5CSXFC2C6U23A7N - Cyclone V SX SoC FPGA 25K LE | Altera | 672-UBGA
MPN: 5CSXFC2C6U23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $43.83 | $43.83 |
| 10 | $41.5 | $415.00 |
| 100 | $38.9 | $3,890.00 |
| 500 | $35.2 | $17,600.00 |
| 1,000 | $31.75 | $31,750.00 |
Drop-in alternatives for 5CSXFC2C6U23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC4C6U23A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$136.24 / Unit
View Datasheet →5CSXFC2C7U23A7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5CSXFC2C6U23I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$285 / Unit
View Datasheet →5CSEBA6U23A7N
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →5CSEBA6U23I7N
✅ Drop-In✓ In Stock
$51.8 / Unit
View Datasheet →5CSXFC2C6U23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 25,000 |
| Process Technology | 28 nm low-power |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| Package | 672-UBGA (UFBGA) 23x23 mm |
| Pin/Ball Count | 672 |
| Terminal Form | Ball |
| Package Code | FBGA |
| Operating Temperature Grade | Automotive |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSXFC2C6U23A7N fbga Pin Configuration Guide
Complete pinout information for 5CSXFC2C6U23A7N (fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC2C6U23A7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC2C6U23A7N is suitable for 6 applications: Industrial Machine Vision Systems, Automotive ADAS Front Camera Pre-Processor, Motor Control and Industrial Drives, Portable Medical Instrumentation, Industrial IoT Edge Gateways, Software-Defined Radio Baseband Pre-Processing.
Industrial Machine Vision Systems
The 5CSXFC2C6U23A7N fits industrial machine vision by combining a dual-core ARM Cortex-A9 HPS running Linux-based image classification with FPGA-fabric pre-processing pipelines for Bayer demosaic, lens distortion correction, and edge detection. Its 25K logic elements and variable-precision DSP blocks handle 1080p @ 60 fps pixel streams in real time while the HPS runs OpenCV on the Cortex-A9 cores. The 672-UBGA package exposes enough LVDS pairs for direct MIPI CSI-2 or LVDS image-sensor interfacing, eliminating an external bridge ASIC. Power stays within typical industrial budgets because the 28 nm low-power process minimizes dynamic dissipation versus prior 40 nm Cyclone generations, making it well suited for factory-floor vision modules where reliability and BOM consolidation matter.
Recommended
Automotive ADAS Front Camera Pre-Processor
The 5CSXFC2C6U23A7N is rated for the automotive temperature grade and pairs a dual Cortex-A9 HPS with FPGA logic for sensor-fusion front-camera pre-processing in driver-assistance systems. FPGA hardware accelerates lane-mark detection, object bounding-box generation, and H.264 encoding, while the HPS runs RTOS or Linux stacks for sensor fusion. Automotive qualification and the wide HPS peripheral set (CAN, LIN, FlexRay via external PHY, DDR3) support integration into body-domain controllers. For ASIL-B or higher functional-safety targets, designers augment with external watchdog and lockstep SoC, but the 5CSXFC2C6U23A7N delivers the heterogeneous compute density needed for ADAS front-camera modules.
Recommended
Motor Control and Industrial Drives
The 5CSXFC2C6U23A7N supports industrial motor drives by allocating FPGA hardware to field-oriented control (FOC) loops, PWM generation, encoder decoding, and current-sampling sequencing, while the dual Cortex-A9 HPS runs higher-level motion controllers and EtherCAT/CANopen stacks. The HPS-side DDR3 controller buffers trajectory data and the FPGA fabric executes sub-microsecond torque loops, deterministic timing that is hard to achieve on a CPU-only architecture. The 672-UBGA U23 package provides sufficient GPIO for multi-axis servo drives with three-phase IGBT gate drivers. Engineers choose the 5CSXFC2C6U23A7N when the design needs Linux networking on HPS plus tight FPGA-side control loops, reducing part count versus separate MCU + CPLD designs.
