5M1270ZF256C4N - 980 Macrocell MAX V CPLD, 256-FBGA | Intel
N.º da peça: 5M1270ZF256C4N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $23.62 | $23,62 |
| 10 | $21.2 | $212,00 |
| 100 | $18.85 | $1.885,00 |
| 500 | $16.5 | $8.250,00 |
| 1.000 | $14.95 | $14.950,00 |
5M1270ZF256C4N Visão geral
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays on a single chip, providing instant-on, deterministic, single-cycle logic with predictable timing. CPLDs occupy the hierarchy between discrete logic gates (smallest), SPLDs (Simple PLDs), FPGAs (largest, most flexible, but volatile and configuration-dependent), and ASICs (highest density, NRE cost). MAX V CPLDs use a low-power, flash-based process that retains configuration without external boot memory.
Key features include in-system programmability via JTAG, an internal voltage regulator requiring only a 1.8 V supply, 6.2 ns tPD enabling 304 MHz operation, and a commercial operating range of 0C to +70C (junction). The device integrates 980 macrocells across 127 LABs and exposes 211 general-purpose I/O pins, providing substantial logic capacity for I/O expansion, state-machine control, and parallel bus interfacing.
The architecture is built on a non-volatile flash process with an internal 1.8 V regulator, eliminating the need for an external core-voltage rail. MultiVolt I/O banks support interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVTTL/LVCMOS peripherals, while built-in JTAG (IEEE 1149.1) and ISP simplify board-level bring-up and field updates.
Typical applications include I/O expansion and voltage-level translation between ASICs/SoCs and peripherals, power-sequence and reset-distribution controllers, bus-interface bridges (e.g., parallel-to-parallel width conversion), industrial control and factory-automation glue logic, and LED-display scan and refresh drivers.
When designing with the 5M1270ZF256C4N, provide a clean 1.8 V rail with at least 10 uF of bulk decoupling near the supply balls and 0.1 uF ceramic caps adjacent to each VCC/VCCIO pin group. The FBGA-256 land pattern requires precise PCB fabrication (laser-drilled microvias recommended) and the exposed-pad balls must be soldered to a continuous ground plane for thermal and electrical performance.
This page synthesizes distributor pricing, drop-in MAX V family alternatives, and practical design notes that complement the manufacturer datasheet for engineers evaluating the 5M1270ZF256C4N.
Alternativas drop-in para 5M1270ZF256C4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5M1270ZF256C4N (mesmo formato e footprint) — diferindo em Operating Temperature, Configuration Memory, Package, Programming Interface, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5M1270ZF256A5N
✅ Drop-In✓ Em estoque
$24.1 / unidade
Ver ficha técnica →5M1270ZF324C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.5 / unidade
Ver ficha técnica →5M1270ZF256I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5M570ZF256C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.2 / unidade
Ver ficha técnica →5M1270ZF256C4N Classificações máximas e características elétricas
| Family | MAX V |
| Series | 5M1270Z |
| Device Type | CPLD - Complex Programmable Logic Device |
| Number of Macrocells | 980 |
| Number of Logic Array Blocks (LABs) | 127 |
| Number of User I/Os | 211 |
| Maximum Operating Frequency | 304 MHz |
| Propagation Delay (tPD) | 6.2 ns (max) |
| Supply Voltage - Internal | 1.71 V to 1.89 V (nominal 1.8 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Temperatura de operação | 0C to +70C (commercial, TJ) |
| Encapsulamento | 256-FBGA (17 x 17 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5M1270ZF256C4N 256-fbga (17 x 17 mm, 1.0 mm pitch)
Configuração de pinos para 5M1270ZF256C4N (pacote 256-fbga (17 x 17 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5M1270ZF256C4N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5M1270ZF256C4N é adequado para 6 aplicaçãos: I/O Expansion and Voltage-Level Translation, Power-Sequencing and Reset Distribution Controller, Bus-Interface Bridge (Width and Protocol Conversion), Industrial Control and Factory-Automation Glue Logic, LED Display Scan and Refresh Driver, Legacy Peripheral Replacement and Custom I/O Decoding.
I/O Expansion and Voltage-Level Translation
The 5M1270ZF256C4N is widely used to expand the limited I/O count of an ASIC, SoC, or microcontroller and to translate between mismatched voltage domains (1.5/1.8/2.5/3.3 V). Its 211 user I/Os and MultiVolt I/O bank architecture allow direct interfacing to LVCMOS and LVTTL peripherals without external level shifters. With 6.2 ns tPD and 980 macrocells, the part can implement multiple bidirectional bus bridges in a single device, reducing board area and BOM cost versus discrete logic.
Recomendado
Power-Sequencing and Reset Distribution Controller
The 5M1270ZF256C4N's instant-on, non-volatile flash-based configuration makes it ideal for power-sequencing and reset-distribution roles in multi-rail systems. The device can monitor PG (power-good) inputs from multiple DC-DC converters and generate sequenced enable signals to downstream loads, satisfying strict processor power-up requirements. With 211 I/Os the CPLD can service many rails simultaneously, and the 6.2 ns deterministic delay ensures sub-microsecond sequencing accuracy.
