreSight debug accelerates IEC 62304-compliant software verification. Medical designs benefit from consolidating a discrete CPU + DSP + glue logic onto a single SoC FPGA, lowering BOM and easing FDA documentation through a single component datasheet.
Recomendado
Industrial IoT Edge Gateways
The 5CSXFC2C6U23A7N suits IIoT edge gateways that aggregate Modbus/TCP, EtherCAT, PROFINET, and legacy serial protocols into a single Linux-managed node. The dual Cortex-A9 HPS runs containerized edge-analytics workloads (Node-RED, MQTT brokers) while the FPGA fabric implements deterministic real-time Ethernet MACs and time-sensitive networking shims, all on the same die. The 672-UBGA U23 package provides enough LVDS and general-purpose I/O to break out multiple industrial bus PHYs without external FPGA bridges. Low static power from the 28 nm process keeps thermal envelopes inside fanless industrial enclosures, and the SoC integration eliminates the latency of CPU-FPGA PCIe handshakes seen in two-chip designs.
Recomendado
Software-Defined Radio Baseband Pre-Processing
The 5CSXFC2C6U23A7N supports software-defined radio baseband pre-processing where the FPGA fabric runs FIR filtering, FFT pipelines, and digital down-conversion, while the HPS executes higher-layer demodulation and MAC protocols under Linux. Variable-precision DSP blocks deliver efficient 18x18 and 27x27 multiplications needed for complex-baseband arithmetic, and the 672-UBGA U23 package exposes LVDS pairs to AD9361-class RFICs. For prototype SDR modules targeting sub-6 GHz bands, this Cyclone V SX SoC reduces board area and BOM compared with separate FPGA + ARM module designs, while remaining reprogrammable for protocol updates via over-the-air firmware flows.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC2C6U23A7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC4C6U23A7N | 5CSXFC2C7U23A7N | 5CSXFC2C6U23I7N | 5CSEBA6U23A7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 | ~40,000 | 25,000 | 25,000 | ~110,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Temperature Grade | Automotive | Automotive | Automotive | Industrial | Automotive |
| Speed Grade | -7 | -7 | -7 | -7 | -7 |
| Process Node | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Principais diferenciais
- Lower static power versus Cyclone IV SoC predecessors (vs 5CSEBA6U23A7N)
- Automotive temperature grade as standard (vs 5CSXFC2C6U23I7N)
- Faster -7 speed grade at same price band (vs 5CSXFC2C8U23A7N)
Notas de projeto
The 672-UBGA U23 package has a 23x23 mm body with 0.8 mm ball pitch typical of the Cyclone V U-package family. PCB layout must use laser-drilled microvias and 4-6 layer stack-up to escape the inner balls; allocate at least 1 oz copper for power planes to support the HPS + FPGA core currents. Reference Altera's Cyclone V Device Family Pin Connection Guidelines for VCCIO/VCCPD/VCCR subject to per-bank voltage grouping.
Estimated: at full HPS plus FPGA utilization, the 5CSXFC2C6U23A7N dissipates up to 5-8 W depending on toggle rate and transceiver use. With theta_JA around 15-20 C/W for a U23 BGA on a JEDEC 4-layer test board, expect junction temperature rise of 75-160 C above ambient. Derate by enabling Cyclone V power management features (clock gating, voltage scaling) and consider a thermal via array under the exposed die pad for production boards.
Do not assume the SX and SE SoC sub-families are interchangeable. The SX variant targets lower static power and reduced peripheral set, while SE adds enhanced logic and additional HPS peripherals. Pin maps on the U23 672-BGA may overlap for common HPS signals but differ for transceiver I/O, so revalidate Quartus Prime pin assignments before PCB respin. Also confirm DDR3 trace lengths match the HPS controller's fly-by topology requirements, especially when migrating from Cyclone IV designs.
Informações de conformidade
RoHS compliant per Altera/Intel product page. The part is rated for automotive temperature grade but is not formally AEC-Q100 qualified as a single component - consult Altera functional safety data package for ADAS safety claims.