Recommended
Portable Medical Instrumentation
The 5CSXFC2C6U23A7N fits portable medical instrumentation such as patient monitors, ultrasound front-ends, and handheld diagnostics because the 28 nm low-power process minimizes battery drain while the dual Cortex-A9 HPS runs the Qt/Linux application stack. FPGA fabric implements DSP filtering, decimation, and signal conditioning for ECG/EEG/SpO2 channels, offloading compute from the application processor and reducing end-to-end latency. The 672-UBGA U23 package supports LVDS ADC interfacing at hundreds of MSPS, and the integrated CoreSight debug accelerates IEC 62304-compliant software verification. Medical designs benefit from consolidating a discrete CPU + DSP + glue logic onto a single SoC FPGA, lowering BOM and easing FDA documentation through a single component datasheet.
Recommended
Industrial IoT Edge Gateways
The 5CSXFC2C6U23A7N suits IIoT edge gateways that aggregate Modbus/TCP, EtherCAT, PROFINET, and legacy serial protocols into a single Linux-managed node. The dual Cortex-A9 HPS runs containerized edge-analytics workloads (Node-RED, MQTT brokers) while the FPGA fabric implements deterministic real-time Ethernet MACs and time-sensitive networking shims, all on the same die. The 672-UBGA U23 package provides enough LVDS and general-purpose I/O to break out multiple industrial bus PHYs without external FPGA bridges. Low static power from the 28 nm process keeps thermal envelopes inside fanless industrial enclosures, and the SoC integration eliminates the latency of CPU-FPGA PCIe handshakes seen in two-chip designs.
Recommended
Software-Defined Radio Baseband Pre-Processing
The 5CSXFC2C6U23A7N supports software-defined radio baseband pre-processing where the FPGA fabric runs FIR filtering, FFT pipelines, and digital down-conversion, while the HPS executes higher-layer demodulation and MAC protocols under Linux. Variable-precision DSP blocks deliver efficient 18x18 and 27x27 multiplications needed for complex-baseband arithmetic, and the 672-UBGA U23 package exposes LVDS pairs to AD9361-class RFICs. For prototype SDR modules targeting sub-6 GHz bands, this Cyclone V SX SoC reduces board area and BOM compared with separate FPGA + ARM module designs, while remaining reprogrammable for protocol updates via over-the-air firmware flows.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC2C6U23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC4C6U23A7N | 5CSXFC2C7U23A7N | 5CSXFC2C6U23I7N | 5CSEBA6U23A7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 | ~40,000 | 25,000 | 25,000 | ~110,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Temperature Grade | Automotive | Automotive | Automotive | Industrial | Automotive |
| Speed Grade | -7 | -7 | -7 | -7 | -7 |
| Process Node | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Key Differentiators
- Lower static power versus Cyclone IV SoC predecessors (vs 5CSEBA6U23A7N)
- Automotive temperature grade as standard (vs 5CSXFC2C6U23I7N)
- Faster -7 speed grade at same price band (vs 5CSXFC2C8U23A7N)
Design Notes
The 672-UBGA U23 package has a 23x23 mm body with 0.8 mm ball pitch typical of the Cyclone V U-package family. PCB layout must use laser-drilled microvias and 4-6 layer stack-up to escape the inner balls; allocate at least 1 oz copper for power planes to support the HPS + FPGA core currents. Reference Altera's Cyclone V Device Family Pin Connection Guidelines for VCCIO/VCCPD/VCCR subject to per-bank voltage grouping.
Estimated: at full HPS plus FPGA utilization, the 5CSXFC2C6U23A7N dissipates up to 5-8 W depending on toggle rate and transceiver use. With theta_JA around 15-20 C/W for a U23 BGA on a JEDEC 4-layer test board, expect junction temperature rise of 75-160 C above ambient. Derate by enabling Cyclone V power management features (clock gating, voltage scaling) and consider a thermal via array under the exposed die pad for production boards.
Do not assume the SX and SE SoC sub-families are interchangeable. The SX variant targets lower static power and reduced peripheral set, while SE adds enhanced logic and additional HPS peripherals. Pin maps on the U23 672-BGA may overlap for common HPS signals but differ for transceiver I/O, so revalidate Quartus Prime pin assignments before PCB respin. Also confirm DDR3 trace lengths match the HPS controller's fly-by topology requirements, especially when migrating from Cyclone IV designs.
Compliance Information
RoHS compliant per Altera/Intel product page. The part is rated for automotive temperature grade but is not formally AEC-Q100 qualified as a single component - consult Altera functional safety data package for ADAS safety claims.