Recomendado
Bus-Interface Bridge (Width and Protocol Conversion)
The 5M1270ZF256C4N can bridge between asynchronous parallel buses of differing widths - for example converting a 32-bit local bus to a 16-bit peripheral interface - with deterministic single-cycle latency. The 980 macrocells comfortably absorb wide state machines, FIFOs, and address-decode logic, while 211 I/Os expose enough pins for both bus sides plus status LEDs. MultiVolt I/O banks permit direct connection to legacy 5 V-tolerant buses when configured appropriately.
Recomendado
Industrial Control and Factory-Automation Glue Logic
The 5M1270ZF256C4N provides deterministic glue logic for PLCs, motor controllers, and sensor aggregation nodes in factory-automation systems. Its 211 user I/Os can directly drive opto-isolated inputs and outputs, encoder interfaces, and PWM-control lines. The 304 MHz internal performance and 6.2 ns tPD support high-speed encoder decoding and protocol conversion (e.g., incremental-quadrature to BiSS). For harsher -40C to +100C environments, the I7N industrial variant is recommended instead.
Recomendado
LED Display Scan and Refresh Driver
The 5M1270ZF256C4N's deterministic timing and high I/O count make it an effective scan-driver for multi-row, multi-column LED video walls and dot-matrix displays. With 211 outputs it can refresh dozens of rows in parallel, while the flash-based instant-on configuration eliminates the boot-up blanking interval of SRAM-based FPGAs. The 6.2 ns tPD supports high PWM bit-depths without visible flicker, and JTAG-based ISP allows in-field refresh-rate or scan-pattern updates without removing the board.
Recomendado
Legacy Peripheral Replacement and Custom I/O Decoding
The 5M1270ZF256C4N can replace aging PAL/GAL devices and discrete 74-series decode logic on legacy boards, consolidating dozens of packages into one BGA. Its 980 macrocells support wide address decoders, chip-select generators, and interrupt controllers for retro-computing, industrial-control, and aerospace retrofit applications. In-system programmability enables rapid re-spin of decode tables during qualification, and 211 I/Os cover most legacy backplanes without multiplexing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5M1270ZF256C4N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5M1270ZF256A5N | 5M1270ZF324C5N | 5M1270ZF256I7N | 5M570ZF256C5N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 324-FBGA (19x19 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) |
| Macrocells | 980 | 980 | 980 | 980 | 570 (-42%) |
| Operating Temperature | 0C to +70C (commercial) | Extended/automotive grade | 0C to +70C (commercial) | -40C to +100C (industrial) | 0C to +70C (commercial) |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Programmability | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) |
Principais diferenciais
- Highest-density MAX V CPLD in 256-FBGA package (vs 5M570ZF256C5N)
- Industrial temperature variant available in the same footprint (vs 5M1270ZF256I7N)
- Instant-on, non-volatile flash configuration (vs SRAM-based FPGAs (e.g., Cyclone IV))
Notas de projeto
Provide a clean 1.8 V core rail with at least 10 uF of bulk ceramic decoupling placed within 25 mm of the FBGA supply balls. Each VCC and VCCIO pin group should be bypassed with a 0.1 uF X7R capacitor located adjacent to the package. According to the manufacturer datasheet, the internal LDO requires the input 1.8 V to be monotonic at power-up; a soft-start ramp slower than 1 ms may cause configuration errors. MultiVolt I/O banks require their own VCCIO rail (1.5/1.8/2.5/3.3 V) - tie unused I/O banks to VCCIO = 1.8 V to minimize leakage.
The 256-FBGA at 1.0 mm pitch demands precise PCB fabrication: use laser-drilled microvias, ENIG or OSP surface finish, and a 0.4 mm solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pad with via-in-pad. Per the manufacturer datasheet, all balls must be soldered - including the inner power/ground balls - to a continuous ground plane for thermal dissipation. A 4-layer stack-up with 1 oz copper and a dedicated ground plane beneath the BGA is recommended. Allow at least 6 mm of keep-out around the BGA for rework and X-ray inspection.
Do not assume JTAG pins (TCK, TMS, TDI, TDO) are 5 V-tolerant - they are 1.8/2.5/3.3 V LVCMOS only; connecting a 5 V JTAG programmer will damage the device. The nSTATUS, nCONFIG, and CONF_DONE pins used during parallel programming must not be pulled high during JTAG ISP. According to the manufacturer datasheet, leaving the JTAG chain unterminated by omitting the 10 kohm TCK pull-down may cause false clocking; always include the recommended pull-down on TCK and pull-up on TDI/TMS.
Informações de conformidade
RoHS compliant per manufacturer product listing. Standard commercial part - AEC-Q100 qualification applies to the -A automotive suffix variant, not the C4N commercial part.
